Abstract: Disclosed is a flexible display device. The flexible display device includes a housing, a winding shaft, a flexible display panel, a supporting member, a separating member and a pressing member. The housing has an opening provided thereon. The winding shaft is rotatably provided in the housing. The flexible display panel has one end connected to the winding shaft and another opposite end extending out of the housing through the opening. The supporting member has one end connected to the winding shaft and another opposite end extending out of the housing through the opening. The separating member is provided on the housing to separate the flexible display panel and the supporting member partially. The pressing member is provided on the housing to connect the flexible display panel and the supporting member.

Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

Abstract: A device includes a micro-organic light emitting diode (?-OLED) display panel and an electronic component. An electrical connector electrically couples the ?-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the ?-OLED display panel. The standoff physically couples the electronic component and the ?-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the ?-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the ?-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.

Abstract: A cooling module includes: a fan having a fan housing with an intake port and an exhaust port; a fin that faces the exhaust port of the fan; a heat pipe connected to a surface of the fin; and a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin to be parallel with the heat pipe, so that the one edge is disposed between the heat pipe and the fin.

Abstract: An electronic device and a control method thereof are disclosed. The electronic device includes a screen, where the screen includes a bendable flexible screen portion; and a support assembly, where the support assembly is disposed on a back side of the flexible screen portion and configured to support the flexible screen portion, and the support assembly is switchable between a first state and a second state. In a case that the support assembly is in the first state, the flexible screen portion is curved; and in a case that the support assembly is in the second state, the flexible screen portion is flat.

Abstract: A display assembly, communications box, and related methods are disclosed. A display assembly includes an electronic display subassembly attached to a mounting structure. A communications box attached to the mounting structure has an interior space for electronic equipment which is located above, and spaced apart from, the electronic display subassembly. A gas permeable fabric panel of the communications box occupies at least a majority of a side of the communications box and is gas permeable, such as to allow airflow to electronics contained therein.

Abstract: A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.

Abstract: An electronic device has a curved screen. An arc-shaped transition edge is disposed on both sides of a corner of the curved screen, and a black border is bent to a side surface of the electronic device, so that a full-screen effect without a black border is achieved, and the fringe of the curved screen is continuous and smooth as a whole.

Abstract: An electronic component system includes a chassis that includes a body, an electrically isolated portion, and an insulator disposed between the electrically isolated portion and the body, wherein the insulator is comprised of a first electrically insulating material. The electronic component system further includes a first electronic component mounted to the electrically isolated portion, and a second electronic component mounted to the body and electrically connected to the first electronic component.

Abstract: Examples described herein relate to a system. The system can include a container that contains fluid to provide two phase immersion liquid cooling (2PILC) for a system within the container. The container can enclose a first circuit board with a first side of the first circuit board is conductively coupled to at least one device. The container can enclose a motherboard conductively coupled to a second side of the first circuit board with a first side of the motherboard is conductively coupled to the second side of the first circuit board. The motherboard can include at least four edges. Connectors can conductively connect the motherboard with a second circuit board. The second circuit board can include at least four edges and an edge of the motherboard is oriented approximately 90 degrees to an edge of the second circuit board. At least one device can include one or more of: a processor, memory device, accelerator device, or network interface.

Abstract: A vapor chamber includes a first base plate (12), a second base plate (13), and a capillary structure (15). The first base plate (12) and the second base plate (13) are disposed in a stacked manner and fastened to each other, and together form a cavity (11). The capillary structure is disposed on an inner wall of the cavity (11) and a surface of at least one support pillar (120) between the first base plate (12) and the second base plate (13), and the capillary structure (15) is configured to provide capillary force for returning liquid to a working medium. A reinforcement table (127) located in the cavity (11) is disposed between the first base plate (12) and the second base plate (13).

Abstract: Electronic device such as a camera for a vehicle, including: a supporting frame, a main electronic substrate, provided with at least one electric or electronic component or circuit and coupled to the supporting frame; a secondary electronic substrate, provided with at least one electric or electronic component or circuit and coupled to the supporting frame; wherein the supporting frame has at least one main projecting tab and at least one secondary projecting tab, each capable to occupy a non-twisted position or a twisted position, wherein the main projecting tab, when in the twisted position, is providing an attachment of the main electronic substrate to the supporting frame, and wherein the secondary projecting tab, when in the twisted position, is providing an attachment of the secondary electronic substrate to the supporting frame.

Abstract: An electronic device includes a housing, first and second wiring substrates disposed to face each other, a fixing member that is made of an electrically conductive member and fixes the first and second wiring substrates to each other, and an external connection terminal provided in the housing. The fixing member has first and second fixing portions, and is interposed between the first and second wiring substrates. The fixing member is electrically conductive to a first electrically conductive portion provided in the first wiring substrate by fixing the first fixing portion to the first wiring substrate. The fixing member is electrically conductive to a second electrically conductive portion provided in the second wiring substrate by fixing the second fixing portion to the second wiring substrate. The external connection terminal is electrically conductive to the fixing member by electrically connecting the fixing member to the external connection terminal.

Abstract: A medical device includes a housing, a power supply, a thermally conductive mounting clamp, a heat shield, and at least one fastener. The housing includes a handle. The power supply is disposed within the housing. The thermally conductive mounting clamp is attached to an outer surface of the housing. The heat shield is disposed within the housing adjacent to the power supply. The heat shield is disposed against at least one interior surface of the handle. The at least one fastener passes through at least one opening in the housing and is in thermally conductive contact with the thermally conductive mounting clamp. Heat generated by the power supply is configured to dissipate from the power supply, through the heat shield, through the at least one fastener, and into the thermally conductive mounting clamp.

Abstract: A controller for an e-machine of a turbomachine including a support structure, a printed circuit board, and a fastener arrangement that retains the printed circuit board on the support structure, the fastener arrangement including a resilient member that resiliently biases the printed circuit board towards the support structure.

Abstract: An electronic control device includes: an electronic circuit board on which an electronic component is packaged; and a housing in which the electronic circuit board is contained, and which is composed of a case and a base. The electronic control device includes: a plurality of claws which is provided in the case of the housing and fixes the electronic circuit board; a fixing groove which is formed in the case on the rear side of the claws, and into which a peripheral edge portion of the base is close-fitted; a cutout which is formed on the rear side of the claws of the housing and is communicated with the fixing groove; and adhesive which is filled on the rear side of the claws via the fixing groove and the cutout.

Abstract: The present disclosure relates to the field of printed circuit board technologies. A printed circuit board with good heat dissipation performance is provided and includes a substrate serving as a board body of the printed circuit board, a heating component embedded in the substrate, and a cooling liquid channel disposed in the substrate. The cooling liquid channel is disposed in the printed circuit board, and passes around the heating component to exchange heat with the heating component, so that a heat dissipation path is shortened and heat dissipation efficiency is improved, thereby quickening heat dissipation of the printed circuit board, and prolonging a service life of the printed circuit board.

Abstract: An ejector may be provided. The ejector may comprise a pawl, a trigger, and a handle. The pawl may be configured to rotate relative to a line card about a first axis. The pawl may comprise a pawl concavity. The trigger may be configured to rotate relative to the line card about a second axis. The trigger may comprise a trigger catch and a trigger lever. The trigger catch may be configured to engage the pawl concavity. The handle may be connected to the pawl and configured to rotate relative to the pawl about a third axis. The trigger catch may be configured to engage the pawl concavity to inhibit rotation of the pawl about the first axis. The trigger catch may be configured to disengage the pawl concavity and to allow rotation of the pawl about the first axis.

Abstract: An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).