Patents Examined by Zhengfu J Feng
  • Patent number: 11895806
    Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: February 6, 2024
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Voi Nguyen, Jason Thompson, Charles Weirick
  • Patent number: 11889667
    Abstract: A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: January 30, 2024
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Akash Changarankumarath Pradeepkumar, Alfredo R. Munoz, Michael W. Degner, Edward Chan-Jiun Jih, Guangyin Lei
  • Patent number: 11880609
    Abstract: A USB memory according to a present embodiment is the USB memory capable of data transfer by being connected with a receptacle, and includes a wiring board, a semiconductor chip, a connector, and an adhesive film. The wiring board includes wiring. The semiconductor chip is electrically connected with the wiring. The connector includes a first connection, a second connection, and a holder. The first connection is electrically connected with the semiconductor chip via the wiring. The second connection is electrically connected with the first connection and is connectable with the receptacle. The holder holds the first connection and the second connection. The adhesive film is provided at least between the wiring board and the holder.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: January 23, 2024
    Assignee: Kioxia Corporation
    Inventor: Masayuki Dohi
  • Patent number: 11877414
    Abstract: In some examples, a tool-less electronic component retention apparatus includes a bracket to affix to a circuit board, and a spring-loaded arm attached to the bracket. The spring-loaded arm has an engagement tab that is angled downwardly to engage an upper surface of an electronic component to mount the electronic component to the circuit board. The spring-loaded arm is pivotable between an engaged position and a release position by a user without use of a tool.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: January 16, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Bradford Adam Gill, Tony Seokhwa Moon, Derek Lee Goode
  • Patent number: 11877422
    Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: January 16, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Ernesto Ferrer, Tahir Cader
  • Patent number: 11864331
    Abstract: A display panel and a display device are provided. Through setting an area difference between a first sub-display area and a second sub-display area in two directions of the display panel to be less than or equal to a preset value, an area difference between a force-receiving area of the first sub-display area and a force-receiving area of the second sub-display area will be less than or equal to a preset value such that force exerted on the first sub-display area and the second sub-display area is uniform, preventing concentrated force on one side of the display panel from causing the display panel to break.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: January 2, 2024
    Inventor: Cuilin Zhu
  • Patent number: 11839050
    Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: December 5, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventor: Chang-Yuan Wu
  • Patent number: 11839061
    Abstract: An electronic module assembly includes a circuit card assembly (CCA) with heat generating electronic components. A connector is electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA, connected in thermal communication with the electronic components. An undulating channel feature is defined along a lateral edge of the heatsink relative to the connector. One or more channels of the undulating channel feature are aligned with an insertion axis defined by the connector.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: December 5, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Alexander Trotman, Judy Schwartz, Josh Kamp, Robert J. DeFelice, Michael Doe, Jr., Anthony Matthew DeLugan
  • Patent number: 11832422
    Abstract: A computing rack apparatus which reduces the manufacturing cost by simplifying the structure thereof and in which the temperature of the internal air is utilized in the cooling unit is disclosed. The apparatus comprises: a rack housing which houses a server, a rack frame which is disposed inside the rack housing and on which the server is fastened and mounted; and a cooling unit which has a discharge port which is disposed inside the rack housing and discharges cooling air and a suction port which sucks the internal air through a cooling zone, wherein the discharge port is located in a first region with respect to a boundary portion defined by a front surface of the server, and the suction port is located in a second region with respect to the boundary portion, and the first and second regions form the cooling zone.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: November 28, 2023
    Inventor: Sung Kyun Lee
  • Patent number: 11825633
    Abstract: An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: November 21, 2023
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Alexander Trotman, Josh Kamp, Judy Schwartz, Robert DeFelice, Michael Doe, Jr., Anthony Matthew DeLugan
  • Patent number: 11825623
    Abstract: Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: November 21, 2023
    Assignee: SpinLaunch Inc.
    Inventors: Carl Lawhon, Maxim Clarke, Jonathan Yaney
  • Patent number: 11812594
    Abstract: The present disclosure provides a display apparatus. The display apparatus includes a display module including a display panel and a guide plate, a flexible printed circuit board extending from the display panel, a source printed circuit board connected to the flexible printed circuit board and attached to the guide plate, at least one driving chip disposed on the source printed circuit board, and a protective member disposed to cover the flexible printed circuit board, the source printed circuit board, and the driving chip.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: November 7, 2023
    Assignee: LG Display Co., Ltd.
