Abstract: A process for cleaning semiconductor fabrication equipment parts includes determining a definition for a clean part including multiple maximum acceptable impurity levels; determining an initial multiple impurity levels of a part prior to its cleaning; determining a cleaning process to apply to the part; applying the cleaning process to the part, wherein the cleaning process creates reduced multiple impurity levels for the part below that of the initial multiple impurity levels; determining the reduced multiple impurity levels; comparing the reduced multiple impurity levels against the multiple maximum acceptable impurities levels of the definition; and repeating the application of the cleaning process to the part if the reduced multiple impurity levels do not meet the definition of a clean part. A dilute aqueous cleaning solution for cleaning parts includes 0.5-1.5% wt. HF; 0.1-0.5% wt. HNO3; and 1-10% wt H2O2.

Abstract: A dishwasher functions to chop all fluid entrained soil prior to directing fluid to at least upper and lower wash arms and directs a percentage of the fluid flow into a filter chamber having one or more fine mesh filter screens that open into the dishwasher tub basin. When the fine mesh filter becomes clogged, fluid is forced to flow up an overflow tube and be exposed to another filter. The draining of portions of the system are sequenced to enhance soil removal.

Abstract: A method of surface cleaning and controlled oxidation of superalloys is described. The method provides a thin homogeneous layer of relatively pure alpha alumina which is suited to receive and adhere to a subsequent vapor deposited coating.

Abstract: A cleaning method for cleaning a developer container includes a step of blowing air through an opening formed in the developer container at a first flow rate; a step of sucking air through the opening at a second flow rate which is larger than the first flow rate; wherein while the blowing and suction steps are being simultaneously carried out, ambient air is permitted to enter the developer container through an ambient air inlet.

Abstract: In a procedure for cleaning floors by hand with the help of flat cleaning mops, mops provided with a certain quantity of cleaning solution are used. In this case, at least one mop is removed from a storage container (1), and saturated with solution before or during removal; the solution is applied onto the surface of the mop; the mops are stored as is after use in a holding container (2) up to their disposal for purposes of regeneration. A device for fitting and preparing a larger number of flat cleaning mops consists of a storage container, which has a removal opening (5) for removing mops, and is provided inside with a feeding device (11) for prior saturating the removed mops with cleaning solution.

Abstract: A method of improving the operation of a gas pipeline having at least some water therein including the steps of introducing into the interior of the pipeline a soluble soap pig that is dimensioned to move through the pipeline by gas flow, the composition of the soap pig being selected such that at least some soap is applied as a film to the interior wall as the soap pig moves through the pipeline and in which the soap pig slowly dissolves within the pipeline. The soap film preferably has anti-corrosive and/or antibacterial properties.

Abstract: A plant for the continuous washing of plastic material in scales. The plant having a washing apparatus, at least one filtering unit connected to the apparatus for purifying the washing fluid and means for varying the time the scales remain in the washing apparatus as a function of the quantity of scales contained at that same moment in the same apparatus.

Abstract: A cleaning system for cleaning boxes or containers used to carry semiconductor wafers has box holder assemblies attached to a rotor within an enclosure. Liquid spray manifolds have one or more spray nozzles that spray at an angle toward or away from the direction of rotation of the rotor, or an angle up or down, rather than straight at the boxes in the box holder assemblies. Improved spray coverage and cleaning is achieved.

Abstract: A method of cleaning particulates from a solution bath including at least partially filling a deionized water (DIW) bath for rinsing at least one wafer following chemically cleaning the at least one wafer; rinsing the at least one wafer; transferring the at least one wafer to a downstream process; at least partially draining the DIW from the DIW bath; at least partially filling the DIW bath with a bath cleaning solution; and, applying at least one source of ultrasonic energy to agitate the bath cleaning solution.

Abstract: A method for cleaning a lubricating oil cooler apparatus in situ with a cleaning liquid which includes introducing a cleaning liquid that is compatible with lubricating oil into the shell to cause cleaning of the shell and the external surfaces of the tube bundle. The cleaning liquid is recirculated in the shell to remove contaminants from the shell and the cleaning liquid is filtered after it has passed through the shell to remove contaminants from the cleaning liquid. The cleaning liquid is removed from the shell.

Abstract: A method for reclaiming fiberglass and a resinous residue from resinous fiberglass product. The method comprises first introducing the resinous fiberglass product to a single chamber or multi-chamber washer/extractor machine. An aqueous acid solution is then used to remove the resinous residue from the resinous fiberglass product. The fiberglass portion is then rinsed, dewatered, and stored for later use. At the same time, the resinous residue is recovered by precipitating the resinous residue out of the acid solution bath and separating it using a clarifier. The fiberglass portion is then available for reuse in the glass industry and other end use applications and the resinous residue may then be available for use in many other industries, including the fertilizer industry. In an alternative embodiment, a sizing composition may also be applied to the fiberglass portion prior to the dewatering step to form a sized fiberglass material.

