Patents by Inventor A. Purushotham

A. Purushotham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11029947
    Abstract: A device may receive data associated with a software development platform, and may correlate the data to generate correlated data. The device may train a first model, with the correlated data, to generate a software impact analyzer model, and may train a second model, with the correlated data, to generate a software development behavior model. The device may receive data identifying a new software requirement associated with the software development platform, and may process the data identifying the new software requirement, with the software impact analyzer model, to identify a file or a module impacted by the new software requirement. The device may process data identifying the file or the module, with the software development behavior model, to identify a developer to handle the new software requirement, and may perform one or more actions based on the data identifying the file or the module and data identifying the developer.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 8, 2021
    Assignee: Accenture Global Solutions Limited
    Inventors: Sundar Prasad Jayaraman, Ravindra Kabbinale, Suhas Nagaraju, Amrutha Pervody Bhat, Smitha Ka, Divya R. Purushotham, Sanjay Singatalur, Vijeth Srinivas Hegde, Aditi Kulkarni, Rajendra T. Prasad, Koushik M Vijayaraghavan
  • Patent number: 11016673
    Abstract: Aspects of the technology provide improvements to a Serverless Computing (SLC) workflow by determining when and how to optimize SLC jobs for computing in a Distributed Computing Framework (DCF). DCF optimization can be performed by abstracting SLC tasks into different workflow configurations to determined optimal arrangements for execution in a DCF environment. A process of the technology can include steps for receiving an SLC job including one or more SLC tasks, executing one or more of the tasks to determine a latency metric and a throughput metric for the SLC tasks, and determining if the SLC tasks should be converted to a Distributed Computing Framework (DCF) format based on the latency metric and the throughput metric. Systems and machine-readable media are also provided.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: May 25, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Xinyuan Huang, Johnu George, Marc Solanas Tarre, Komei Shimamura, Purushotham Kamath, Debojyoti Dutta
  • Patent number: 10998935
    Abstract: A secondary power distribution box (SPDB), solid state power controller (SSPC) line replacement module or printed board assembly (LRM/PBA), integrated power distribution and avionics system, and method of power distribution are disclosed. For example, the method includes receiving electrical power from a power source at a power feeder network, communicating with at least one load of a plurality of loads at least in part over the power feeder network, and coupling the electrical power to the at least one load of the plurality of loads in response to the communicating.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: May 4, 2021
    Assignee: Honeywell Limited
    Inventors: Zhenning Liu, Randy Fuller, Karthik V J, Rohit Parashar, Prashant Purushotham Prabhu K, Muthukumar Murthy
  • Publication number: 20210090732
    Abstract: Methods, systems, and apparatus for a method that predicts an individual survival survival time of a patient. The method includes obtaining clinical data associated with health factors of the patient. The method includes obtaining liquid biopsy data associated with one or more attributes of diseased cells within the patient. The method includes predicting or determining a survival time of the patient using a deep learning model based on the clinical data and the liquid biopsy data. The method includes providing or outputting the survival time.
    Type: Application
    Filed: April 27, 2018
    Publication date: March 25, 2021
    Inventors: Anand Kolatkar, Peter Kuhn, Yan Liu, Paymaneh Malihi, Sanjay Purushotham
  • Publication number: 20210066273
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Inventors: Denis MYASISHCHEV, Andrew V. MAZUR, Purushotham Kaushik MUTHUR SRINATH, Robert M. NICKERSON, Shripad GOKHALE
  • Publication number: 20210066167
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.
