Patents by Inventor A J Lambert

A J Lambert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10832859
    Abstract: A hardened inductive device and systems and methods for protecting the inductive device from impact is provided. The inductive device is hardened with protective coating and/or an armor steel housing. The hardened inductive device is protected from impact by an object such as a bullet and leakage of dielectric fluid is prevented. Acoustic and vibration sensors are provided to detect the presence and impact, respectively, of an object in relation to the inductive device housing. The measurements of the acoustic and vibration sensors are compared to thresholds for sending alarms to the network control center and initiating shut-down and other sequences to protect the active part. The acoustic sensor results are utilized to determine the location of origin of the projectile.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: November 10, 2020
    Assignee: ABB Schweiz AG
    Inventors: George K. Frimpong, Alberto Prieto, Mirrasoul J. Mousavi, James Stoupis, Ed G teNyenhuis, Jeremy R. Schueler, Andrew Bleich, Elizabeth D. Sullivan, Claude J. Lambert, Petter A. Fiskerud, Andrew J. Wall, Gary C. McLeish, Thomas McDonald, Ronald A. Kupiec
  • Publication number: 20200303822
    Abstract: In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.
    Type: Application
    Filed: September 29, 2017
    Publication date: September 24, 2020
    Inventors: Jimin YAO, Shawna M. LIFF, William J. LAMBERT, Zhichao ZHANG, Robert L. SANKMAN, Sri Chaitra J. CHAVALI
  • Publication number: 20200290001
    Abstract: A structural improvement for microwave-assisted high temperature high-pressure chemistry vessel systems is disclosed that among other advantages offers dynamic venting and resealing while a reaction proceeds and eliminates the risk of cross contamination associated with systems that use a common pressurized chamber. The improvement includes a relatively thin-walled disposable liner cylinder that includes one closed end and one open end defining a mouth, and a liner cap positioned in the mouth of the rigid liner cylinder for closing the rigid liner cylinder. The liner cap includes a depending column that engages the inside diameter of the rigid liner cylinder, and a disk at one end of the depending column having a diameter sufficient to rest upon the rigid liner cylinder without falling into the rigid cylinder liner so that the cylindrical liner cap can rest in the rigid liner cylinder at the mouth of the rigid liner cylinder.
    Type: Application
    Filed: March 14, 2019
    Publication date: September 17, 2020
    Applicant: CEM Corporation
    Inventor: Joseph J. Lambert
  • Publication number: 20200278349
    Abstract: Detecting a pathogen may include introducing a nonmagnetic metal into the sample where the nonmagnetic metal includes an antibody that is specific to the pathogen to form a complex of the nonmagnetic metal and the pathogen, removing the nonmagnetic metal that is not complexed with the pathogen from the sample, and detecting the presence of the nonmagnetic metal in the sample where the presence of the nonmagnetic metal indicates the presence of the pathogen.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 3, 2020
    Inventors: Ugochukwu Chinedu Nze, Himanshu Jayant Sant, Bruce Kent Gale, Michael Beeman, Christopher J. Lambert
  • Patent number: 10758880
    Abstract: An instrument system for acid digestion is disclosed. The instrument includes a heating block, a reaction vessel formed of a polymer that is resistant to acid and other chemical attack at temperatures above 150° C. and that has a structure (thickness, etc.) sufficient to withstand pressures above atmospheric, a metal sleeve surrounding the polymeric reaction vessel, and an opening in the block that has a cross-section corresponding to the cross-section of the metal sleeve.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: September 1, 2020
    Assignee: CEM Corporation
    Inventors: Michael J. Collins, Jr., Joseph J. Lambert, Matt Beard, Dwight D. Watkins, Timothy A. Zawatsky, Taylor M. Hostak
  • Publication number: 20200271555
    Abstract: Sample preparation can include obtaining a sample in the form of a liquid mixture and forcing the liquid mixture through a cavitation chamber at an optimal pressure for separating pathogens from particles in the mixture without fragmenting at least 30% of the pathogens. Apparatuses used for sample preparation methods can include a fluid circuit, a cavitation chamber incorporated into the fluid circuit and having a channel with first, second, and third cross-sectional areas, the second cross-sectional area being downstream of and smaller than the first cross-sectional with respect to fluid flow through the fluid circuit and the third cross-sectional area being larger than and downstream of the second cross-sectional area with respect to fluid flow through the fluid circuit. The apparatus can include a pump in fluid communication with the cavitation chamber and a pressure sensor positioned upstream of the cavitation chamber.