Abstract: A cleaning method for removing solid deposits of the oxides of nitrogen, especially dinitrogen pentoxide, from ozone generator tubes and dielectrics is described. The method circulates warm dry gas in the tube section of the generator, warm water in the shell section or both to clean the ozone generator. The oxides are evaporated and evacuated from the system. The method substantially reduces or eliminates the formation of nitric acid on the tubes and dielectrics when the generator is exposed to humidity upon being opened to the atmosphere.

Abstract: The present invention provides a method and apparatus for a dishwasher having variable fill times. The dishwasher includes a fill volume sensor for sensing that the dishwasher has reached a known fill volume, a timer for timing a period of time between a beginning of fill and the known fill volume being reached, and an intelligent control electrically connected to the fill volume sensor and operatively connected to the timer and adapted for calculating a dishwasher fill rate. According to the present invention, once filling of the dishwasher begins, a sensor is triggered when a known water level and/or fill volume of the dishwasher is reached. The amount of time between initiating the fill and triggering the sensor is measured. A fill rate for the dishwasher is then calculated based on the known fill volume of the dishwasher and the amount of time.

Abstract: A method for removing particles from a semiconductor processing tool is provided. The method comprises providing a pick-up wafer for picking up particles from a semiconductor processing tool, inserting said pick-up wafer into said semiconductor processing tool and placing the pick-up wafer on a receiving member, applying an electrostatic charge to said pick-up wafer, leaving said pick-up wafer in said semiconductor processing tool for a predetermined dwell time; and removing said pick-up wafer from said semiconductor processing tool. Further, a method for processing semiconductor wafers is provided.

Abstract: A method of cleaning a printhead in an inkjet printer by removing organic debris deposits from the printhead, uses anyone of the liquid mixes of NaOCl (sodium hypochlorite) and H2O (water), H2O2 (hydrogen peroxide) and H2O, Na2S2O4 (sodium hydrosulfite) and H2O, CaCl2O2 (calcium hypochlorite) and H2O, or KMnO4 (potassium pernanganate) and H2O on the debris deposits, to serve as a cleaning agent.

Abstract: The present invention is directed to a method for controlled environment processing of parts in a chamber or chambers wherein solvents and/or solutions used for processing the parts can be introduced. The process includes applying a negative gauge pressure to the chamber to remove air or other non-condensable gases. Next a solvent, solvent mixture or solution in either a liquid or vapor state is introduced to the chamber. A first system is then applied to recover the solvent(s) or solution(s) from the object being processed and chamber, and a second system, separate from the first system, is applied that further recovers residual solvent or solution from the object and chamber. Treatment of the part may be in the form of coating, etching, deposition, cleaning, stripping, plating, adhesion, dissolving, penetrating, anodizing, impregnating, debinding or any other process in which material is removed or deposited on a solid surface by transfer from or to a liquid or gas phase.

Abstract: The invention is directed to a controlled environment processing chamber into which solvents, water and/or gases can be introduced for cleaning of an object. The process includes first applying a negative gauge pressure to the chamber to non-condensable gases and then introducing a solvent, solvent mixture, water or gas in either a liquid or vapor state to remove soluble contaminants from the surface of an object being processed in the chamber. Further steps recover residual solvent or solution from the object and chamber. A secondary cleaning step directs a vapor state fluid at high velocity at a solid surface of the object to remove insoluble material left behind after the pretreatment step. A final series of steps recovers any loose impediments or residual liquid or vapor from the chamber and returns the chamber to atmospheric pressure for removal of the cleaned object.

Abstract: The present invention discloses a method for cleaning contact lens molds. The method comprises the steps of placing a contact lens mold within an enclosed or substantially enclosed area, directing an inflow of gas under pressure into the enclosed area against the contact lens mold, and providing an outflow of gas from the enclosed area, thereby dislodging and removing debris.

Abstract: The invention relates to a method for lubricating and cleaning and/or disinfecting filling facilities for containers receiving beverages or foodstuffs, wherein the containers are conveyed on transport devices which are brought into contact with an aqueous solution of a conveyor lubricant during operation for the purpose of lubrication, wherein said aqueous solution is produced by diluting a product concentrate with water at a first dilution factor. The transport devices and/or the devices connected thereto are cleaned and/or disinfected during preselected time intervals and without interrupting the filling and transport operation by using the product concentrate for cleaning and/or disinfecting the transport devices and/or the devices connected thereto once said product concentrate has been diluted with water at a second dilution factor that is smaller than the first dilution factor.

Abstract: An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.