Patents by Inventor A Wen Yu

A Wen Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9444987
    Abstract: An interactive imaging system includes an image system and a remote controller. The image system includes at least one reference beacon, a receiving unit and a host. The at least one reference beacon emits light in an emission pattern. The receiving unit is configured to receive a packet data. The host controls an enable time of the at least one reference beacon according to the packet data. The remote controller includes an image sensor and a transmission unit. The image sensor captures the light emitted from the at least one reference beacon at a sampling period. The transmission unit sends the packet data corresponding to the sampling period of the image sensor.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: September 13, 2016
    Assignee: PIXART IMAGING INC
    Inventors: Chia-Cheun Liang, Chao-Chien Huang, Chi-Yang Huang, Wen-Yu Yang, Hung-Yu Lee
  • Patent number: 9432046
    Abstract: A successive approximation analog-to-digital converter includes a first capacitance bank, a second capacitance bank, a bridge capacitor, a switch set, a comparator and a successive approximation register logic circuit. The first capacitance bank is connected with a first node. The second capacitance bank is connected with a second node. The bridge capacitor is connected between the first node and the second node. Two first input terminals of the comparator are connected with the first node and the intermediate level, respectively. An output terminal of the comparator generates a comparing signal. The successive approximation register logic circuit receives the comparing signal, and generates the switching signal and a digital data signal. The switch set selectively provides one of a low reference level, a high reference level, an input level and an intermediate level to the first capacitance bank and the second capacitance bank.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: August 30, 2016
    Assignees: FARADAY TECHNOLOGY CORPORATION, Faraday Technology Corp.
    Inventors: Guang-Wen Yu, Xing-Bo Ding, Min-Yuan Wu
  • Patent number: 9413123
    Abstract: An electrical plug connector includes a metal shell, an insulation housing, upper-row elastic terminals, and lower-row elastic terminals. The metal shell defines a receiving cavity to receive the insulation housing. The insulation housing includes an upper member, a lower member, and a mating room between the upper member and the lower member. The upper-row elastic terminals are held on a lower surface of the upper member and include upper-row elastic contact segments extending toward the mating room for transmitting first signals. The lower-row elastic terminals are held on an upper surface of the lower member and include lower-row elastic contact segments extending toward the mating room for transmitting second signals.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: August 9, 2016
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Ya-Fen Kao, Yu-Lun Tsai, Pin-Yuan Hou, Wen-Yu Wang, Wen-Hsien Tsai
  • Publication number: 20160205776
    Abstract: A cover film with high dimensional stability includes an insulation film, a first adhesive layer, and a carrier. A first side of the first adhesive layer is connected to a first surface of the insulation film, and a second side of the first adhesive layer is configured to adhere to at least one metal conductor of a flexible printed circuit board. The carrier includes a supporting film and a second adhesive layer. A first side of the second adhesive layer is connected to the supporting film, and a second side of the second adhesive layer is adhered to a second surface of the insulation film, wherein bonding strength of the second adhesive film is smaller than bonding strength of the first adhesive film.
    Type: Application
    Filed: February 12, 2015
    Publication date: July 14, 2016
    Inventors: Hsiu-Chu Wu, Ching-Wen Yu, Wen-Chien Chen, Wu-Ying Su, Wei-Yuan Huang, Meng-Cheng Tsai, Chi-Sheng Hung
  • Publication number: 20160192887
    Abstract: A computer-implemented method for a monitoring device being executed by a processor of the monitoring device comprises acquiring at least two kinds of physiological signals via a sensor of the monitoring device, obtaining a signal quality index of each of the at least two kinds of physiological signals by the processor of the monitoring device, providing a homologous physiological parameter value corresponding to each of the at least two kinds of physiological signals by the processor of the monitoring device, and fusing the homologous physiological parameter values based on the signal quality index of each of the at least two kinds of physiological signals and providing a fused value of the homologous physiological parameter values by the processor of the monitoring device. The disclosed physiological parameter processing method avoids disadvantages caused by relying on a single physiological signal.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 7, 2016
    Inventors: ZE-HUI SUN, JIAO YU, JIAN-WEI SU, JING-MING YANG, CHAO-CHENG XIE, WEN-YU YE, JIAN CEN
  • Patent number: 9374637
    Abstract: An electronic system and an electronic device thereof are provided. The electronic device includes a first housing, a speaker module, a second housing, and a bearing. The first housing has a first hole. The speaker module is disposed in the first housing, and a sound generated by the speaker module is transmitted out of the electronic device through the first hole. The second housing has a bearing surface facing to the first housing. The bearing is disposed between the first housing and the second housing. The second housing and the first housing move relative to each other by using the bearing, so the first housing covers or exposes a portion of the bearing surface.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: June 21, 2016
    Assignee: HTC Corporation
    Inventors: Yen-Chun Shao, Chih-Chiang Lin, Wen-Yu Shih
  • Publication number: 20160172264
    Abstract: A method for fabricating a package structure is provided, including the steps of: disposing and electrically connecting a sensing chip to a substrate; forming an encapsulant on the substrate to encapsulate the sensing chip; and forming a bright layer on the encapsulant to increase the gloss of the package structure. The encapsulant includes an additive to increase the Mohs hardness of the encapsulant. Further, the encapsulant with different additives presents different colors. Therefore, the invention obtains a high-gloss, high-hardness and colorful sensor package structure.
