Patents Examined by Zhengfu J Feng
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Patent number: 12389523Abstract: An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.Type: GrantFiled: November 29, 2021Date of Patent: August 12, 2025Assignee: Huawei Technologies Co., Ltd.Inventors: Lan Li, Linfang Jin, Jinyan Hu
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Patent number: 12376252Abstract: A retention mechanism is provided for retaining graphics add-in cards in an information handling system. The retention mechanism includes a mount and a retention bracket. The mount is affixed to the information handling system and includes mounting locations. The retention bracket is configured to be affixed to a particular one of the mounting locations and includes an adjustable filler device. The filler device is configured to secure a first graphics add-in card having a first width with the filler device located in a first position, and to secure a second graphics add-in card having a second width that is wider than the first width with the filler device located in a second position.Type: GrantFiled: March 17, 2023Date of Patent: July 29, 2025Assignee: Dell Products L.P.Inventors: HsienWei Chen, Yu-Tai Sheng, Pei-Yi Chou, Che-Ling Huang
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Patent number: 12356561Abstract: The electronic control device includes: a housing; a first plate disposed in the housing; a second plate disposed in the housing and having an inner surface facing the inner surface of the first plate; a first control module disposed in the housing; and a second control module disposed in the housing, wherein the first control module includes: a first printed circuit board having an inner surface coupled to one side of the first plate and one side of the second plate; a first power supply substrate disposed on an outer surface of the second plate; and a first EMI filter disposed between the first plate and the second plate, an inner surface of which is opposite to an inner surface of the first printed circuit board, and wherein the second control module includes: a second printed circuit board having an inner surface coupled to the other side surface of the first plate and the other side surface of the second plate; a second power supply substrate disposed on an outer surface of the first plate; and a secondType: GrantFiled: November 24, 2021Date of Patent: July 8, 2025Assignee: LG INNOTEK CO., LTD.Inventors: Kun Yong Song, Dong Joon Kim
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Patent number: 12356582Abstract: A power module structure includes a first housing, a second housing, a wind generating unit and a power socket. The first housing includes a first plate and a first side portion. The second housing is attached to the first housing and includes a second plate arranged opposite to the first plate and a second side portion arranged opposite to the first side portion. Furthermore, a ventilation bracket is integrally bent and extended from the second housing and provided for the installation of the wind generating unit. The power socket is arranged side by side with the wind generating unit. The power socket and the wind generating unit are located between the first plate and the second plate. Moreover, the ventilation bracket includes a securement portion, and the securement portion is extended to inside of the first plate or the second plate for securement.Type: GrantFiled: June 2, 2023Date of Patent: July 8, 2025Assignee: CHICONY POWER TECHNOLOGY CO., LTD.Inventors: Yung-Hung Hsiao, Chia-Hsien Yen, Chun-Hsiung Yeh, Cheng-Chang Hsiao, Yu-Chen Wu
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Patent number: 12348022Abstract: An electrical cabinet includes a cabinet frame, two or more hoist brackets, a hoist bar, and a hoist mechanism. The cabinet frame has a top section and a bottom section. The bottom section rests on an underlying supporting surface, and the top section is positioned at an opposing side of the cabinet frame from the bottom section. The hoist brackets are coupled to the top section of the cabinet frame. Each of the hoist brackets has a respective indentation. The hoist bar rests in the indentations of the two or more hoist brackets, and includes a first groove. The hoist mechanism rests in the first groove of the hoist bar. The hoist mechanism is configured to facilitate lifting and positioning of an electrical component of a power distribution system within the electrical cabinet. The electrical component can be a bus assembly for a switchboard.Type: GrantFiled: July 23, 2021Date of Patent: July 1, 2025Assignee: Schneider Electric USA, Inc.Inventors: Forrest Jones, Karthik Sundaramoorthy, Charles Wesley Travis, Jr.
