Patents Examined by Zhuo H. Li
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Patent number: 12293086Abstract: An apparatus and method for providing high throughput memory responses are provided. The apparatus includes a memory device including a plurality of memory arrays, a memory controller configured to control the memory device, the memory controller having a read queue, a write queue, and an address match circuit, and a data output circuit. The memory controller receives a read request, searches the write queue for a write address that matches a read address of the read request, and sends data associated with the write address from the write queue to the data output circuit without accessing the memory device when the write address matches the read address, the write address that matches the read address being a target address. The data output circuit outputs the data associated with the target address to an external device.Type: GrantFiled: May 11, 2023Date of Patent: May 6, 2025Inventors: Shashank Nemawarkar, Bipul C. Paul
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Patent number: 12282657Abstract: A data storage device includes a controller. The controller includes a controller memory buffer (CMB). The controller is configured to associate both the CMB and a host memory buffer (HMB) of a host device as a single buffer pool with a plurality of CMB buffers and a plurality of HMB buffers. The controller is further configured to allocate either a CMB buffer or a HMB buffer based on a tradeoff between latency and performance between using the CMB or using the HMB to store data. By leveraging the benefits of both the CMB and the HMB to store data, the overall performance of the data storage device may be improved.Type: GrantFiled: September 20, 2022Date of Patent: April 22, 2025Assignee: Sandisk Technologies, Inc.Inventor: Shay Benisty
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Patent number: 12277319Abstract: An in-memory computing device includes in some examples a two-dimensional array of memory cells arranged in rows and columns, each memory cell made of a nine-transistor current-based SRAM. Each memory cell includes a six-transistor SRAM cell and a current source coupled by a switching transistor, which is controlled by input signals on an input line, to an output line associates with the column of memory cells the memory cell is in. The current source includes a switching transistor controlled by the state of the six-transistor SRAM cell, and a current regulating transistor adapted to generate a current at a level determined by a control signal applied at the gate. The control signal can be set such that the total current in each output line is increased by a factor of 2 in each successive column of the memory cells.Type: GrantFiled: May 22, 2023Date of Patent: April 15, 2025Assignee: Taiwan Semiconductor Manufacturing Company, LtdInventors: Yu-Der Chih, Chia-Fu Lee, Jonathan Tsung-Yung Chang
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Patent number: 12271297Abstract: A system and related method reduce public cloud provisioning latencies using one or more processors. The method comprises, prior to receiving a volume provisioning request from a user, creating a pool of pre-provisioned generic volumes. The method further comprises receiving the request from the user to provision a volume from the pool, and then determining that a pre-provisioned generic volume is available for customization based on the request. Responsive to the determination, the method executes the actions comprising customizing the pre-provisioned generic volume based on the request, creating a custom volume, and providing the customized pre-provisioned volume to the user.Type: GrantFiled: June 12, 2023Date of Patent: April 8, 2025Assignee: International Business Machines CorporationInventors: Kapil Jain, Patrick Sullivan, Michael Behrendt
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Patent number: 12248679Abstract: Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a common substrate and a first integrated circuit (IC) chip disposed on the common substrate. The first IC chip includes a first memory interface. A second IC chip is disposed on the common substrate and includes a second memory interface. A first memory device is disposed on the common substrate and includes memory and a first port coupled to the memory. The first port is configured for communicating with the first memory interface of the first IC chip. A second port is coupled to the memory and communicates with the second memory interface of the second IC chip. In-memory processing circuitry is coupled to the memory and controls transactions between the first memory device and the first and second IC chips.Type: GrantFiled: January 21, 2024Date of Patent: March 11, 2025Assignee: Eliyan CorporationInventors: Ramin Farjadrad, Syrus Ziai
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Patent number: 12242721Abstract: Disclosed Methods, Apparatus, and articles of manufacture to profile page tables for memory management are disclosed. An example apparatus includes a processor to execute computer readable instructions to: profile a first page at a first level of a page table as not part of a target group; and in response to profiling the first page as not part of the target group, label a data page at a second level that corresponds to the first page as not part of the target group, the second level being lower than the first level.Type: GrantFiled: March 26, 2021Date of Patent: March 4, 2025Assignee: Intel CorporationInventors: Aravinda Prasad, Sandeep Kumar, Sreenivas Subramoney, Andy Rudoff
