Patents by Inventor A Sheng Yang

A Sheng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11844286
    Abstract: Various embodiments of the present application are directed towards a method for forming a flat via top surface for memory, as well as an integrated circuit (IC) resulting from the method. In some embodiments, an etch is performed into a dielectric layer to form an opening. A liner layer is formed covering the dielectric layer and lining the opening. A lower body layer is formed covering the dielectric layer and filling a remainder of the opening over the liner layer. A top surface of the lower body layer and a top surface of the liner layer are recessed to below a top surface of the dielectric layer to partially clear the opening. A homogeneous upper body layer is formed covering the dielectric layer and partially filling the opening. A planarization is performed into the homogeneous upper body layer until the dielectric layer is reached.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: December 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih, Tung-Sheng Hsiao, Wen-Ting Chu, Yu-Wen Liao, I-Ching Chen
  • Publication number: 20230393062
    Abstract: A method includes receiving a value for a spectral band identified from a soil sample and inputting the value for the spectral band to a system that predicts a percentage of carbon matter in the soil sample using values of spectral bands. The ability of the system to correctly predict the percentage of carbon matter in the soil sample is improved by further inputting a humidity level to the system wherein the humidity level indicates an amount of ambient moisture present when the value for the spectral band was identified.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 7, 2023
    Inventors: David C. Stone, Sheng-Yang Matthew Goh, Michael Wiest, Bradly R. Roetman, Terry S. Nederhoff
  • Publication number: 20230386920
    Abstract: A method of forming a semiconductor device includes providing a device having a gate stack with a metal gate layer and a spacer layer disposed on a sidewall of the gate stack. In some embodiments, the method further includes performing an etch-back process to the metal gate layer to form an opening over the gate stack. In various examples, the method further includes performing a plasma treatment process to modify a profile of the opening. In some cases, the method further includes forming a HM layer over the metal gate layer and within the opening having the modified profile.
    Type: Application
    Filed: May 26, 2022
    Publication date: November 30, 2023
    Inventors: Chih-Lun LU, Jih-Sheng YANG, Chen-Wei PAN, Chih-Teng LIAO
  • Publication number: 20230388318
    Abstract: A computing system can receive location data from a computing device of a driver. Based at least in part on the location data, execute a location-based feasibility model to determine that one or more anomalous locational attributes are present, where the location-based feasibility model outputs a probability that the computing device of the respective driver is performing location-spoofing. Based on the probability indicating that the computing device of the driver is performing location-spoofing, the system associates a data set with a driver profile of the respective driver.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Sheng Yang, Ze Huang, Qiao Wang, David Spenser DyTang, Kiarash Amiri, Tara Michelle Mitchell, Xiao Cai
  • Publication number: 20230371658
    Abstract: A zipper structure is provided and includes a first zipper component including a first zipper portion, a second zipper component including a second zipper portion, and a sealing end assembly. An end part of the first zipper portion of the first zipper component adjacent to an end of the first zipper component and an end part of the second zipper portion of the second zipper component adjacent to an end of the second zipper component are engaged with each other. The sealing end assembly is connected to the ends of the first zipper component and the second zipper component by injection molding and covers surfaces of the ends of the first zipper component and the second zipper component. A gap between the end parts of the first zipper portion and the second zipper portion is filled with the sealing end assembly. Furthermore, a related zipper bag is also provided.
    Type: Application
    Filed: July 12, 2022
    Publication date: November 23, 2023
    Applicant: Universal Trim Supply Co., Ltd.
    Inventors: Shih-Sheng Yang, Chia-Hsin Wu
  • Patent number: 11816900
    Abstract: Systems, methods, and non-transitory computer-readable media can access a plurality of parameter-based encodings providing a structured representation of an environment captured by one or more sensors associated with a plurality of vehicles traveling through the environment. A given parameter-based encoding of the environment identifies one or more agents that were detected by a vehicle within the environment and respective location information for the one or more agents within the environment. The plurality of parameter-based encodings can be clustered into one or more clusters of parameter-based encodings. At least one scenario associated with the environment can be determined based at least in part on the one or more clusters of parameter-based encodings.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: November 14, 2023
    Assignee: Lyft, Inc.
    Inventors: Ivan Kirigan, David Tse-Zhou Lu, Sheng Yang, Ranjith Unnikrishnan, Emilie Jeanne Anne Danna, Weiyi Hou, Daxiao Liu, Suneet Rajendra Shah, Ying Liu
  • Publication number: 20230354277
    Abstract: A station (STA) for communicating with an Access Point (AP) in a wireless communication system is provided. The STA may include a wireless transceiver and a processor. The wireless transceiver may be configured to perform wireless transmission and reception to and from the AP. The processor may be configured to receive allocation information from the AP via the wireless transceiver, wherein the allocation information indicates at least one user block and at least one stream for the STA, wherein each resource unit (RU) in a Physical layer Protocol Data Unit (PPDU) comprises at least one user block, and send Uplink (UL) data or receive Downlink (DL) data in the at least one user block to or from the AP via the wireless transceiver according to the allocation information.
