Patents Examined by Zhengfu J Feng
  • Patent number: 10481652
    Abstract: Devices, systems, and methods for cooling an autonomous vehicle computing system are provided. A modular cooling device can include a cooling baseplate and one or more modular heat frames. The cooling baseplate can include at least one planar cooling surface, an inlet configured to receive a cooling fluid, an outlet, and at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the at least one planar cooling surface. Each modular heat frame can be configured to house at least one autonomous vehicle computing system component, be coupled parallel to the at least one planar cooling surface, and transfer heat from the at least one autonomous vehicle computing system component housed by the modular heat frame to the cooling baseplate.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: November 19, 2019
    Assignee: UATC, LLC
    Inventors: David Patrick Rice, Thomas Jeffrey Watson, John William Zinn, Robert Henry Doll, Declan Seamus Kelly
  • Patent number: 10455731
    Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Ralph W. Jensen, Jeffory L. Smalley, Kevin J. Ceurter, Devdatta P. Kulkarni, Casey Winkel
  • Patent number: 10453777
    Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: October 22, 2019
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Ercan Mehmet Dede, Shailesh N. Joshi
  • Patent number: 10437297
    Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 8, 2019
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen
  • Patent number: 10440864
    Abstract: A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: October 8, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ryohei Hayashi, Goki Furuya, Kohei Ando
  • Patent number: 10420251
    Abstract: An electronic device is immersed in a coolant in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, storage units attached to a first surface of the metal board and a second surface opposite the first surface, and a backplane including connectors for electrically connecting the respective storage units, attached orthogonally to the first surface of the metal board, and the second surface opposite the first surface. The metal board includes a primary member including cuts in a width direction for fixing support plates that support the storage units to the primary member, and a secondary member includes pawls inserted into slits in the backplane, and fixed to the primary member. The support plates include holes for passage of the coolant.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: September 17, 2019
    Assignee: EXASCALER INC.
    Inventor: Motoaki Saito
  • Patent number: 10398062
    Abstract: A heat exchanger includes a chassis, and a mounting opening and an outer outlet formed at the bottom of the chassis. The cooling core is installed in the chassis and disposed above the mounting opening. The external circulation fan module is installed from the mounting opening into the chassis. The cover covers the mounting opening. External air flows through the cooling core and exchanges heat with the cooling core to simplify the method of mounting the external circulation fan module.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: August 27, 2019
    Inventors: Yen-Wen Huang, Kuan-Lung Wu, Shan-Chun Yang
  • Patent number: 10379986
    Abstract: A hardware monitoring system and a method therefor are disclosed. The hardware monitoring method includes: sensing a first temperature value of a first temperature area by a first temperature sensor and sensing a second temperature value of a second temperature area by a second temperature sensor; reading and compensating for the second temperature value by a complex programmable logic device (CPLD); and reading the first temperature value and the compensated second temperature value and controlling heat dissipation of the computer system based on the first temperature value and the compensated second temperature value, by a hardware monitor. In this method, temperature values of different areas are sensed with multiple temperature sensors and are read and modified by the CPLD, thereby allowing temperature compensation for the temperature sensors and addressing the problem of inability to individually compensate for temperature values of different areas.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: August 13, 2019
    Inventors: Xiaobing Zou, Yingxian Han, Longlong Xie, Chia-Hsing Chen, Jianbin Ni
  • Patent number: 10362712
    Abstract: A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: July 23, 2019
    Inventors: Michimasa Aoki, Masumi Suzuki
  • Patent number: 10356952
    Abstract: A data center cooling system configured to cool one or more components of a data center thereby enabling a data center to be maintained at a higher overall temperature while still providing sufficient cooling to the components housed in the data center is disclosed. By maintaining the data center at a higher overall temperature, significant operational costs are realized due to savings in power costs. The data center cooling system may include one or more turbo-expanders having a rotary turbine positioned within a turbo-expander housing in which compressed air expands and drives the rotary turbine. The cooled expanded air is heated passing through a thermal transfer system that pulls heat from the data center component. The air is further heated passing through a brake system that generates heat by applying resistance to a shaft coupled to the rotary turbine. The heated air is exhausted outside of the data center.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: July 16, 2019