    Type: Application
    Filed: February 27, 2020
    Publication date: August 27, 2020
    Inventors: Ugochukwu Chinedu Nze, Himanshu Jayant Sant, Bruce Kent Gale, Christopher J. Lambert, Dhruv Patel, Michael Beeman
  • Patent number: 10741536
    Abstract: An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: August 11, 2020
    Assignee: Intel Corporation
    Inventors: Yongki Min, Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala, Clive R. Hendricks
  • Publication number: 20200252138
    Abstract: An acoustic communication and messaging system includes an acoustic transducer adapted for communicating signals via a subsurface acoustic medium, and a controller in communication with the acoustic transducer. The controller can include one or more of a signal programmer adapted for defining a limited set of coded signals; e.g., where each of the coded signals selected for low cross-correlation with other coded signals in the limited set, and a signal encoder adapted for defining a set of messages or commands; e.g., where each message is associated with a selected one of the coded signals in the limited set. The acoustic transducer can be adapted to transmit the coded signals associated with identified messages via the subsurface acoustic medium. An interface can be provided for identifying messages for coding and transmission, and for reporting decoded commands to a user.
    Type: Application
    Filed: February 4, 2020
    Publication date: August 6, 2020
    Inventors: Dale J. Lambert, Robert H. Kemp, Nicholas Muguira
  • Publication number: 20200203470
    Abstract: A conductive metal pillar is disposed within a composite material used as a die overflow material to form inductor on a module substrate. In situ fabrication of inductors on a module substrate enable customized selection of an inductance value, thus enabling inductors (and other similar peripheral devices) to be placed on a module substrate rather than on a motherboard. Furthermore, these in situ fabricated peripheral devices may also be used to remove excess heat produced by a die because the magnetic particles of the composite material are also thermally conductive. Furthermore, electrically conductive elements of the peripheral devices can be placed in contact with the die and/or integrated heat spreader.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 25, 2020
    Applicant: INTEL CORPORATION
    Inventors: Kedar Dhane, Malavarayan Sankarasubramanian, Yongki Min, William J. Lambert
  • Patent number: 10679787
    Abstract: A hardened inductive device and systems and methods for protecting the inductive device from impact is provided. The inductive device is hardened with protective coating and/or an armor steel housing. The hardened inductive device is protected from impact by an object such as a bullet and leakage of dielectric fluid is prevented. Acoustic and vibration sensors are provided to detect the presence and impact, respectively, of an object in relation to the inductive device housing. The measurements of the acoustic and vibration sensors are compared to thresholds for sending alarms to the network control center and initiating shut-down and other sequences to protect the active part. The acoustic sensor results are utilized to determine the location of origin of the projectile.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: June 9, 2020
    Assignee: ABB Schweiz AG
    Inventors: George K. Frimpong, Alberto Prieto, Mirrasoul J. Mousavi, James Stoupis, Ed G teNyenhuis, Jeremy R. Schueler, Andrew Bleich, Elizabeth D. Sullivan, Claude J. Lambert, Petter A. Fiskerud, Andrew J. Wall, Gary C. McLeish, Thomas McDonald, Ronald A. Kupiec
  • Patent number: 10677696
    Abstract: An extraction method for preparing samples for analytical analysis is disclosed. The method includes the steps of placing a sample matrix containing one or more analytes in a heat conductive sample cup, positioning the heat conductive sample cup in a pressure-resistant reaction chamber, dispensing solvent into the heat conductive sample cup, dispersing the solvent and the sample matrix in the sample cup in the reaction chamber, heating the sample matrix and the extraction solvent in the heat conductive sample cup in the reaction chamber to a temperature at which the dispensed solvent generates an above-atmospheric pressure, and releasing the extraction solvent extract from the sample cup at atmospheric pressure.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: June 9, 2020
    Assignee: CEM Corporation
    Inventors: Michael J. Collins, Sr., Joseph J. Lambert, Matthew N. Beard, Paul C. Elliott
  • Patent number: 10658765
    Abstract: A method of forming a planar antenna on a first substrate. An antenna feedline is formed on a peelable copper film of a carrier. A dielectric with no internal conductive layer is formed on the feedline. A planar antenna is formed on one of two parallel sides of the dielectric and a feed port is formed adjacent the other parallel side. The feedline connects the antenna with the feed port. One plane of the planar antenna is configured for perpendicular attachment to a second substrate. The feedline is connected to the planar antenna by a via through the dielectric. The peelable copper is removed and the structure is etched to produce the planar antenna on the substrate. Two planar antennas on substrates can be perpendicularly attached to another substrate to form side-firing antennas.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: May 19, 2020
    Assignee: Intel Corporation
    Inventors: Sri Chaitra Jyotsna Chavali, Sanka Ganesan, William J. Lambert, Debendra Mallik, Zhichao Zhang
  • Patent number: 10638313
    Abstract: Systems and methods for confirming a cryptographic key. The system includes an electronic controller configured to generate an electronic message in response to an installation of a secret key on the electronic controller, the electronic message comprising information about the installation of the secret key, digitally sign the electronic message using a manufacturer private key, encrypt the electronic message, store the electronic message in a memory, access the stored electronic message in response to a request by a user, decrypt the electronic message, confirm a digital signature of the electronic message using a manufacturer public key, generate a confirmation message, and send the confirmation message to a user.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: April 28, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Robert J. Lambert, Robert M. Kaster
  • Publication number: 20200076046
    Abstract: Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 5, 2020
    Inventors: Omkar KARHADE, William J. LAMBERT, Xiaoqian LI, Sidharth DALMIA
  • Publication number: 20200066659
    Abstract: A microelectronics package, comprising a substrate comprising a first bondpad and a second bondpad over a dielectric. An inductor comprising at least one wire extends over the dielectric. The at least one wire has a first end coupled to the first bondpad and a second end coupled to the second bondpad, and an inductor core layer over the dielectric. The inductor core layer comprises a magnetic material. At least a portion of the inductor extends within the inductor core layer.
    Type: Application
    Filed: August 21, 2018
    Publication date: February 27, 2020
    Applicant: Intel Corporation
    Inventors: William J. Lambert, Omkar Karhade, Martin Rodriguez, Gregorio R. Murtagian
  • Publication number: 20200058439
    Abstract: A hardened inductive device and systems and methods for protecting the inductive device from impact is provided. The inductive device is hardened with protective coating and/or an armor steel housing. The hardened inductive device is protected from impact by an object such as a bullet and leakage of dielectric fluid is prevented. Acoustic and vibration sensors are provided to detect the presence and impact, respectively, of an object in relation to the inductive device housing. The measurements of the acoustic and vibration sensors are compared to thresholds for sending alarms to the network control center and initiating shut-down and other sequences to protect the active part. The acoustic sensor results are utilized to determine the location of origin of the projectile.
    Type: Application
    Filed: August 19, 2019
    Publication date: February 20, 2020
    Inventors: George K. Frimpong, Alberto Prieto, Mirrasoul J. Mousavi, James Stoupis, Ed G teNyenhuis, Jeremy R. Schueler, Andrew Bleich, Elizabeth D. Sullivan, Claude J. Lambert, Petter A. Fiskerud, Andrew J. Wall, Gary C. McLeish, Thomas McDonald, Ronald A. Kupiec
  • Publication number: 20200041678
    Abstract: An example system for deploying seismic sensor stations includes a cable storage device configured to deploy a rope, and a plurality of seismic sensor stations each having a respective coupling mechanism. The respective coupling mechanism of a seismic sensor station of the plurality of seismic sensor stations is configurable in a first position such that the rope is free to deploy through or by the seismic sensor station, and is configurable in a second position such that the rope is gripped to attach the seismic sensor station to the rope for deployment. The example system further includes a deployment control system configured to selectively cause the respective coupling mechanism of each of the plurality of seismic sensor stations to grip the rope.
    Type: Application
    Filed: October 3, 2019
    Publication date: February 6, 2020
    Inventors: Dale J. Lambert, André W. Olivier
  • Publication number: 20200036095
    Abstract: Embodiments are generally directed to a package architecture for antenna arrays. An embodiment of an apparatus includes an electronic package, the electronic package including one or more routing layers; a transmitter to drive a signal for wireless transmission; and an assembled phased array antenna to transmit the signal, the assembled phased array antenna including a plurality of separate antenna elements in an array, each antenna element of the array being individually attached to a first side of the electronic package. The antenna elements include a first antenna element and a second antenna element, wherein the first antenna element is separated from the second antenna element by a gap.
    Type: Application
    Filed: January 4, 2017
    Publication date: January 30, 2020
    Inventors: Adel A. ELSHERBINI, Shawna M. LIFF, William J. LAMBERT
  • Publication number: 20200013693
    Abstract: An apparatus is provided which comprises: one or more pads comprising metal on a first substrate surface, the one or more pads to couple with contacts of an integrated circuit die, one or more substrate layers comprising dielectric material, one or more conductive contacts on a second substrate surface, opposite the first substrate surface, the one or more conductive contacts to couple with contacts of a printed circuit board, one or more inductors on the one or more substrate layers, the one or more inductors coupled with the one or more conductive contacts and the one or more pads, and highly thermally conductive material between the second substrate surface and a printed circuit board surface, the highly thermally conductive material contacting the one or more inductors. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 9, 2020
    Applicant: Intel Corporation
    Inventor: William J. Lambert
  • Patent number: 10527530
    Abstract: A venting cap is disclosed for pressure vessels for microwave-assisted chemistry. The venting cap includes a flexible circular cover for closing the mouth of a reaction vessel, a flexible annular wall depending from the circular cover, and a flexible annular ring at the bottom of the annular wall and parallel to the circular cover for positioning the cap on a reaction vessel. At least one indentation in the circular cover minimizes distortion when any contents of a reaction vessel exert pressure against the cap, and at least one opening in the annular wall provides a ventilation path through the cap when gas pressure in a reaction vessel flexes the cap sufficiently to partially disengage at least a portion of the cap from the mouth of the reaction vessel.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: January 7, 2020
    Inventors: David A. Barclay, Joseph J. Lambert, William E. Jennings, David L. Herman