    Type: Application
    Filed: July 5, 2023
    Publication date: November 2, 2023
    Inventors: Hung-Tao HSIEH, Tung-Sheng YANG, Chao-Chun WANG, Jianhan LIU, Ying-You LIN
  • Patent number: 11802280
    Abstract: An enzyme synthesizes hydroxyl acetaldehyde and/or 1,3-dihydroxyacetone by catalyzing formaldehyde. Site-directed mutation of benzoylformate decarboxylase (BFD) creates a mutant of the enzyme, which can polymerize the formaldehyde, A phosphoketalose (F/XPK) generates acetyl phosphoric acid from the hydroxyl acetaldehyde or 1,3-dihydroxyacetone (DHA). Combination with phosphotransacetylase (Pta) provides a route from the formaldehyde to acetyl coenzyme A in three steps.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: October 31, 2023
    Assignee: Tianjin Institute of Industrial Biotechnology, Chinese Academy of Sciences
    Inventors: Huifeng Jiang, Xiaoyun Lu, Yuwan Liu, Yiqun Yang, Lina Lu, Sheng Yang, Junran Gou
  • Publication number: 20230336418
    Abstract: A method of for performing carbon neutralization in a communication network is provided. The method includes receiving a service task from a user equipment. The method also includes obtaining a carbon neutralization calculation parameter related to performing the received service task. The method further includes selecting, based on the obtained carbon neutralization calculation parameter, a target entity from a plurality of candidate targets at which the received service task can be performed. The method further includes sending the received service task to the selected target entity.
    Type: Application
    Filed: March 14, 2023
    Publication date: October 19, 2023
    Applicant: MEDIATEK INC.
    Inventors: Chien-Sheng YANG, Chien-Chun HUANG-FU, I-Kang FU
  • Patent number: 11777954
    Abstract: A computing system can receive location data from computing devices of drivers, each of the computing devices operating a designated application associated with an application service. The system can determine a set of locational attributes of a respective driver and determine whether one or more anomalous locational attributes are present in the set of locational attributes of the respective driver. In response to determining that one or more anomalous locational attributes are present, the system can associate a data set with a driver profile of the respective driver.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: October 3, 2023
    Assignee: Uber Technologies, Inc.
    Inventors: Sheng Yang, Ze Huang, Qiao Wang, David Spenser DyTang, Kiarash Amiri, Tara Michelle Mitchell, Xiao Cai
  • Publication number: 20230288213
    Abstract: Systems and methods of using sensor data for coordinate prediction are disclosed herein. In some example embodiments, for a place, a computer system accesses corresponding service data comprising pick-up data and drop-off data for requests, and accesses corresponding sensor data indicating at least one path of mobile devices of the requesters of the requests, with the at least one path comprising at least one of a pick-up path ending at the pick-up location indicated by the pick-up data and a drop-off path beginning at the drop-off location indicated by the drop-off data. In some example embodiments, the computer system generates at least one predicted geographic location using the paths indicated by the sensor data, and stores the at least one predicted geographic location in a database in association with an identification of the place.
    Type: Application
    Filed: May 22, 2023
    Publication date: September 14, 2023
    Inventors: Shivendra Singh, Upamanyu Madhow, Vikram Saxena, Livia Zarnescu Yanez, Chandan Prakash Sheth, Sheng Yang, Alvin AuYoung
  • Publication number: 20230283838
    Abstract: An analysis method configured to analyze original signals on an auxiliary channel of DisplayPort between a transmitter and at least one receiver, includes: receiving a first original signal of the original signals; dividing the first original signal to obtain a DPCD address and a first data; storing the first data according to the DPCD address; determining whether the first data is a redundant signal; when the first data is not the redundant signal, analyzing the first data; and displaying a topology of the at least one receiver. The operation of analyzing the first data includes generating the topology of the at least one receiver.
