Abstract: Activated gaseous species generated adjacent a carbon contaminated surface affords in-situ cleaning. A device for removing carbon contamination from a surface of the substrate includes (a) a housing defining a vacuum chamber in which the substrate is located; (b) a source of gaseous species; and (c) a source of electrons that are emitted to activate the gaseous species into activated gaseous species. The source of electrons preferably includes (i) a filament made of a material that generates thermionic electron emissions; (ii) a source of energy that is connected to the filament; and (iii) an electrode to which the emitted electrons are attracted. The device is particularly suited for photolithography systems with optic surfaces, e.g., mirrors, that are otherwise inaccessible unless the system is dismantled.

Abstract: A heated wheel/tire cleaner applicator system is used in car washes to clean wheels and tires on vehicles. The system is comprised of a cleaning solution supply system and circulating hot water system. The cleaning solution supply system pumps cleaning solution from a tank, through a pipe having an inline, flow-regulating valve, to spray nozzles on the distal flow end of the pipe. An applicator box houses the distal flow end of the pipe and a small hot water tank. The circulating hot water system maintains a constant heated water temperature in the tank. The hot water in the tank heats cleaning solution flowing in the distal flow end of the pipe by convection. A trigger device in the car wash opens and closes the valve to regulate the flow of cleaning solution through the distal flow end of the pipe and spray nozzles.

Abstract: A method and apparatus for cleaning the EGR system of a vehicle is disclosed. The apparatus includes an induction device that is removably attachable to the manifold of an engine in the location of the EGR valve. The induction device includes an adapter plate and a nozzle assembly. The apparatus further includes a solvent administrator removably attachable to the induction device for providing a quantity of solvent to the EGR system.

Abstract: A method for cleaning an apparatus using a clean-in-place system is disclosed. The clean-in-place system is in fluid communication with an inlet and an outlet of the apparatus. In the method, a cleaning composition having a measurable physical property (e.g., pH) is supplied from a cleaner tank into the inlet of the apparatus for a first period of time. A rinsing composition having the measurable physical property at a second measured value is then supplied from a rinse tank into the inlet of the apparatus for a second period of time. The measurable physical property is sensed versus time for fluids exiting the outlet of the apparatus, and a circulation time of the cleaning composition is determined. A closing time for a return valve of the cleaner tank is then determined for subsequent cleaning cycles such that minimal rinsing composition enters the cleaner tank during the subsequent cleaning cycle.

Abstract: A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . , which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.

Abstract: The embodiment of this invention is an apparatus that provides for a cassette-to-cassette batch demounting process wherein the apparatus has two cassettes for holding and separating semiconductor substrates. A first cassette is placed on top of a second cassette, using the first cassette as the top cassette that holds the semiconductor substrate and the support substrate, and the second cassette at the bottom as a bottom cassette that receives the semiconductor substrate after demounting process. The semiconductor substrate is loaded with its support substrate into a slot in the top cassette. The top cassette will let only the semiconductor substrate to descend to the bottom cassette while blocking the support substrate from exiting the top cassette. The two cassettes are then soaked in a hot solvent that can dissolve or melt an adhesive that adheres the semiconductor substrate to the support substrate in order to weaken the cohesive force between the two substrates.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A method of cleaning articles, such as infant feeding bottles is disclosed. The method provides for the use of alkali metal chloride, more particularly sodium chloride. The salt is deposited into the article to be cleaned, then water is added, and then the article is shaken to cause the crystalline substance to contact the interior walls of the container, thereby cleaning and sanitizing the interior of the article.

Abstract: A foreign-matter removal capacity is improved in a cleaning process. When a wafer is cleaned while a brush is moved from the center of the wafer toward the outer circumference thereof, a discharge flow rate of cleaning liquid flowing into the brush is regulated so that the interval between the brush and the wafer is kept constant.

Abstract: A mixed hydrogen-oxygen fuel generator system uses an electrolytic solution to generate gaseous hydrogen-oxygen fuel through the electrolysis of water. This generator system includes: at least one electrolytic cell with multiple metallic plates used as an internal isolation system in which two of the plates separately connect to both the positive and negative terminal of a DC circuit. These plates are used for the electrolysis of the electrolytic solution in the cell(s) to produce, under pressure, mixed hydrogen-oxygen fuel. The apparatus also includes a cooling system containing a water cooling tank in which there are two zones: one is the electrolytic solution circulation coil and the another is a water circulation zone.

