Patents Examined by Zhengfu J Feng
  • Patent number: 12031363
    Abstract: A handle mechanism is to be mounted on a slidable plate and to slide the slidable plate relative to a chassis. The handle mechanism includes a handle and an engagement component. The handle is adapted to be pivotably disposed on the slidable plate so as to have an engaged position and a disengaged position. The engagement component is slidably disposed on the handle and adapted to contact the chassis to slide the slidable plate into the chassis. The engagement component has a contact surface, and the contact surface has an edge located away from an axis of the handle. A distance between the edge of the contact surface of the engagement component and the axis of the handle in the engaged position is smaller than a distance between the edge of the contact surface of the engagement component and the axis of the handle in the disengaged position.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: July 9, 2024
    Assignee: WIWYNN CORPORATION
    Inventors: Ping Sheng Yeh, Tingya Liao, Ming Chih Kao, Ming Feng Hsieh
  • Patent number: 12024283
    Abstract: A circuit board assembly for association with an aircraft includes a circuit board and an electromagnetic interference component connected to the circuit board. The circuit board assembly may further include an enclosure having an electromagnetic signal permissive layer and an electromagnetic signal blocking layer. The electromagnetic signal permissive layer may include a housing that define a volume. The housing may enclose the electromagnetic interference component on the circuit board. The electromagnetic signal blocking layer defines a conductive barrier about the electromagnetic interference component.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: July 2, 2024
    Assignee: Zipline International Inc.
    Inventor: Ethan C. Anderson
  • Patent number: 12022626
    Abstract: In a ventilation mechanism of an electronic control device, a ventilation path is formed by a through hole and a window formed in a side surface of a projection projecting outward of a case, and entry of water into the ventilation path is prevented by a wall. A water-repellent filter is attached to an inner wall of the case, with a gap between the water-repellent filter and a bottom surface of the projection. The projection and the wall are integrated with the case. This achieves reduction in the number of components of the ventilation mechanism and improvement in machinability while ensuring a waterproof function.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: June 25, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuya Fujisawa, Kohei Ushio, Kazuki Takabatake
  • Patent number: 12018710
    Abstract: An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20. The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28. The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20. A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: June 25, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Kenta Yakuzawa, Toshikazu Shigyo
  • Patent number: 12022640
    Abstract: A multi-column graphite-over-foam (GOF) assembly includes a plurality of foam columns wherein each foam column of the plurality of foam columns are individually wrapped in a graphite sheet. A graphite layer surrounds the plurality of foam columns and an electrically conductive outer layer surrounding the graphite layer. The graphite layer is configured to thermally couple the electrically conductive outer layer to the plurality of foam columns, and the electrically conductive outer layer is configured to absorb electromagnetic interference (EMI).
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: June 25, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Phong Hoang Ho, Stephen Aubrey Scearce
  • Patent number: 12016166
    Abstract: An electronic device is provided. The electronic device includes a circuit board, a connector, a shielding frame and a shielding cover. The connector is disposed on the circuit board. The shielding frame is disposed on the circuit board, wherein the connector is disposed in the shielding frame. The shielding cover is detachably connected to the shielding frame, wherein when the shielding cover is combined with the shielding frame, an inlet is formed between the shielding frame and the shielding cover, and the shielding frame and the shielding cover are adapted to block an interference signal.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: June 18, 2024
    Assignee: WISTRON NEWEB CORP.
    Inventors: Yu-Ting Kuo, Yung-Jinn Chen
  • Patent number: 12014236
    Abstract: Mounts for securing a device to a flexible object comprise a flexible substrate configured to be operatively coupled to the flexible object and a housing coupled to the flexible substrate and having an internal void that is sized to receive the device.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: June 18, 2024
    Assignee: ELEVATION LAB, INC.
    Inventors: Casey Hopkins, Jacob Hull
  • Patent number: 12016120
    Abstract: A computing card for an information handling system, the computing card system including a computing card, including: a first side including: a first body surface, the first body surface including a first plurality of conductive pads configured to connect respectively with a first set of pins of a computing card receptacle; a first indented surface configured to connect with a second set of pins of the computing card receptacle; a first connecting surface defined between the first body surface and the first indented surface; a bottom surface; and a plurality of internal layers, wherein one or more of the internal layers are exposed at the first indented surface, and are connected to the bottom surface.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: June 18, 2024
    Assignee: Dell Products L.P.