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Patent number: 12242726Abstract: Methods, systems, and devices for capability messaging for memory operations across banks with multiple page access are described. Techniques are described for a memory system to use a same bank for first and second access operations of data associated with an access command. The data corresponding to the second access operation may be communicated after the data corresponding to the first access operation on the same data channels. Techniques are further described for including one or more additional access commands with the access command that use other banks. Techniques are further described for interleaving data sets communicated as a result of the access commands and for abutting data sets based on parameters obtained by the memory device. Techniques are further described for the generation and performance of internal access commands in accordance with a data transfer type indicated by a host system.Type: GrantFiled: August 22, 2022Date of Patent: March 4, 2025Assignee: Micron Technology, Inc.Inventor: Sujeet V. Ayyapureddi
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Patent number: 12229410Abstract: A solid state drive management solution is provided, and includes: detecting that a usage status of a first storage space of an SSD meets a preset condition, where the first storage space works in a first mode; and enabling, based on the detection result, the first storage space to work in a second mode to obtain a second storage space, where a quantity of bits that can be stored in a cell in the first storage space is greater than a quantity of bits that can be stored in a cell in the second storage space.Type: GrantFiled: September 21, 2022Date of Patent: February 18, 2025Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Jianhua Zhou
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Patent number: 12223167Abstract: Provided is a method for cleaning residual paths on a host end, including: acquiring device information of subordinate devices of a plurality of paths; determining, according to the device information, whether links corresponding to the subordinate devices are all abnormal; acquiring a global identification number and connection information of each subordinate device in a case that the links corresponding to the subordinate devices are all abnormal; when the global identification number is not null and the connection information is successfully acquired, querying a mapping state of a volume corresponding to the global identification number and a mapped host according to the global identification number and the connection information; and when the volume is not in the mapping state or the mapped host is not a target host, deleting the plurality of paths and the subordinate devices.Type: GrantFiled: October 29, 2021Date of Patent: February 11, 2025Assignee: INSPUR SUXHOU INTELLIGENT TECHNOLOGY CO., LTD.Inventor: Zhenguang Zhang
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Patent number: 12223172Abstract: Mechanisms for controlling background wear leveling are provided, including: increasing a first counter; comparing the first counter to a first threshold; and in response to the first counter meeting the first threshold: decreasing the first counter by a value of the first threshold; and triggering background wear leveling. In some embodiments, the first counter is increased in response to receiving a write trigger. In some embodiments, the first threshold is based upon a page size and a number of planes of physical media of an SSD. In some embodiments, the mechanisms further comprise: incrementing a second counter in response to receiving a host write trigger; comparing the second counter to a second threshold; and in response to the second counter meeting the second threshold, decreasing the second counter by the second threshold, wherein the increasing the first counter is performed in response to the second counter meeting the second threshold.Type: GrantFiled: December 28, 2022Date of Patent: February 11, 2025Assignee: SK hynix NAND Product Solutions CorporationInventors: David G. Dreyer, David J. Pelster, Mark Anthony Sumabat Golez, Bhargavi Govindarajan
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Patent number: 12216579Abstract: Disclosed embodiments relate to atomic memory operations. In one example, an apparatus includes multiple processor cores, a cache hierarchy, a local execution unit, and a remote execution unit, and an adaptive remote atomic operation unit. The cache hierarchy includes a local cache at a first level and a shared cache at a second level. The local execution unit is to perform an atomic operation at the first level if the local cache is a storing a cache line including data for the atomic operation. The remote execution unit is to perform the atomic operation at the second level. The adaptive remote atomic operation unit is to determine whether to perform the first atomic operation at the first level or at the second level and whether to copy the cache line from the shared cache to the local cache.Type: GrantFiled: December 25, 2020Date of Patent: February 4, 2025Assignee: Intel CorporationInventors: Carl J. Beckmann, Samantika S. Sury, Christopher J. Hughes, Lingxiang Xiang, Rahul Agrawal
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Patent number: 12210456Abstract: A memory is described. The memory includes row buffer circuitry to store a page. The page is divided into sections, wherein, at least one of the sections of the page is to be sequestered for the storage of meta data, and wherein, a first subset of column address bits is to: 1) define a particular section of the page, other than the at least one sequestered sections of the page, whose data is targeted by a burst access; and, 2) define a field within the at least one of the sequestered sections of the page that stores meta data for the particular section.Type: GrantFiled: March 26, 2021Date of Patent: January 28, 2025Assignee: Intel CorporationInventor: Kuljit S. Bains
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Patent number: 12204840Abstract: Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a logic base die for inclusion in a chiplet-based multi-chip module (MCM) is disclosed. The logic base die includes a first port interface for coupling to an interface beachfront of a first integrated circuit (IC) chiplet. The first port interface is to receive data of a first bandwidth via the interface beachfront via a first set of traces formed in a micro-bump advanced-package routing layer. A memory port provides a first portion of the first bandwidth to at least a first memory stack configured for positioning on the logic base die. A second port interface couples to the first port interface and utilizes a second portion of the first bandwidth.Type: GrantFiled: May 2, 2024Date of Patent: January 21, 2025Assignee: Eliyan CorporationInventor: Ramin Farjadrad