    Type: Application
    Filed: August 26, 2019
    Publication date: March 4, 2021
    Inventors: Robert M. NICKERSON, Rees WINTERS, Purushotham Kaushik MUTHUR SRINATH
  • Publication number: 20210064361
    Abstract: A device may receive data associated with a software development platform, and may correlate the data to generate correlated data. The device may train a first model, with the correlated data, to generate a software impact analyzer model, and may train a second model, with the correlated data, to generate a software development behavior model. The device may receive data identifying a new software requirement associated with the software development platform, and may process the data identifying the new software requirement, with the software impact analyzer model, to identify a file or a module impacted by the new software requirement. The device may process data identifying the file or the module, with the software development behavior model, to identify a developer to handle the new software requirement, and may perform one or more actions based on the data identifying the file or the module and data identifying the developer.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Inventors: Sundar Prasad JAYARAMAN, Ravindra KABBINALE, Suhas NAGARAJU, Amrutha PERVODY BHAT, Smitha KA, Divya R. PURUSHOTHAM, Sanjay SINGATALUR, Vijeth SRINIVAS HEGDE, Aditi KULKARNI, Rajendra T. PRASAD, Koushik M VIJAYARGHAVAN
  • Publication number: 20210066155
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first package, wherein the first package comprises, a first package substrate, a first die over the first package substrate, a first mold layer over the first package substrate and around the first die, and a plurality of through mold interconnects (TMIs) through the first mold layer. The electronic package may further comprise a second package electrically coupled the first package by the TMIs, wherein the second package comprises a second package substrate, a second die over the second package substrate, and a solder resist over a surface of the second package substrate opposite from the second die. In an embodiment, the electronic package may also comprise a barrier between the first package and the second package.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Inventors: Elizabeth NOFEN, Shripad GOKHALE, Nick ROSS, Amram EITAN, Nisha ANANTHAKRISHNAN, Robert M. NICKERSON, Purushotham Kaushik MUTHUR SRINATH, Yang GUO, John C. DECKER, Hsin-Yu LI
  • Patent number: 10902293
    Abstract: In one embodiment, a device forms a neural network envelope cell that comprises a plurality of convolution-based filters in series or parallel. The device constructs a convolutional neural network by stacking copies of the envelope cell in series. The device trains, using a training dataset of images, the convolutional neural network to perform image classification by iteratively collecting variance metrics for each filter in each envelope cell, pruning filters with low variance metrics from the convolutional neural network, and appending a new copy of the envelope cell into the convolutional neural network.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: January 26, 2021
    Assignee: Cisco Technology, Inc.
    Inventors: Purushotham Kamath, Abhishek Singh, Debojyoti Dutta
  • Patent number: 10873635
    Abstract: Techniques and structures to manage a multi-channel client-server connection is disclosed. A connection session is established between a client and in server response to receiving a call from a first browser interface element to establish the connection session. The session is shared in response to receiving a second call from a second browser interface element to establish a connection session.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: December 22, 2020
    Assignee: salesforce.com, inc.
    Inventors: Purushotham Babu Naidu, Jay Hurst, John Arlan Brock, Vikram Kommaraju, Soumen Bandyopadhyay
  • Publication number: 20200380130
    Abstract: A method for managing memory within a computing system. The method includes one or more computer processors identifying a range of physical memory addresses that store a first data. The method further includes determining whether a second data is stored within the range of physical memory addresses that stores the first data. The method further includes responding to determining that the second data is stored within the range of physical memory addresses that store the first data, by determining whether a process accessing the second data is identified as associated with a side-channel attack. The method further includes responding to determining that the process accessing the second data is associated with the side-channel attack, by initiating a response associated with the process accessing the second data.
    Type: Application
    Filed: May 31, 2019
    Publication date: December 3, 2020
    Inventors: Srinivas Bangalore Purushotham, Santosh Balasubramanian
  • Publication number: 20200380400
    Abstract: Aspects of the disclosure relate to apparatuses, method steps, and systems for optimized Internet of Things (IoT) data processing for real-time decision support systems. The systems are used for real-time processing prioritization using a prioritization code and/or processing code. Edge devices may generate processing codes that are used in optimizing the data processing. For example, the system receives sensor data and preprocesses the sensor data with a simplified state estimation module to calculate a variance that is used to determine a processing code and/or a prioritization code.
    Type: Application
    Filed: May 29, 2019
    Publication date: December 3, 2020
    Inventors: Om Purushotham Akarapu, Daniel D. Widjanarko, Durgadatta Belhekar, Jitendra Upadhyay, Rama Krishnam Raju Rudraraju
  • Patent number: 10846900
    Abstract: The systems may include superimposing a canvas layer having a pixel system over the digital map; aligning the coordinate system of the digital map with the pixel system of the canvas layer; obtaining a location coordinate of the coordinate system to each site of interest of a plurality of sites of interest, wherein the location coordinate is associated with a location of the site of interest on the digital map; associating the location coordinate for the site of interest with a pixel in the pixel system; and creating a marker on the canvas layer on the pixel associated with the location coordinate for the site of interest.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: November 24, 2020
    Assignee: AMERICAN EXPRESS TRAVEL RELATED SERVICES COMPANY, INC.