    Inventors: Charles William Ziegler, Jason Charles Pritchard, Stephen Edward Strickland
  • Patent number: 12016139
    Abstract: A flexible display device and a manufacturing method thereof are provided. The flexible display device includes a flexible display panel, wherein the flexible display panel is bent at a preset position to form a first plane part, a bending part, and a second plane part, the preset position includes a first bending point and a second bending point, a distance between the first bending point and the second bending point is H, a middle point of a line formed by connecting the first bending point and the second bending point is located on a bending axis of the bending part, and a radius of curvature of at least one point on the bending part is greater than H/2.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: June 18, 2024
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Lijun Qin, Yanqiang Duan
  • Patent number: 12011908
    Abstract: A stretchable display panel and a display device are disclosed. The stretchable display device includes a display area and a wiring area. Each of bridge structures in a transition display area gradually increases in width in a direction from a middle display area to the wiring area. A plurality of first openings are defined on a side of the transition display area adjacent to the wiring area. Each of the first openings has opposite ends located within a boundary area defined by a connecting line connecting centers of adjacent island structures corresponding to the opposite ends of the first opening. In this manner, a hollow ratio of the transition display area close to the wiring area can be reduced, and risk of breakage of lines in the transition display area can be lowered.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: June 18, 2024
    Assignee: WUHAN CHINA STAR OPTOELECTORNICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Wenqiang Wang
  • Patent number: 12014794
    Abstract: According to one embodiment, a memory system includes a first plate, an intermediate member, and a substrate. The intermediate member includes a second plate and a pair of side walls. The second plate includes a first opening, and is arranged to have a gap with respect to the first plate. The second plate includes a first face facing the first plate and a second face located on a side opposite to the first face. The pair of side walls is arranged on the second face. The substrate is placed between the pair of side walls. The substrate includes a third face on which a first non-volatile memory package and a controller package are mounted. The third face faces the second plate. The first non-volatile memory package is thermally connected to the second plate. The controller package is thermally connected to the first plate through the first opening.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: June 18, 2024
    Assignee: Kioxia Corporation
    Inventor: Seiichi Tajima
  • Patent number: 12016146
    Abstract: Embodiments of the disclosure provide a cable connection structure, including: a bearing member, the bearing member being provided with at least one cable connector, and each cable connector having a first port connected to a cable and a second port electrically connected to the first port; and a sliding structure connected to the bearing member, the bearing member being configured to be connected to a single board through the sliding structure, the bearing member enabling the single board connected to the bearing member to slide in a first direction which is a direction close to or away from the second port. Embodiments of the disclosure also provide a single-board assembly and a single-board assembly connection structure.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: June 18, 2024
    Assignee: XI'AN ZHONGXING NEW SOFTWARE CO., LTD.
    Inventor: Yu Bi
  • Patent number: 12016167
    Abstract: A carrier assembly for mounting equipment into a carrier slot includes an electro-magnetic interference (EMI) shield and an EMI finger. The EMI shield protects the mounted equipment from EMI. The EMI shield is formed in a first plane of the carrier assembly. The EMI finger protrudes from the EMI shield and is coupled to the EMI shield. The EMI finger is formed in a second plane perpendicular to the first plane. The EMI finger operates, when the carrier assembly is installed into the carrier slot, to couple the EMI shield to the carrier slot. The EMI finger, when viewed from a first direction that is perpendicular to both the first plane and the second plane, is formed in a tear-drop shape.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: June 18, 2024
    Assignee: Dell Products L.P.
    Inventors: Yu-Lin Chen, Yueh-Chun Tsai, Chun-Cheng Lin, Chi-Feng Lee
  • Patent number: 12016155
    Abstract: A heat sink including a first face in contact with electronic components generating heat to be removed and a second face in contact with the medium into which to dissipate the heat generated by the electronic components, including: at least one device for enhancing the thermal conductivity including a dome-shaped surface, a pin and a lateral section of revolution about the pin, the dome-shaped surface being connected to one end of a pin and to the lateral section of revolution, the dome-shaped surface being arranged on the second-face side, the free end of the pin being arranged on the first-face side.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: June 18, 2024
    Assignees: Continental Automotive France, Continental Automotive GmbH
    Inventor: Philippe Lopez
  • Patent number: 12015217
    Abstract: An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: June 18, 2024
    Assignee: International Business Machines Corporation
    Inventors: Tyler Jandt, Mark Plucinski, Sandra J. Shirk/Heath, Phillip V. Mann
  • Patent number: 12004314
    Abstract: This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: June 4, 2024
    Assignee: Micron Technology, Inc.
    Inventor: Anthony D. Veches
  • Patent number: 11997785
    Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: May 28, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chun-Lin Liao, Pei-Chang Huang
  • Patent number: 11997816
    Abstract: A substrate magazine for a substrate insertion system, having a frame in which several drawers for receiving in each case at least one flat substrate are arranged one above the other. Each drawer is formed by two guide rails, arranged in parallel and at a distance from one another at the same height as that of the frame, each with a sliding surface on which a substrate lying on the edge can be displaced. At least one elastically displaceable latching element is assigned to each drawer. In a first, unloaded state, the at least one latching element extends at least partially over the sliding surface of one of the guide rails of the drawer and, in a second, elastically deformed state, releases the sliding surface.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: May 28, 2024
    Assignee: ASYS AUTOMATISIERUNGSSYSTEME GMBH
    Inventors: Klaus Mang, Jurgen Lehner
  • Patent number: 11997841
    Abstract: Presented herein is an air vent including a plate, and a non-uniform array of openings extending through a thickness of the plate. The non-uniform array of openings arranged to admit a flow of cooling air through the plate. The plate and the non-uniform array of openings are arranged to attenuate electromagnetic interference (EMI) emitted through the plate.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 28, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Jianquan Lou, Alpesh Umakant Bhobe, Jerrold Mark Pianin
  • Patent number: 11997839
    Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 28, 2024
    Assignee: GE Grid Solutions LLC
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl