Abstract: A method of increasing organic carbon in a soil is disclosed. The method includes inoculating the soil and/or a plant growing in the soil with one or more fungal strains from at least one genus selected from the group consisting of Acrocalymma, Clonostachys, Leptodontidium, Periconia, Phaeosphaeria, Thozetella, Trichoderma, and a combination thereof, wherein the one or more fungal strains are in an amount effective to increase organic carbon in the soil compared to a non-inoculated control soil. Also disclosed is a method of enhancing plant growth, comprising: applying to a plant, a plant part, or the locus surrounding the plant with one or more fungal strains from at least one genus selected from the group consisting of Acrocalymma, Clonostachys, Leptodontidium, Periconia, Phaeosphaeria, Thozetella, Trichoderma, and a combination thereof in an amount effective to enhance the growth of the plant as compared to an untreated control plant.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first package, wherein the first package comprises, a first package substrate, a first die over the first package substrate, a first mold layer over the first package substrate and around the first die, and a plurality of through mold interconnects (TMIs) through the first mold layer. The electronic package may further comprise a second package electrically coupled the first package by the TMIs, wherein the second package comprises a second package substrate, a second die over the second package substrate, and a solder resist over a surface of the second package substrate opposite from the second die. In an embodiment, the electronic package may also comprise a barrier between the first package and the second package.

Abstract: A method, computer program product, and/or system is disclosed for changing the events monitored by a processor including: determining whether a change in the monitoring of the first event to the second different event has been requested; copying, in response to a request to change the monitoring of the first event to the second different event, op-codes from memory into microcode executable by a general processing engine; and executing the op-codes from memory by the general processing engine to change the first event monitored by the counter to the second different event.

Abstract: A system for implementing anomaly detection accesses user activities associated with an avatar in a virtual environment. The system extracts features from the user activities, where the features provide information about interactions of the avatar with other avatars and entities in the virtual environment. The system determines a deviation range for each feature, where the deviation range indicates a deviation between the features among the avatars over a certain period. The system determines whether the deviation range for a feature is more than a threshold deviation. If it is determined that a deviation range of a feature is more than the threshold deviation, a confidence score associated with the user is updated based on the deviation range of the feature. If the confidence score is more than a threshold score, the user is not associated with an anomaly. Otherwise, the user is determined to be associated with an anomaly.

Abstract: Aspects of the disclosure relate to apparatuses, method steps, and systems for optimized Internet of Things (IoT) data processing for real-time decision support systems. The systems are used for real-time processing prioritization using a prioritization code and/or processing code. Edge devices may generate processing codes that are used in optimizing the data processing. For example, the system receives sensor data and preprocesses the sensor data with a simplified state estimation module to calculate a variance that is used to determine a processing code and/or a prioritization code.

Abstract: A system for optimizing anomaly detection determines, based on a confidence score, user clustering information that indicates a cluster to which a user belongs, such that if the confidence score is more than a threshold score, the user clustering information indicates that the user belongs to a first cluster. Otherwise, the user clustering information indicates that the user belongs to a second cluster. The system determines, based on user activities in a virtual environment, user outlier information that indicates whether the user is associated with an unexpected activity. The system determines virtual resource routing information that comprises routings of virtual resources between the avatar and the other avatars within the virtual environment. The system updates the confidence score based at least in part upon at least one of the user clustering information, the user outlier information, or the virtual resource routing information.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first package, wherein the first package comprises, a first package substrate, a first die over the first package substrate, a first mold layer over the first package substrate and around the first die, and a plurality of through mold interconnects (TMIs) through the first mold layer. The electronic package may further comprise a second package electrically coupled the first package by the TMIs, wherein the second package comprises a second package substrate, a second die over the second package substrate, and a solder resist over a surface of the second package substrate opposite from the second die. In an embodiment, the electronic package may also comprise a barrier between the first package and the second package.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first package, wherein the first package comprises, a first package substrate, a first die over the first package substrate, a first mold layer over the first package substrate and around the first die, and a plurality of through mold interconnects (TMIs) through the first mold layer. The electronic package may further comprise a second package electrically coupled the first package by the TMIs, wherein the second package comprises a second package substrate, a second die over the second package substrate, and a solder resist over a surface of the second package substrate opposite from the second die. In an embodiment, the electronic package may also comprise a barrier between the first package and the second package.