    Inventors: Won-Tae Kim, Se-Hwan Jeon
  • Patent number: 11812558
    Abstract: A display device includes: a display panel; a circuit board, one end of the circuit board being connected to the display panel, and the circuit board being at least partially disposed on a back surface of the display panel and includes a device region on a side distal from the display panel; at least one electronic device disposed in the device region; and an adhesive tape disposed on a side, distal from the display panel, of the circuit board and bonded to a back surface of at least a part of the circuit board and the back surface of at least a part of the display panel. At least a part of the at least one electronic device in the device region is disposed between the adhesive tape and the back surface of the display panel.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 7, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Fan Li, Xiaolong Zhu, Hengzhen Liang
  • Patent number: 11795809
    Abstract: An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises thermally conductive material. The electronics enclosure system further includes at least one circuit board secured to an inner surface of a respective shell of the plurality of shells and a plurality of electronic components secured to the at least one circuit board, the plurality of shells, or some combination thereof.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: October 24, 2023
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Mark A. Zimmerman, Mukul M. Agnihotri, Michael Dewayne Finke
  • Patent number: 11799999
    Abstract: The protective corner apparatus is fitted along a portable mobile device, such that the protective corner apparatus provides sufficient protection while maintaining and complementing the core aesthetic design of the portable smart device. The protective corner apparatus contains a first protective layer, and a second protective layer. The first protective layer contains a first backing, a first mounting surface, and at least one retaining hook. The second protective layer contains a second backing, a second mounting surface, a slit, and a retaining ridge. The first protective layer is connected adjacent to the second protective layer. The first mounting surface is positioned on the first backing. The at least one retaining hook is angularly connected to the first backing. The second mounting surface is positioned on the second backing. The retaining ridge is angularly connected to the second backing. The slit is positioned between the second backing and the retaining ridge.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: October 24, 2023
    Inventor: Eric Adjesson
  • Patent number: 11785717
    Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: October 10, 2023
    Assignee: International Business Machines Corporation
    Inventors: Tyler Jandt, Mark Plucinski, Sandra J. Shirk/Heath, Phillip V. Mann
  • Patent number: 11778765
    Abstract: An electronic device is provided. The electronic device includes a housing having an insertion slot, a connecting interface, and an adaptor card. The connecting interface is disposed in the housing for connecting with a first electronic module or a second electronic module separately and has a first connecting part and a second connecting part. The adaptor card is detachably disposed in the housing and includes a flow guide. When the electronic device is in a first mode, the first electronic module is connected to the first connecting part, and the adaptor card is disposed between the insertion slot and the connecting interface. The flow guide directs an airflow toward the first electronic module. When the electronic device is in a second mode, the adaptor card is removed from the housing, and the second electronic module is connected to the first connecting part and the second connecting part.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: October 3, 2023
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Tsung-Han Wu, Yu-Shuo Wu
  • Patent number: 11758677
    Abstract: A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: September 12, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun Chang, Hsin-Chieh Lin, Chih-Hao Chang, Yi-Fu Liu
  • Patent number: 11751341
    Abstract: An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: September 5, 2023
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Tatsuya Ushioda, Jun Iwasaki, Masaaki Bandoh, Ryota Watanabe, Hiroshi Yamazaki
  • Patent number: 11751352
    Abstract: A method and assembly for locking/unlocking, formed of one of several a removable module (2) and a mount plate (3). The assembly includes a support wall (4) supporting each removable module (2). The removable module (2) being provided with two lugs (5) through which an aperture passes. The lugs (5) extending out of the removable (2) so that they can be inserted into opening (7) formed in the support wall (4). This assembly is equipped with a locking/unlocking system (100) having a lever (10) extending under the support wall (4) and provided with circular eccentric cams (11) arranged with offset axial symmetry in the form of an S about a central rotation axle (20) perpendicular to the support wall (4). The lever (10) being fixed in terms of rotation on this central axle (2) at equal distances from the two openings (7).
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: September 5, 2023
    Assignee: LATELEC
    Inventors: Jean Francois Bousquet, Bastien Puertolas