    Type: Application
    Filed: February 26, 2015
    Publication date: June 16, 2016
    Inventors: Wen-Yu Teng, Liang-Yi Hung
  • Patent number: 9369751
    Abstract: A hand-held pointing device includes a main body, a processing circuit, a light emitting device and two image sensing devices. The main body has a first surface and a second surface for lying on an operating surface. The two image sensing devices are disposed in the main body and configured to sense first and second images through first and second transparent areas thereof, respectively. The light emitting device, disposed in the main body, is configured to emit a light source through the second transparent area. The processing circuit is configured to determine and operate the hand-held pointing device in a remote controller mode or a mouse mode according to whether the first image contains an image of a reference light source and/or the second image contains an image of the operating surface reflecting the light source. An operation for a hand-held pointing device is also provided.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: June 14, 2016
    Assignee: PIXART IMAGING INC.
    Inventors: Chia-Cheun Liang, Chi-Yang Huang, Chih-Yen Wu, Wen-Yu Yang
  • Patent number: 9364846
    Abstract: A circuit for liquid atomizing device coupled to an atomizing module is disclosed. The circuit for liquid atomizing device includes a conversion unit, a control unit and a voltage adjustment unit. The control unit is coupled to the conversion unit and controls the conversion unit to output a transforming voltage. The voltage adjustment unit is coupled between the conversion unit and the atomizing module. The voltage adjustment unit according to the transforming voltage outputs a driving voltage to the atomizing module. The driving voltage includes a plurality of electrolysis sections and a plurality of negative level sections. Each electrolysis section indicates that the atomizing module produces a forward electrolysis reaction. Each negative level section indicates that the atomizing module produces a backward electrolysis reaction.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: June 14, 2016
    Assignee: HCMED INNOVATIONS CO., LTD.
    Inventors: Wen-Yu Tsai, Chieh-Sheng Cheng
  • Patent number: 9368926
    Abstract: An electrical connector plug having resilient contact terminals electrically connects to an electrical connector socket with a casing and two groups of engaging terminals mounted on or in the casing. The electrical connector plug has an electrically conductive housing. A coupling device extends in a longitudinal direction and has a base portion. The resilient contact terminals are mounted on the coupling device axially symmetrically arranged with each other in the longitudinal direction, each of which has a flat section and an upwardly protruding contact section. A metallic shield frame is electrically connected to and secured to the electrically conductive housing, having a frame section, a front section, and two lateral protective sections. The respective lateral protective sections have a height no less than that of the upwardly protruding contact sections of the resilient contact terminals.
    Type: Grant
    Filed: May 18, 2014
    Date of Patent: June 14, 2016
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Ya-Fen Kao, Yu-Lun Tsai, Pin-Yuan Hou, Wen-Yu Wang, Wen-Hsien Tsai, Alan Robert MacDougall
  • Patent number: 9358934
    Abstract: A retractable speaker structure for use in a vehicle is provided. The retractable speaker structure includes: a case formed with a chamber; a driving member installed in the chamber and including a stepping motor and a transmission shaft connected to the stepping motor; a retracting mechanism disposed in the chamber and including a screw rod and a retractable rod fitted with the screw rod. The screw rod is driven by the transmission shaft to rotate, thereby enabling the retractable rod to perform a protruding/retracting movement relative to the screw rod; and a speaker secured at an end section of the retractable rod and moved with the retractable rod. Accordingly, the retractable speaker structure is able to be adjusted for being protruded or retracted according to the actual needs, thereby effectively simplifying components and lowering production cost.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: June 7, 2016
    Assignee: HSIN CHONG MACHINERY WORKS CO. LTD.
    Inventors: Yeh-Wen Yu, Shiu-Ming Lin
  • Patent number: 9363901
    Abstract: A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: June 7, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Wen Yu Lee, Steven Su
  • Publication number: 20160151235
    Abstract: A massage device includes a shaft and a detachable massage member. The shaft has a first end provided with a connector for releasably connecting the shaft to a swivel joint. The detachable massage member is detachably connected at a proximal end to an opposite second end of the shaft. With the above arrangements, the massage device can be conveniently operated directly by a user to achieve the effect of deep massage of a variety of muscles.
