Patents Examined by Zhengfu J Feng
  • Patent number: 11464137
    Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 4, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Pritish R. Parida, Joel A. Silberman
  • Patent number: 11460884
    Abstract: A case for use with a portable computing device is provided. The case comprises a housing for protecting the portable computing device. The housing is configured to attach to the portable computing device. The case further comprises a multiport hub and/or a data storage device contained within the housing. The multiport hub is configured to be electrically connected to the portable computing device.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: October 4, 2022
    Assignee: BYRDBYTE CREATIONS INC.
    Inventors: Kareem Kort, Emil Fadi Kort, Maximilian Kent Dykes
  • Patent number: 11375605
    Abstract: An electronic device includes a printed board, a frame for fixing the printed board, a connector fixed at a position along one side of a front surface of the printed board, and an electrically conductive member. An indented portion is formed at a position of the one side facing the connector. The electrically conductive member has a portion arranged in the indented portion, and is expanded and contracted in a direction along the one side and a thickness direction of the printed board by an external force. The electrically conductive member has an upper surface, a lower surface, and a side surface in contact, respectively, with a shell of the connector, one surface of the frame, at least one side-surface portion which is part of a portion forming the indented portion and extends along a direction crossing the one side. The electrically conductive member is electrically connected with a ground of the printed board via the side-surface portion.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: June 28, 2022
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Tetsufumi Nozawa, Hiroyuki Katayama
  • Patent number: 11363738
    Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 14, 2022
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Jason Thompson, Marcus Ni, Voi Nguyen
  • Patent number: 11343921
    Abstract: An electronic unit includes a first case made of metal; a second case made of metal; a frame made of synthetic resin arranged inside an assembly of the first case and the second case; a relay member made of metal that is separate from the frame and includes a first connection portion electrically connected to the first case, a second connection portion electrically connected to the second case, and a coupling portion coupling the first connection portion and the second connection portion; a first screw that passes through the first case and the first connection portion from the outside of the first case and is fixed to the frame; and a second screw that passes through the second case and the second connection portion from the outside of the second case and is fixed to the frame.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: May 24, 2022
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tatsuya Sumida, Kyohei Morita
  • Patent number: 11317546
    Abstract: A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: April 26, 2022
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Akash Changarankumarath Pradeepkumar, Alfredo R. Munoz, Michael W. Degner, Edward Chan-Jiun Jih, Guangyin Lei
  • Patent number: 11310933
    Abstract: A storage device includes a casing; a drive that records data; a controller that controls a data processing of the drive; and a midplane that connects the drive to the controller, in which the midplane includes a plurality of split midplanes which are replaceable, a drive side connector is disposed on a drive side of the split midplane, and the drive side connector is connected to the drive.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: April 19, 2022
    Assignee: HITACHI, LTD.
    Inventors: Hibiki Suzuki, Yuichi Saigan, Tatsuhiko Fukazawa
  • Patent number: 11304301
    Abstract: An electrical junction box includes a conductive input busbar, a conductive output busbar electrically connectable to the input busbar, a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar, a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay, and a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay. The semiconductor relay is mounted on at least one of the input busbar and the output busbar. The input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: April 12, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Keisuke Kimura, Naoyuki Ikeda
  • Patent number: 11294434
    Abstract: This disclosure provides a switch assembly structure and a display device. The switch assembly structure comprises: a switch assembly (100); an assembly housing (400) provided with a first groove (410); a first clamping member (500) provided with a second groove (510), wherein the first clamping member (500) has a first state of being securely connected with the assembly housing (400) and a second state of being separate from the assembly housing (400); wherein, in the second state, the switch assembly (100) is able to mate with the first groove (410) or the second groove (510); and in the first state, the first groove (410) and the second groove (510) combine to form a switch mounting hole (10), and the switch assembly (100) is secured in the switch mounting hole (10) by a securable connection of the first clamping member (500) with the assembly housing (400).
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: April 5, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Jing Li
  • Patent number: 11252847
    Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: February 15, 2022
    Assignee: General Electric Company
    Inventors: Alistair Martin Waddell, Mark Aaron Chan Chan, Owen Jannis Schelenz, Michael Fernahl
  • Patent number: 11224117
    Abstract: An integrated heat exchanger has a heat exchanger within a circuit board. The circuit board can be a PCB having one or more electronic components coupled to its top-side surface. The conductive layers of the PCB include a first sub-set of electrically conductive interconnects and as second sub-set of electrically conductive interconnects. The first sub-set of conductive layers are electrically connected to each other and to the one or more electronic components. The second sub-set of conductive layers are electrically isolated from the first sub-set of conductive layers by intervening non-conductive layers such as prepreg. In this manner, the heat exchanger is electrically isolated from the one or more electronic components. The second sub-set of conductive layers include a dedicated top-side conductive layer to which a baseplate can be attached. The baseplate is also attached to the one or more electronic components via an electrically non-conductive gap filler.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: January 11, 2022
    Assignee: Flex Ltd.