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Patent number: 12342506Abstract: A thermal dissipation structure includes a housing, a thermal dissipation mechanism, and a seal member. The housing accommodates a heat-generating element. The thermal dissipation mechanism includes a thermal transfer part and a thermal dissipation part. The thermal transfer part is disposed inside the housing. The thermal transfer part is configured to transfer heat generated by the heat-generating element. The thermal dissipation part is disposed outside the housing. The seal member seals between the housing and the thermal dissipation mechanism.Type: GrantFiled: April 13, 2023Date of Patent: June 24, 2025Assignee: EXEDY CORPORATIONInventors: Taichi Ohno, Taichi Kitamura
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Patent number: 12334232Abstract: An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.Type: GrantFiled: July 20, 2021Date of Patent: June 17, 2025Assignee: Intel CorporationInventors: Navneet Kumar Singh, Samarth ALva, Raghavendra S. Kanivihalli, Aiswarya M. Pious, Samantha Rao, Bijendra Singh
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Patent number: 12328840Abstract: A heater device connectable to a network and adapted to mine cryptocurrency includes a housing having at least one sidewall, a top cover, and a bottom cover, the at least one sidewall including a sound insulation layer connectable thereto. A mining assembly is configured to mine cryptocurrency. The mining assembly includes a shroud that includes a mining motherboard, a power supply unit, and a control board and a fan assembly connectable to the mining assembly. The fan assembly is configured to transfer heat when generated by the mining assembly. The sound insulation layer surrounds both the mining and fan assemblies to provide noise absorption of the mining assembly or fan assembly when the heater device is activated.Type: GrantFiled: July 6, 2022Date of Patent: June 10, 2025Assignee: HEATBIT INC.Inventors: Igor Aleksadrov, Dmitriy Aleksandrov, Anton Khromov, Vasily Kostromin, Vadim Rustamov, Alexander Busarov
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Patent number: 12324131Abstract: Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data centers.Type: GrantFiled: May 17, 2023Date of Patent: June 3, 2025Assignee: Seguente, Inc.Inventors: Raffaele Luca Amalfi, Ryan Enright, John Kim
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Patent number: 12317442Abstract: Disclosed in the present disclosure is a locking bracket and a chassis. The locking bracket includes a locking base and a locking block. The locking base is fixedly connected to the chassis, and the locking block is movably connected to the locking base along a preset path to switch the locking block to the locked state when installing the functional module into the chassis. The clamping groove can clamp the limiting portion of the installing bracket that covers and fixes the functional module to fix its position, thereby improving the problem of component detachment caused by vibration, shaking, or impact during transportation of the chassis. When it is necessary to remove the functional module from the chassis, the locking block is moved along the preset path to switch from the locked state to the unlocked state.Type: GrantFiled: October 16, 2023Date of Patent: May 27, 2025Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.Inventors: Hung-Wei Chen, Yu-Yong Huang
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Patent number: 12313114Abstract: A rotating shaft apparatus and an electronic device are provided, which include a first rotating mechanism and a second rotating mechanism. The first rotating mechanism includes a first ratchet and a first tooth. The first tooth can rotate with respect to the first ratchet in a first rotation direction. An engagement structure between the first tooth and the first ratchet makes the first tooth stop rotating in a second rotation direction. The first and second rotation directions are opposited. The second rotating mechanism is arranged coaxially with the first rotating mechanism, and includes a second ratchet and a second tooth. The second ratchet is in stop-rotation connection with the first tooth. The second tooth can rotate with respect to the second ratchet in the second rotation direction. An engagement structure between the second tooth and the second ratchet makes the second tooth stop rotating in the first rotation direction.Type: GrantFiled: December 15, 2022Date of Patent: May 27, 2025Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventor: Hongdong Huang
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Patent number: 12302488Abstract: An electronic control device includes a first circuit board having a first mounting surface on which a first electronic component is mounted, a second circuit board having a second mounting surface on which a second electronic component is mounted, and a base member disposed between the first mounting surface and the second mounting surface so as to face the first electronic component and the second electronic component, where a first heat-conducting material is disposed between the base member and the first electronic component, a second heat-conducting material is disposed between the base member and the second electronic component, the base member includes a first region that at least does not overlap the second circuit board when viewed in a line-of-sight direction normal to the first mounting surface and the second mounting surface, and a second region that overlaps both of the first circuit board and the second circuit board when viewed in the line-of-sight direction, a heat dissipation unit including aType: GrantFiled: March 10, 2021Date of Patent: May 13, 2025Assignee: HITACHI ASTEMO, LTD.Inventors: Minami Teranishi, Shinya Kawakita
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Patent number: 12301742Abstract: An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.Type: GrantFiled: March 10, 2023Date of Patent: May 13, 2025Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Junghyun Im, Joungki Park, Jinwoo Park, Seungchang Baek, Yoonhee Lee, Jungwoo Choi, Sungho Cho, Hangyu Hwang, Jongchul Choi
