Patents Examined by Zhengfu J Feng
  • Patent number: 11604491
    Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: March 14, 2023
    Assignee: Apple Inc.
    Inventors: Dinesh C. Mathew, Edward J. Cooper, Brett W. Degner, Keith J. Hendren, Nicholas Alan Rundle, Dave Tarkington
  • Patent number: 11602066
    Abstract: The invention relates to a structure (1) for housing electronic apparatuses (10) such as boards (11) and the like, wherein the apparatuses are arranged in a container with a drawer (40) insertable and extractable with respect to a frame (20) of the structure (1). On the back wall of the drawer (40) and on the frame (20) connectors (53, 54) are provided which are coupled directly and automatically when the drawer is inserted.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: March 7, 2023
    Assignee: HITACHI RAIL STS S.P.A.
    Inventors: Renzo Tresanini, Nicola Baschiera, Paolo Spiga
  • Patent number: 11582886
    Abstract: A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: February 14, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11582890
    Abstract: An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: February 14, 2023
    Assignee: BAE Systems plc
    Inventors: Simon Bishop, Carl Martin Matthews, Curtis Baker
  • Patent number: 11570924
    Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: January 31, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Everett Lyons, Daniel Linnen, Randy Gillespie
  • Patent number: 11557529
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • Patent number: 11536292
    Abstract: A fan assembly includes a socket to receive a fan module, a fan flap coupled to a first side wall of the socket, and an anti-reflow device coupled to a second side wall of the socket. The fan flap moves in a curved path between a first position and a second position. The anti-reflow device has an attachment feature, an embossed feature, and a stopping feature. The attachment feature attaches the anti-reflow device to the second side wall. The embossed feature extends through a first aperture in the second side wall. The stopping feature extends through a second aperture in the second side wall and contacts the fan flap. When the fan module is removed, the stopping feature retains the fan flap in the first position to block the socket and prevent air from reflowing through the socket.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 27, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Chun Chang, Ting-Kuang Pao, Chih-Hao Chang
  • Patent number: 11540411
    Abstract: A coupling for connecting a circuit board to a mount with a fastener. The mount may be connected to a component. The fastener includes a first snap-fit connection formation for establishing a snap-fit connection with a second snap-fit connection formation provided on the mount. When connected, the fastener clamps the circuit board against the mount. The fastener further includes a first engagement formation configured to engage with a second engagement formation on the mount for bracing the snap-fit connection.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: December 27, 2022
    Assignee: Aptiv Technologies Limited
    Inventors: Ralf Slawik, Thorsten Mauff
  • Patent number: 11527458
    Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 13, 2022
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Ercan Mehmet Dede, Shailesh N. Joshi
  • Patent number: 11516326
    Abstract: A sensor module includes: a flexible printed circuit board; a temperature sensor disposed on the flexible printed circuit board to measure the temperature of a measurement object; a distance sensor disposed on the flexible circuit board adjacent to the temperature sensor to measure the distance to the measurement object; a terminal cover disposed above the temperature sensor and the distance sensor and including a first hole exposing a top surface of the temperature sensor and a second hole exposing a top surface of the distance sensor; and a window disposed in the second hole of the terminal cover.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: November 29, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Won Seo, Ki Chul Chang, Jeong Gi Seo
  • Patent number: 11497131
    Abstract: An example electrical connector includes a body to receive a circuit board. The body includes a first end and a second end. The electrical connector also includes a first latch rotatably attaches to the first end. The electrical connector further includes a second latch rotatably attaches to the second end. The electrical connector further includes a link member attached to the body. In response to a rotation of the first latch, the link member is to slide across the body from the first latch towards the second latch to rotate the second latch.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: November 8, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Cary Hung, Chien Hao Chen
  • Patent number: 11493313
    Abstract: The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: November 8, 2022
    Assignee: BAE SYSTEMS PLC
    Inventors: Gary Roy Moore, Paul Bicknell
  • Patent number: 11497139
    Abstract: A holder for an electronic rack includes a pivot point and a first end of the holder having a first blind-mate connector to be coupled to a second blind-mate connector at a first engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. The holder additionally includes a second end of the holder having a third blind-mate connector to be coupled to a fourth blind-mate connector at a second engagement interface. The third blind-mate connector and the fourth blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: November 8, 2022
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11483942
    Abstract: Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 25, 2022
    Assignee: SpinLaunch Inc.
    Inventors: Carl Lawhon, Maxim Clarke, Jonathan Yaney
  • Patent number: 11477885
    Abstract: A housing of a conformal wearable battery (CWB) encloses a plurality of battery cells arranged in a grid-like pattern and electrically connected to a printed circuit board (PCB). The PCB includes an electrical connection pad that is electrically coupled to a positive terminal of a battery cell of the plurality of battery cells and a positive conductive region receiving electrical energy from one or more of the plurality of battery cells. A redundant trace fuse circuit is formed on the PCB to facilitate electrical connection of the electrical connection pad and the positive conductive region. The redundant trace fuse circuit includes a first fusible link for electrically connecting the first electrical connection pad to the positive conductive region and a second fusible link that is selectively enabled to electrically connect the first electrical connection pad to the positive conductive region when the first fusible link is inoperative.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: October 18, 2022
    Assignee: Inventus Power, Inc.
    Inventors: Michael M. Zhang, Christopher Michael Reinke, Ilyas Ayub, William Mark Batts, Timothy James Vallaro, Elijah Brett Goldin, Anvin Joe Manadan
  • Patent number: 11464137
    Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 4, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Pritish R. Parida, Joel A. Silberman
  • Patent number: 11460884
    Abstract: A case for use with a portable computing device is provided. The case comprises a housing for protecting the portable computing device. The housing is configured to attach to the portable computing device. The case further comprises a multiport hub and/or a data storage device contained within the housing. The multiport hub is configured to be electrically connected to the portable computing device.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: October 4, 2022
    Assignee: BYRDBYTE CREATIONS INC.
    Inventors: Kareem Kort, Emil Fadi Kort, Maximilian Kent Dykes
  • Patent number: 11375605
    Abstract: An electronic device includes a printed board, a frame for fixing the printed board, a connector fixed at a position along one side of a front surface of the printed board, and an electrically conductive member. An indented portion is formed at a position of the one side facing the connector. The electrically conductive member has a portion arranged in the indented portion, and is expanded and contracted in a direction along the one side and a thickness direction of the printed board by an external force. The electrically conductive member has an upper surface, a lower surface, and a side surface in contact, respectively, with a shell of the connector, one surface of the frame, at least one side-surface portion which is part of a portion forming the indented portion and extends along a direction crossing the one side. The electrically conductive member is electrically connected with a ground of the printed board via the side-surface portion.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: June 28, 2022
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Tetsufumi Nozawa, Hiroyuki Katayama
  • Patent number: 11363738
    Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 14, 2022
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Jason Thompson, Marcus Ni, Voi Nguyen
  • Patent number: 11343921
    Abstract: An electronic unit includes a first case made of metal; a second case made of metal; a frame made of synthetic resin arranged inside an assembly of the first case and the second case; a relay member made of metal that is separate from the frame and includes a first connection portion electrically connected to the first case, a second connection portion electrically connected to the second case, and a coupling portion coupling the first connection portion and the second connection portion; a first screw that passes through the first case and the first connection portion from the outside of the first case and is fixed to the frame; and a second screw that passes through the second case and the second connection portion from the outside of the second case and is fixed to the frame.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: May 24, 2022
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tatsuya Sumida, Kyohei Morita