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Patent number: 12204759Abstract: Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a common substrate and a first integrated circuit (IC) chip disposed on the common substrate. The first IC chip includes a first memory interface. A second IC chip is disposed on the common substrate and includes a second memory interface. A first memory device is disposed on the common substrate and includes memory and a first port coupled to the memory. The first port is configured for communicating with the first memory interface of the first IC chip. A second port is coupled to the memory and communicates with the second memory interface of the second IC chip. In-memory processing circuitry is coupled to the memory and controls transactions between the first memory device and the first and second IC chips.Type: GrantFiled: October 17, 2023Date of Patent: January 21, 2025Assignee: Eliyan CorporationInventors: Ramin Farjadrad, Syrus Ziai
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Patent number: 12190038Abstract: Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a package substrate and an interposer disposed on a portion of the package substrate. A first integrated circuit (IC) chip is disposed on the interposer. A first memory device is disposed on the interposer and includes a first port interface including an interposer-compliant mechanical interface for coupling to the first IC chip via a first set of traces formed in the interposer. A second port interface includes a non-interposer-compliant mechanical interface for coupling to an off-interposer device. Transactions between the first IC chip and the off-interposer device pass through the first port interface and the second port interface of the first memory device.Type: GrantFiled: January 23, 2024Date of Patent: January 7, 2025Assignee: Eliyan CorporationInventor: Ramin Farjadrad
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Patent number: 12189978Abstract: Embodiments of systems and methods for a Compression Attached Memory Module (CAMM) for Low-Power Double Data Rate (LPDDR) memories are described. In an illustrative, non-limiting embodiment, an Information Handling System (IHS) may include: a compression Dual In-Line Memory Module (cDIMM) connector coupled to a motherboard; and a memory module coupled to the cDIMM connector, where the memory module comprises an LPDDR device coupled to a top surface of the memory module and accessible via surface contact connections disposed on a bottom surface of the memory module.Type: GrantFiled: March 28, 2022Date of Patent: January 7, 2025Assignee: Dell Products L.P.Inventors: Arnold Thomas Schnell, Joseph Daniel Mallory
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Patent number: 12175116Abstract: In one implementation a vector processor gather/scatter apparatus comprises a plurality of vector ports, and a random access memory, where the plurality of vector ports are in communication with the random access memory, and where one or more of the plurality of vector ports uses one or more of an address register and one or more of a stride register in communication with the random access memory to allow the gather/scatter of random access memory contents.Type: GrantFiled: February 11, 2022Date of Patent: December 24, 2024Assignee: Microchip Technology Inc.Inventor: Christopher I. W. Norrie
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Patent number: 12169651Abstract: Disclosed are various approaches for decreasing the latency involved in reading pages from swap devices. These approaches can include setting a first queue in the plurality of queues as a highest priority queue and a second queue in the plurality of queues as a low priority queue. Then, an input/output (I/O) request for an address in memory can be received. The type of the I/O request can be determined, and then the I/O request can be assigned to the first queue or the second queue of the swap device based at least in part on the type of the I/O request.Type: GrantFiled: July 9, 2021Date of Patent: December 17, 2024Assignee: VMware LLCInventors: Emmanuel Amaro Ramirez, Marcos Kawazoe Aguilera, Pratap Subrahmanyam, Rajesh Venkatasubramanian
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Patent number: 12165691Abstract: The present disclosure includes apparatuses and methods for performing operations by a memory device in a self-refresh state. An example includes an array of memory cells and a controller coupled to the array of memory cells. The controller is configured to direct performance of compute operations on data stored in the array when the array is in a self-refresh state.Type: GrantFiled: May 26, 2023Date of Patent: December 10, 2024Inventors: Perry V. Lea, Glen E. Hush
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Patent number: 12159043Abstract: In embodiments, a system includes a first and a second processing unit, a memory, and a firewall device. The first processing unit operates in a secure mode and generates memory access requests having a secure level. The second processing unit operates in a non-secure mode and generates memory access requests having a non-secure level. The memory includes a first memory area that can be shared between the first and second processing units. The firewall device includes a first firewall circuit with a first configuration authorizing access to the first memory area in the presence of a secure or non-secure level access request. The firewall circuit includes a second configuration prohibiting access to the first memory area in the presence of a secure level access request and authorizing access to the first memory area only in the presence of a non-secure level access request.Type: GrantFiled: November 17, 2022Date of Patent: December 3, 2024Assignee: STMicroelectronics (Grand Ouest) SASInventors: Loic Pallardy, Michel Jaouen