Abstract: The present invention is directed to a method, system, and apparatus for applying megasonic energy to the surface of a workpiece for the removal of contaminants. A nozzle dispenses a stream of deionized water or other cleaning fluid at a radial position on the surface. A stepping motor moves the arm over the surface, in a step-wise manner, allowing megasonic energy to be applied in a uniform manner. The workpiece is rotated at low speeds to provide a more uniform application. Chemical solutions may optionally be added to dissolve contaminants or change the Zeta potential of the contaminants to make particles easier to detach and suspend. A high-RPM dry spin cycle further removes cleaning fluid and suspended contaminants, preventing them from reattaching. The present invention is compatible with numerous types of workpieces including 12″ semiconductor wafers.

Abstract: A pipeline cleaning and renovating method of the present invention comprises introduction of abrasive particulates by pressurized air through the pipelines to remove the incrustation adhering to the inner surface of the pipelines. Water or other liquids are introduced into the pipelines to generate or increase a moisture content in a flow of the pressurized air. The air flow through the pipelines is controlled to induce a substantially helical flow pattern such that a substantial amount of abrasive particulates are driven by the air flow to move along the inner surface of the pipeline in order to efficiently remove the incrustation. After the pipelines are cleaned, a coating material is added into the pipelines and driven by the air flow in the substantially helical flow pattern to provide an even coating film on the cleaned inner surface of the pipelines. This method can be broadly applied to various types of pipelines and various diameters of the pipelines from 13 mm to 300 mm.

Abstract: The present invention relates to a method for applying a detergent use solution to a washing surface of a motor vehicle, including the steps of: (a) providing a liquid detergent concentrate that includes an active ingredient level from about 0.1 wt. % to about 15 wt. %; (b) introducing the liquid detergent concentrate into a water stream to provide a detergent use solution that includes an active ingredient level from about 0.03 wt. % and 1 wt. %; and (c) applying the detergent use solution to a washing surface of a motor vehicle. In addition, the present invention also relates to a method for washing a washing surface of a vehicle, wherein the method includes: (a) providing a liquid detergent concentrate having an active ingredients level from about 0.1 wt. % to about 15 wt.

Abstract: The present invention provides: a process which involves safely and sanitarily extracting a solid material from a shell-and-tube reactor with good efficiency. The process comprises the step of extracting a solid material 90 that is packed in a reaction tube 20 of a shell-and-tube reactor 10, with the process further comprising: the step (a) of inserting an aspirating tube 30 from an end of the reaction tube 30 wherein the aspirating tube 30 is connected to an exhaust gas aspirator 70; and the step (b) of extracting the solid material 90 from the reaction tube 20 by aspirating the solid material 90 in the reaction tube 20 from a tip of the aspirating tube 30 together with a stream of air.

Abstract: A household dishwasher that includes a drain pan designed to relocate leaking fluids to an observable location. The dishwasher is a standard dishwasher with a drain pan for collecting water that unintentionally falls from the interior of the dishwasher. The drain pan is angled for diverting the collected water to a predetermined location exterior to the household dishwasher where an occupant of the household may view the water.

Abstract: Provided herein is a lid assembly for chemical vapor deposition (CVD) process chamber, comprising a moveable lid, two linear guide rollers connected to the lid, one or more linear lifting actuators, and a rotation actuator connected to the axis of the lid. This lid assembly may be used for opening/closing process chamber as well as wet-cleaning process chamber in chemical vapor deposition.

Abstract: The present invention provides a small, quiet sonic cleaner which can be used to clean jewelry and other small objects. The cleaner includes a tank which is rigidly connected to a vibration generator such as an eccentrically loaded motor, and which is flexibly coupled to a base upon which the cleaner sits. The coupling of the tank to the base is preferably through progressive motion attenuators such as springs, which provide superior vibration isolation for the tank.

Abstract: A method for cleaning a semiconductor structure using vapor phase condensation with a thermally vaporized cleaning agent, a hydrocarbon vaporized by pressure variation, or a combination of the two. In the thermally vaporized cleaning agent process, a semiconductor structure is lowered into a vapor blanket in a thermal gradient cleaning chamber at atmospheric pressure formed by heating a liquid cleaning agent below the vapor blanket and cooling the liquid cleaning agent above the vapor blanket causing it to condense and return to the bottom of the thermal gradient cleaning chamber. The semiconductor structure is then raised above the vapor blanket and the cleaning agent condenses on all of the surfaces of the semiconductor structure removing contaminants and is returned to the bottom of the chamber by gravity.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.