    Type: Application
    Filed: December 6, 2022
    Publication date: September 7, 2023
    Inventors: HAO ZHOU, HONG CHANG, XIN SHENG YANG, TAO XU
  • Patent number: 11751380
    Abstract: A semiconductor memory structure includes a semiconductor substrate, a bit line disposed on the semiconductor substrate, and a capacitor contact disposed on the side of the bit line. The capacitor contact includes a semiconductor plug disposed on the semiconductor substrate, a metal plug disposed on the semiconductor plug, a metal silicide liner extending along the sidewalls and bottom of the metal plug, and a nitride layer disposed on the metal silicide liner. The top surface of the metal silicide liner is lower than the top surface of the metal plug. The nitride layer surrounds the top portion of the metal plug.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: September 5, 2023
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Hao-Chuan Chang, Jiun-Sheng Yang
  • Patent number: 11751485
    Abstract: Various embodiments of the present application are directed towards a method for forming a flat via top surface for memory, as well as an integrated circuit (IC) resulting from the method. In some embodiments, an etch is performed into a dielectric layer to form an opening. A liner layer is formed covering the dielectric layer and lining the opening. A lower body layer is formed covering the dielectric layer and filling a remainder of the opening over the liner layer. A top surface of the lower body layer and a top surface of the liner layer are recessed to below a top surface of the dielectric layer to partially clear the opening. A homogeneous upper body layer is formed covering the dielectric layer and partially filling the opening. A planarization is performed into the homogeneous upper body layer until the dielectric layer is reached.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: September 5, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Jen-Sheng Yang, Sheng-Hung Shih, Tung-Sheng Hsiao, Wen-Ting Chu, Yu-Wen Liao, I-Ching Chen
  • Publication number: 20230266295
    Abstract: A method of indicating a characteristic of a soil sample of a field includes measuring a co-factor in the soil sample and using the co-factor to place the soil sample in a soil sample group. The characteristic of the soil sample is measured and then is scaled based on the soil sample group. The scaled measure is displayed to better represent the characteristic of the soil sample relative to soil samples of the sample group.
    Type: Application
    Filed: February 22, 2022
    Publication date: August 24, 2023
    Inventors: Maria Mooshammer, Sheng-Yang Matthew Goh, David C. Stone, Tyler Barnum, Patrick L. Dumstorff
  • Publication number: 20230270017
    Abstract: A method for fabricating a semiconductor device includes the steps of forming a magnetic tunneling junction (MTJ) on a substrate, forming a spin orbit torque (SOT) layer on the MTJ, forming an inter-metal dielectric (IMD) layer around the MTJ and the SOT layer, forming a first hard mask on the IMD layer, forming a semiconductor layer on the first hard mask, and then patterning the first hard mask.
    Type: Application
    Filed: March 24, 2022
    Publication date: August 24, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hung-Yi Wu, Jia-Rong Wu, Yu-Hsiang Lin, Yi-Wen Chen, Kun-Sheng Yang
  • Publication number: 20230267693
    Abstract: The embodiments of the disclosure provide a method for determining physical characteristics of objects, a host, and a computer readable storage medium. The method includes: detecting a first physical object in an environment; obtaining a first motion behavior of a reference object, wherein the first motion behavior corresponds to an interact event of the reference object interacting with the first physical object; and determining a first physical characteristic of the first physical object based on the first motion behavior.
    Type: Application
    Filed: September 29, 2022
    Publication date: August 24, 2023
    Applicant: HTC Corporation
    Inventor: Sheng-Yang Pan
  • Publication number: 20230269042
    Abstract: A device is provided, which includes radio-frequency circuitry and an encoder. The encoder is configured to modulate input data to generate a long-range packet, and to transmit the long-range packet to a receiver through the radio-frequency circuitry. The long-range packet includes a long-range signal field (LR-SIG) and a long-range data field (LR-DATA). Each modulated bit in the long-range signal field and the long-range data field is spread into a plurality of spread modulated bits that are distributed into a plurality of symbols in a frequency domain.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 24, 2023
    Inventors: Tung-Sheng YANG, Hung-Tao HSIEH, Yen-Shuo LU, Wei-Ping CHUANG, Ting-Che TSENG, Wen-Hsien CHIU
  • Publication number: 20230231345
    Abstract: A power adapter with a sensing control function for a lamp load comprises a plug case, a pin set, and a circuit board. The plug case has an exterior surface having an operation area. The pin set is mounted on the plug case. The circuit module is mounted in the plug case, is electrically connected to the pin set, and has a sensor board comprising a sensing conductor and a controller electrically connected to the sensing conductor. A position of the sensing conductor corresponds to a position of the operation area of the exterior surface of the plug case.
    Type: Application
    Filed: January 18, 2022
    Publication date: July 20, 2023
    Inventor: CHEN SHENG YANG
  • Patent number: D1005128
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: November 21, 2023
    Assignee: Apple Inc.
    Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Jeremy Bataillou, Daniel J. Coster, Daniele De Iuliis, Liane Fang, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Peter Russell-Clarke, Charles A. Schwalbach, Benjamin Andrew Shaffer, Mikael Silvanto, Christopher J. Stringer, Clement Tissandier, Eugene Antony Whang, Sheng Yang, Rico Zörkendörfer