Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

Abstract: A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.

Abstract: An integrated air cooling and arc resistant system is provided for a voltage drive. The system comprises a cabinet including a back, an upper portion and a lower portion. The system further comprises a plurality of power cells disposed in the cabinet. The system further comprises a central chimney vertically disposed in the cabinet. The system further comprises a transformer disposed in the cabinet and being underneath the plurality of power cells. The transformer has a top end and a bottom end. The system further comprises a vertical plenum disposed in the back of the cabinet. The vertical plenum is configured to flow cool air passing from the plurality of power cells towards the bottom end of the transformer.

Abstract: A power converter for a railroad vehicle includes a first fin and a second fin having outer shapes different from each other as viewed in an alignment direction. On both ends of the first fin and the second fin in a running direction, non-overlapping regions in which the first fin and the second fin do not face each other in the alignment direction are located so as to sandwich an overlapping region, in which the first fin and the second fin face each other in the alignment direction, therebetween.

Abstract: A leaf spring is disposed between a circuit board and a upper shield. The leaf spring biases a heat sink toward the circuit board through a connecting member. The leaf spring is not electrically connected to the upper shield. According to this structure, an integrated circuit and the heat sink can be contacted with each other with certainty. Further, generation of unnecessary radiation can be suppressed effectively.

Abstract: An information handling system includes a triangular chassis, a plurality of graphics cards, and a plurality of air movers. An air stream of a first air mover may be axially aligned with the graphics cards and the first air mover may to direct the air stream into a first zone of the information handling systems including the graphics cards, the air stream being parallel to a longitudinal axis of the graphics cards. The first air mover may be a fan and the air flow may be laminar. A second zone of the information handling systems may include a CPU. The first zone may include a power supply unit. The air movers may be controlled independently, enabling independent control of a temperature in the first zone and a temperature in the second zone.

Abstract: An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

Abstract: A data center includes two or more rack computing systems and an air handling system. The rack computing systems may each include racks and computing devices mounted in the rack. The air handling system includes one or more air moving devices external to the one or more racks. The air moving devices create a negative pressure relative to ambient air at air inlets to the racks to draw air from the inlets and through computing devices in the racks.

Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.

Abstract: Devices, systems, and methods for cooling an autonomous vehicle computing system are provided. A modular cooling device can include a cooling baseplate and one or more modular heat frames. The cooling baseplate can include at least one planar cooling surface, an inlet configured to receive a cooling fluid, an outlet, and at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the at least one planar cooling surface. Each modular heat frame can be configured to house at least one autonomous vehicle computing system component, be coupled parallel to the at least one planar cooling surface, and transfer heat from the at least one autonomous vehicle computing system component housed by the modular heat frame to the cooling baseplate.

Abstract: Embodiments herein relate to hydraulic bladders to provide a force against an integrated circuit package to be located between the hydraulic bladder and a system board. In various embodiments, a hydraulic force generator may include a block to be coupled with a system board and a hydraulic bladder to be located between the block and the system board, where the hydraulic bladder, in response to pressurization, is to provide a force against an integrated circuit package to be located between the hydraulic bladder and the system board. Other embodiments may be described and/or claimed.

Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.

Abstract: A power conversion device such that heat dissipation can be improved is obtained. The power conversion device includes a power conversion circuit unit that converts direct current into alternating current using a semiconductor switching element, a heatsink on which the power conversion circuit unit is mounted, and which has a first passage through which a cooling medium is caused to pass, and a frame body that houses the power conversion circuit unit, seals the power conversion circuit unit between the frame body and the heatsink, and has a second passage through which a cooling medium is caused to pass, wherein the first passage and second passage are connected at an interface between the heatsink and frame body, thereby configuring a cooling passage.

Abstract: A chassis having embedded air jets for cooling a computer device is disclosed. The chassis includes a pair of side walls defining a front end and a rear end. The chassis includes a bottom plate for mounting an electronic component. Ducts are supported by each of the side walls. The ducts include a front opening and a rear opening. Two static fans are coupled to the rear openings of the ducts. A nozzle frame is located at the front end of the chassis. The nozzle frame includes a lateral nozzle bar emitting an air jet generated from the front openings of the ducts.

Abstract: An electronic device is immersed in a coolant in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, storage units attached to a first surface of the metal board and a second surface opposite the first surface, and a backplane including connectors for electrically connecting the respective storage units, attached orthogonally to the first surface of the metal board, and the second surface opposite the first surface. The metal board includes a primary member including cuts in a width direction for fixing support plates that support the storage units to the primary member, and a secondary member includes pawls inserted into slits in the backplane, and fixed to the primary member. The support plates include holes for passage of the coolant.

Abstract: A heat exchanger includes a chassis, and a mounting opening and an outer outlet formed at the bottom of the chassis. The cooling core is installed in the chassis and disposed above the mounting opening. The external circulation fan module is installed from the mounting opening into the chassis. The cover covers the mounting opening. External air flows through the cooling core and exchanges heat with the cooling core to simplify the method of mounting the external circulation fan module.

Abstract: A hardware monitoring system and a method therefor are disclosed. The hardware monitoring method includes: sensing a first temperature value of a first temperature area by a first temperature sensor and sensing a second temperature value of a second temperature area by a second temperature sensor; reading and compensating for the second temperature value by a complex programmable logic device (CPLD); and reading the first temperature value and the compensated second temperature value and controlling heat dissipation of the computer system based on the first temperature value and the compensated second temperature value, by a hardware monitor. In this method, temperature values of different areas are sensed with multiple temperature sensors and are read and modified by the CPLD, thereby allowing temperature compensation for the temperature sensors and addressing the problem of inability to individually compensate for temperature values of different areas.

Abstract: A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.

Abstract: A data center cooling system configured to cool one or more components of a data center thereby enabling a data center to be maintained at a higher overall temperature while still providing sufficient cooling to the components housed in the data center is disclosed. By maintaining the data center at a higher overall temperature, significant operational costs are realized due to savings in power costs. The data center cooling system may include one or more turbo-expanders having a rotary turbine positioned within a turbo-expander housing in which compressed air expands and drives the rotary turbine. The cooled expanded air is heated passing through a thermal transfer system that pulls heat from the data center component. The air is further heated passing through a brake system that generates heat by applying resistance to a shaft coupled to the rotary turbine. The heated air is exhausted outside of the data center.

Abstract: An apparatus is described for suppressing EMI emissions in an electrical device. In one example, the apparatus includes absorbing material surrounding at least a portion of an electrical component and electrically conductive material configured to contact at least one side of the absorbing material.