    Inventors: Kedar Biradar, Raju Rathi, Kunal Upadhyay, Purushotham Vunnam, Digvijay Yadav
  • Patent number: 10831659
    Abstract: A method handles cache misses using a Scope Resolution Tag Buffer (SRTB). A cache controller assigns each data block in L2 cache with an n-bit value, where the n-bit value describes a quantity of occurrences in which the data block has been accessed, and where the cache controller increments the n-bit value in one or more data blocks in the first level memory cache each time the one or more data blocks are accessed. The cache controller evicts a particular data block from the L2 cache, and stores a particular data block address where the particular data block is now stored in a Scope Resolution Tag Buffer (SRTB). The information in the SRTB is used to locate which cache or memory contains the particular data block in the event of a subsequent cache miss in the L2 cache.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: November 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Srinivas B. Purushotham, Naveen Miriyalu, Venkata K. Tavva
  • Publication number: 20200272338
    Abstract: Aspects of the technology provide improvements to a Serverless Computing (SLC) workflow by determining when and how to optimize SLC jobs for computing in a Distributed Computing Framework (DCF). DCF optimization can be performed by abstracting SLC tasks into different workflow configurations to determined optimal arrangements for execution in a DCF environment. A process of the technology can include steps for receiving an SLC job including one or more SLC tasks, executing one or more of the tasks to determine a latency metric and a throughput metric for the SLC tasks, and determining if the SLC tasks should be converted to a Distributed Computing Framework (DCF) format based on the latency metric and the throughput metric. Systems and machine-readable media are also provided.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Inventors: Xinyuan Huang, Johnu George, Marc Solanas Tarre, Komei Shimamura, Purushotham Kamath, Debojyoti Dutta
  • Publication number: 20200266855
    Abstract: A secondary power distribution box (SPDB), solid state power controller (SSPC) line replacement module or printed board assembly (LRM/PBA), integrated power distribution and avionics system, and method of power distribution are disclosed. For example, the method includes receiving electrical power from a power source at a power feeder network, communicating with at least one load of a plurality of loads at least in part over the power feeder network, and coupling the electrical power to the at least one load of the plurality of loads in response to the communicating.
    Type: Application
    Filed: February 20, 2019
    Publication date: August 20, 2020
    Applicant: Honeywell Limited
    Inventors: Zhenning Liu, Randy Fuller, Karthik V J, Rohit Parashar, Prashant Purushotham Prabhu K, Muthukumar Murthy
  • Patent number: 10734302
    Abstract: A thermal electrical (TE) interface comprises a primary fiber thermal interface (FTI) having a first side configured to contact a heatsink, and a second side. The primary fiber thermal interface has a thickness ranging from 0.3 mm to 4 mm. A secondary fiber thermal interface (FTI) has a first side configured to contact the second side of the primary FTI, a second side configured to contact circuit components to dissipate heat from the circuit components through the first side of the primary FTI. The secondary fiber thermal interface has a thickness equal to or greater than the primary FTI.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: August 4, 2020
    Assignee: KULR TECHNOLOGY CORPORATION
    Inventors: Mysore Purushotham Divakar, Juergen Mueller, Michael Mo
  • Patent number: 10678444
    Abstract: Aspects of the technology provide improvements to a Serverless Computing (SLC) workflow by determining when and how to optimize SLC jobs for computing in a Distributed Computing Framework (DCF). DCF optimization can be performed by abstracting SLC tasks into different workflow configurations to determined optimal arrangements for execution in a DCF environment. A process of the technology can include steps for receiving an SLC job including one or more SLC tasks, executing one or more of the tasks to determine a latency metric and a throughput metric for the SLC tasks, and determining if the SLC tasks should be converted to a Distributed Computing Framework (DCF) format based on the latency metric and the throughput metric. Systems and machine-readable media are also provided.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: June 9, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Xinyuan Huang, Johnu George, Marc Solanas Tarre, Komei Shimamura, Purushotham Kamath, Debojyoti Dutta
  • Patent number: 10654254
    Abstract: A process of bonding different constituent materials of different tensile strengths in a single step in an isostatic high pressure reactor in order to produce a composite material.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: May 19, 2020
    Assignee: Mahavadi Management and Technology Services GmbH
    Inventor: Purushotham Mahavadi
  • Patent number: 10637756
    Abstract: In one embodiment, a service converts a stream of network telemetry data into sketches. The stream of network telemetry data comprises a plurality of characteristics of traffic observed in a network. The service forms a time series of the sketches. The service performs anomaly detection on the time series of the sketches in part by calculating a joint distribution of ranks and frequencies of a portion of the characteristics at different points in time of the time series. The service sends an anomaly detection alert, when an anomaly is detected from the time series of the sketches.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: April 28, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Ralf Rantzau, Xinyuan Huang, Purushotham Kamath, Debojyoti Dutta