Abstract: Aspects of the disclosure relate to apparatuses, method steps, and systems for optimized Internet of Things (IoT) data processing for real-time decision support systems. The systems are used for real-time processing prioritization using a prioritization code and/or processing code. Edge devices may generate processing codes that are used in optimizing the data processing. For example, the system receives sensor data and preprocesses the sensor data with a simplified state estimation module to calculate a variance that is used to determine a processing code and/or a prioritization code.

Abstract: Embodiments relate to a system, program product, and method for mitigating voltage overshoot in one or more cores in a multicore processing device including a plurality of cores. The method includes determining, in real-time, an indication of power consumption within each core of the one or more cores. The method also includes determining, through the indication of power consumption, a voltage overshoot condition in the one or more cores. The method further includes increasing, for the one or more cores, a power demand thereof. The method also includes increasing, subject to the increasing the power demand, power delivery to the one or more cores, thereby at least arresting the rate of increase of the voltage overshoot.

Abstract: Techniques for generating recommendations for redistributing product inventories are disclosed. A product redistribution system applies hierarchal prioritization of product locations to generate a plan for redistributing products among the product locations. A system identified product repositories organized into clusters. A product redistribution plan first redistributes products among repositories within a cluster. Then the system redistributes products between different clusters. A system predicts whether repositories have excess products or product shortages by applying product excess windows and product shortage windows to inventory data. The system predicts supply and demand of a product over a period of time including the product supply window and the product shortage window. The system generates the product redistribution plan based on the predicted product excess predictions and product shortage predictions.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.

Abstract: Aspects of the disclosure relate to computing hardware and software for dynamic control limit configuration. A computing platform may receive and format historical data. The computing platform may input the formatted data into a control limit prediction model, which may output predicted control limits by weighting, using an ensemble model, outputs from a plurality of other models to produce predicted control limits. The computing platform may adjust existing control limits based on predicted control limits to create actual control limits. The computing platform may receive real time data, and may identify, using the actual control limits and the real time data, a deviation score for the real time data. The computing platform may compare the deviation score to the actual control limits. Based on detecting that the deviation score breaches the actual control limits, the computing platform may send an indication of the breach.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.

Abstract: A method, computer program product, and/or system is disclosed for changing the events monitored by a processor including: determining whether a change in the monitoring of the first event to the second different event has been requested; copying, in response to a request to change the monitoring of the first event to the second different event, op-codes from memory into microcode executable by a general processing engine; and executing the op-codes from memory by the general processing engine to change the first event monitored by the counter to the second different event.

Abstract: The systems may include dividing a digital map provided by a mapping system into a matrix having a plurality of cells; assigning a cell of the plurality of cells to encompass a geographic region of the digital map; calculating a number of sites of interest in the cell; creating a marker comprising a first count number representing the number of sites of interest in the cell; and sharing the marker with a browser for display on the digital map.

Abstract: Aspects of this disclosure relate to use of a monitoring platform for detection of money mule accounts. The monitoring platform may monitor financial and non-financial transactions and/or other activities associated with an account to generate various statistical and technology adaptation metrics. The statistical and technology adaptation metrics may be used by a rules engine to determine whether the account is a potential money mule.

Abstract: Embodiments relate to a system, program product, and method for proactively initiating throttle action on one or more cores in a multicore processing device to mitigate voltage droop therein. The method includes determining, in real-time, an indication of stall events within the core and determining one or more resolutions of the stall events. The method also includes determining, in real-time, a timing margin value for the core and predicting inducement of a voltage droop on the core. The method further includes integrating the resolutions of the stall events and the timing margin value for the core, determining, subject to the predicting, a throttle action for the core, and executing the throttle action on the core.