    Inventors: Sheldon K. Meredith, William Cottrill, Brandon B. Hilliard
  • Patent number: 10321553
    Abstract: An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: June 11, 2019
    Inventors: Hailong Zhang, Xiaoxia Zhou, Jinghan Yu, Philippe Sochoux, Xiao Li, Alpesh Bhobe
  • Patent number: 10264677
    Abstract: An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: April 16, 2019
    Inventors: Koichiro Kawasaki, Taku Kikuchi, Takashi Kitahara, Hiroki Noto
  • Patent number: 10264668
    Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: April 16, 2019
    Assignee: Hamilton Sundstrand Corporation
    Inventors: David Perley, Kenneth J. Trotman
  • Patent number: 10254029
    Abstract: A refrigeration system, including: an electronic control unit, including a housing and an electronic device arranged in the housing; a refrigeration loop, including a compressor, a condenser, a primary throttling element, and an evaporator sequentially connected through a pipeline and forming a closed loop; and an electronic device cooling branch connected into the refrigeration loop from the condenser, and connected back to the refrigeration loop from the evaporator; the electronic device cooling branch including an electronic device cooling unit, a secondary throttling element, and an electromagnetic valve; and the electronic device cooling unit being arranged in the housing and spaced apart from the electronic device, for reducing the temperature and humidity of the electronic device and an environment in the housing.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: April 9, 2019
    Inventors: Michael A. Stark, Lei Wang, Jianxin Huang, Chaoqun Yan
  • Patent number: 10257953
    Abstract: Provided is an enclosure for use in a modular storage system, the enclosure comprising a plurality of drive bays, a controller canister, an expansion canister, and a midplane connecting the drive bays to the canisters, wherein the controller canister occupies a greater volume of the enclosure than the expansion canister.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: April 9, 2019
    Assignee: International Business Machines Corporation
    Inventor: Ian D. Judd
  • Patent number: 10251257
    Abstract: An electronic apparatus and heat dissipation and EMI shielding structure thereof are provided. The electronic apparatus includes a substrate, at least one chip disposed on the substrate, and the heat dissipation and EMI shielding structure. The heat dissipation and EMI shielding structure covers the chip and includes a shielding frame and a heat dissipation element. The shielding frame has an opening to expose the chip, and the heat dissipation element is disposed on the shielding frame and covers the opening. The conjunction of the shielding frame and the heat dissipation element can protect the chip from being interfered with electromagnetic waves, and the heat generated by the chip can be dissipated by the heat dissipation element.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: April 2, 2019
    Inventor: Chao-Min Lai
  • Patent number: 10251312
    Abstract: Cooling systems for devices arranged in rows are disclosed. An example cooling system includes an inflatable air duct to be positioned above a cold aisle defined between two rows of electronic equipment. The inflatable air duct is to be air permeable to deliver conditioned air into the cold aisle. The electronic equipment has fans to force cool air within the cold aisle through the electronic equipment to adjacent hot aisles on opposite sides of the two rows of the electronic equipment. The inflatable air duct to be spaced apart from the rows of computers such that the cold aisle is in unobstructed fluid communication with the adjacent hot aisles over top of the rows of electronic equipment. The conditioned air delivered from the inflatable air duct to substantially prevent a mixing of warm air in the hot aisles with the cool air in the cold aisle.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: April 2, 2019
    Assignee: Rite-Hite Holding Corporation
    Inventors: Philip Sloan, Nicholas L. Kaufmann, Kevin J. Gebke, Frank Heim
  • Patent number: 10211117
    Abstract: A crimping power module includes a shell (10), a cover (12), and an electric insulation substrate (13) crimped to a heat dissipation device. The cover and the substrate are respectively mounted to a first surface (111) and a second surface (112) of the shell. The second surface defines an annular slot (113) in a position facing sides of the substrate. The slot is embedded with a first elastic member (15) elastically abutted against the substrate. The elastic member is higher than the second surface, allowing the shell to adjust a pressure flexibly applied on the heat dissipation device by the substrate. An elastic buffer is provided through defining the slot embedded with the elastic member, to prevent the substrate from fracturing, and adjust the pressure to ensure tight crimping between the substrate and the heat dissipation device, which decreases thermal resistance, and increases heat dissipation efficiency.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: February 19, 2019
    Inventor: Jiefu Zhang