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Patent number: 12293684Abstract: Disclosed is a flexible display device. The flexible display device includes a housing, a winding shaft, a flexible display panel, a supporting member, a separating member and a pressing member. The housing has an opening provided thereon. The winding shaft is rotatably provided in the housing. The flexible display panel has one end connected to the winding shaft and another opposite end extending out of the housing through the opening. The supporting member has one end connected to the winding shaft and another opposite end extending out of the housing through the opening. The separating member is provided on the housing to separate the flexible display panel and the supporting member partially. The pressing member is provided on the housing to connect the flexible display panel and the supporting member.Type: GrantFiled: July 5, 2024Date of Patent: May 6, 2025Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Junhuan Liu, Hong Zhu, Shangchieh Chu
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Patent number: 12295119Abstract: Multiple systems and devices for providing liquid and air cooling for IT components is disclosed. The system includes a module comprising at least one dry cooler and at least one liquid heat exchange device. The module includes a primary cooling loop with the at least one dry cooler and the at least one liquid heat exchange device. The system also includes a secondary loop that includes the at least one liquid heat exchange device and one or more IT units in a facility. The system includes a path for air cooling the one or more IT units in the facility that includes at least one air intake from outside the facility that supplies air for cooling the one or more IT units.Type: GrantFiled: October 21, 2022Date of Patent: May 6, 2025Assignee: Dell Products L.P.Inventors: Tyler Baxter Duncan, Anthony Middleton, Ty Robert Schmitt
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Patent number: 12289874Abstract: An electronic assembly includes a printed circuit board (PCB), an electronic component coupled to the PCB, an electrically conductive fence coupled to the PCB and surrounding a perimeter of the electronic component, and a fan assembly. The fan assembly includes a housing coupled to the fence and disposed over the electronic component and a plurality of fan blades configured to rotate within the housing.Type: GrantFiled: September 29, 2023Date of Patent: April 29, 2025Assignee: APPLE INC.Inventors: Hiroshi Kubo, Yinjuan He, Kristina A. Babiarz, Noell G. Johnson, Sean M. Grove, Sina Bigdeli, Sivesh Selvakumar
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Patent number: 12289851Abstract: A waterproof gate assembly, which is configured to be mounted to a housing and includes a cover, an installation axle and a fixing member, is provided. The installation axle is connected to the cover, allowing the cover to rotate relative to the installation axle. The installation axle includes an axial groove, an engaging structure and a fixing structure. The axial groove is connected to the cover and includes a first end portion and a second end portion. The engaging structure is connected to one side of the axial groove corresponding to the cover, extends to the first end portion of the axial groove, and is configured to be engaged at the housing. The fixing structure is connected to one side of the axial groove corresponding to the cover, and close to the second end portion. The fixing member passes through the fixing structure and is fixed at the housing.Type: GrantFiled: November 4, 2022Date of Patent: April 29, 2025Assignee: Getac Technology CorporationInventors: Kun-Cheng Lee, Juei-Chi Chang
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Patent number: 12284791Abstract: A base for an electrical component includes: a body, the body defining: a rim, pin slots, and first engagement slots; contact terminals; and electrical connectors, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body; wherein the base is configured to provide an electrical connection between one or more power modules and a substrate.Type: GrantFiled: January 27, 2023Date of Patent: April 22, 2025Assignee: BorgWarner US Technologies LLCInventors: Bryan Rohl, Chris Fruth
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Patent number: 12279392Abstract: Provided is an electronic control device capable of suppressing outflow of a sealing material to the outside and reducing defective attachment of a bracket. The electronic control device 1 to be attached to a bracket 2 includes a cover 4 (first housing) and a case 3 (second housing) fitted to the cover 4. The cover 4 (first housing) includes a first flange 4F and a first groove portion 31 filled with a sealing material 5. The case 3 (second housing) includes a second flange 3F overlapping the first flange 4F, and a case protrusion 33 (protrusion) fitted to the first groove portion 31 and embedded in the sealing material 5. The first flange 4F of the cover 4 (first housing) has a second groove portion 41 present at a position that is closer to the outside than the first groove portion 31 is.Type: GrantFiled: February 5, 2021Date of Patent: April 15, 2025Assignee: Hitachi Astemo, Ltd.Inventors: Kenta Yakuzawa, Toshikazu Shigyo
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Patent number: 12272379Abstract: A disk drive according to an embodiment includes a housing, a seal, and a piercing member. The housing includes a base having a first space, a first cover with a first hole, attached to the base, and a second cover covering the first cover. The first cover closes the first space. The first cover and the second cover are placed with a second space in-between. The first hole allows communication between the first space and the second space. The seal with a second hole, is attached to the first cover, the second hole allowing communication between the first space or the second space and the first hole. The piercing member includes an attachment part attached to the second cover in the second space, and a needle protruding from the attachment part toward the second hole.Type: GrantFiled: March 8, 2023Date of Patent: April 8, 2025Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventor: Tomoyuki Tokizaki