    Inventors: Magnus Karlsson, Oscar Persson
  • Patent number: 11213619
    Abstract: A medical device includes a housing, a power supply, a thermally conductive mounting clamp, a heat shield, and at least one fastener. The housing includes a handle. The power supply is disposed within the housing. The thermally conductive mounting clamp is attached to an outer surface of the housing. The heat shield is disposed within the housing adjacent to the power supply. The heat shield is disposed against at least one interior surface of the handle. The at least one fastener passes through at least one opening in the housing and is in thermally conductive contact with the thermally conductive mounting clamp. Heat generated by the power supply is configured to dissipate from the power supply, through the heat shield, through the at least one fastener, and into the thermally conductive mounting clamp.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: January 4, 2022
    Assignee: ICU Medical, Inc.
    Inventors: Kevin P. McLennan, John C. Hoenninger, III
  • Patent number: 11178799
    Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 16, 2021
    Inventors: Hae-Jin Lee, Oh-Hyuck Kwon, Min Park, Jung-Je Bang, Jae-Deok Lim, Kyung-Ha Koo, Jae-Heung Ye, Chang-Tae Kim, Chi-Hyun Cho
  • Patent number: 11166396
    Abstract: Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property. The box-type vehicle-mounted control device includes a circuit board 12, a base 13, and a cover 14. In addition, a first heat radiating coating layer 31 is formed on at least one surface of the circuit board 12, and a second heat radiating coating layer 32 is formed on an inner surface of one or both of the base 13 and the cover 14 facing the first heat radiating coating layer 31.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: November 2, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki Ito, Toshiaki Ishii, Masaru Kamoshida, Hideto Yoshinari, Masato Saito, Akitoyo Konno
  • Patent number: 11153986
    Abstract: Provided is an enclosure for use in a modular storage system, the enclosure comprising a plurality of drive bays, a controller canister, an expansion canister, and a midplane connecting the drive bays to the canisters, wherein the controller canister occupies a greater volume of the enclosure than the expansion canister.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: October 19, 2021
    Assignee: International Business Machines Corporation
    Inventor: Ian David Judd
  • Patent number: 11142313
    Abstract: A flight control device includes a housing, a main control board provided in the housing, an inertial measurement unit provided in the housing and electrically connected to the main control board, and a power management unit provided at the housing and electrically connected to the main control board. The main control board, the inertial measurement unit, and the power management unit are fixedly connected to and integrated with the housing as a whole.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 12, 2021
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Yun Yu, Yin Tang, Yonggen Wang
  • Patent number: 11089710
    Abstract: Provided is an enclosure for use in a modular storage system, the enclosure comprising a plurality of drive bays, a controller canister, an expansion canister, and a midplane connecting the drive bays to the canisters, wherein the controller canister occupies a greater volume of the enclosure than the expansion canister.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: August 10, 2021
    Assignee: International Business Machines Corporation
    Inventor: Ian David Judd
  • Patent number: 11064604
    Abstract: A flexible printed circuit board assembly (PCBA) for a conformal wearable battery (CBB) includes attachment sections for a plurality of battery cells that are arranged in a grid-like pattern on a same side of the flexible PCBA. The flexible PCBA is configured to fold along a bend axis so that the flexible PCBA is folded approximately in half. To reduce mechanical stresses placed on the flexible PCBA when folding the flexible PCBA along the bend axis, the flexible PCBA includes a plurality of cut-outs dispersed along the bend axis and parallel to adjacent battery cells. The CWB is configured to flex during use. The flexible PCBA includes a plurality of cut-outs disposed perpendicular to the bend axis, between adjacent rows of battery cells, and on the bend axis to relieve mechanical stresses applied to a bent portion of the flexible PCBA when the CWB is flexed during use.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: July 13, 2021
    Assignee: Inventus Power, Inc.
    Inventors: Elijah Brett Goldin, Anvin Joe Manadan
  • Patent number: 11019753
    Abstract: In an example, a server system is provided. The server system includes a frame including a support structure and a server supported by the support structure. The server system includes an actuator configured to cause the server to transition from a first position to a second position to increase exposure of the server to airflow to transfer heat away from the server via convection. The actuator is also configured to cause the server to transition from the second position to the first position to decrease exposure of the server to the airflow.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: May 25, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Sean Michael James, Eric C. Peterson, Michael Rees Helsel, Nicholas Andrew Keehn
  • Patent number: 11013153
    Abstract: The present invention provides an inverter including: a middle frame in which a main circuit is disposed; an upper case disposed above the middle frame and configured to accommodate the main circuit; and a lower case disposed under the middle frame and having a first vent hole formed in one side surface thereof; a fan disposed at the other side surface of the lower case facing the first vent hole; a heat sink interposed between the first vent hole and the fan; an auxiliary housing disposed under the lower case, configured to accommodate an auxiliary circuit, and including a second vent hole in at least one side surface thereof; and a controller disposed in the main circuit of the auxiliary circuit.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: May 18, 2021
    Assignee: LSIS CO., LTD.
    Inventor: Soo-Yong Hwang