    Type: Application
    Filed: November 25, 2015
    Publication date: June 2, 2016
    Inventors: HSIEN-WEN YU, CHENG-HUAN YANG
  • Publication number: 20160155671
    Abstract: A method of forming a semiconductor device is provided. The method includes forming a recess in a substrate and forming a first dielectric layer in the recess. A portion of the first dielectric layer is removed. A second dielectric layer is formed over the first dielectric layer. A gate structure is formed over the second dielectric layer.
    Type: Application
    Filed: February 4, 2016
    Publication date: June 2, 2016
    Inventors: Yu-Lien Huang, Tung Ying Lee, Pei-Yi Lin, Chun-Hsiang Fan, Sheng-Wen Yu, Neng-Kuo Chen, Ming-Huan Tsai
  • Patent number: 9337130
    Abstract: A leadframe strip including a first leadframe having a first die pad and a first plurality of generally parallel leads each extending outwardly relative to the first die pad and terminating in a free end and a second leadframe having a second die pad and a second plurality of generally parallel leads extending outwardly relative to the second die pad and terminating in a free end. The free ends of the second plurality of leads are positioned in close nontouching adjacent relationship with the free ends of the first plurality of leads. The two leadframes may be separated from each other by a single saw cut.
    Type: Grant
    Filed: July 28, 2014
    Date of Patent: May 10, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Wen Yu Lee, Steven Su
  • Publication number: 20160123915
    Abstract: The present disclosure discloses a chemical oxygen demand detection apparatus. In the apparatus, a working electrode, which is included TiO2 nanotube arrays electrode between 1800-2500 nm in length, is excited the photoelectrocatalysis reaction thereon by a single wavelength UV-LED module and an electrochemical analysis module. A fixing holder is configured to fix a three-electrode module and the UV-LED module to immerse in sample. An electrochemical analysis module, which electrical connect to the three-electrode module, is configured to receive a time-dependent current signal and integrates time-dependent current signal to get total electric charge, and generates a detecting result to indicate chemical oxygen demand value of sample.
    Type: Application
    Filed: April 29, 2015
    Publication date: May 5, 2016
    Inventor: WEN-YU WANG
  • Patent number: 9318856
    Abstract: An electrical receptacle connector provided to connect with an electrical plug connector. The electrical receptacle connector includes a metal shell, an insulation body and a the conductive contact members. The conductive contact members are disposed at the insulation body to connect with the metal shell. The electrical plug connector includes a metal shell and a tubular portion disposed at a front portion of the metal shell. When the electrical plug connector is plugged into the electrical receptacle connector, the surface of the tubular portion of the electrical plug connector is in contact with the conductive contact members.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: April 19, 2016
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Alan MacDougall, Wen-Yu Wang, Ya-Fen Kao
  • Patent number: 9312438
    Abstract: An epitaxial structure of light emitting diode with a current modulation layer, and more specifically, a high-resistivity material is injected to change the current conduction path, and implementation of the main structure is to grow a high-resistivity material (e.g., InxAlyGa1-x-yN) over the N-type conductive layer or the P-type conductive layer till part of current conduction path is exposed through high-temperature H2 in-situ etching in the reacting furnace and to grow the N-type or the P-type conductive layer for coverage. This design for forming a current modulation layer without second epitaxial growth provides the injected current with a better spreading path in the N-type conductive layer and the P-type conductive layer, which more effectively and uniformly injects the current to the active layer and improves luminous efficiency.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: April 12, 2016
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Wen-Yu Lin, Meng-Hsin Yeh, Kechuang Lin
  • Publication number: 20160100490
    Abstract: A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads.
    Type: Application
    Filed: December 10, 2015
    Publication date: April 7, 2016
    Inventors: Wen Yu Lee, Steven Su
  • Patent number: 9299643
    Abstract: An electrically conductive interconnect is provided through an opening in a dielectric layer, electrically connecting two conductive layers. In one embodiment, the interconnect is formed by ruthenium entirely filling the opening in the dielectric layer. In another embodiment, an adhesion layer of titanium is provided in the opening prior to providing the ruthenium. In using this approach, an aspect ratio (i.e., the ratio of the length of the interconnect to the width thereof) of 20:1 or greater is achievable.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: March 29, 2016
    Assignee: Cypress Semiconductor Corporation
    Inventors: Zheng Wang, Connie Wang, Erik Wilson, Wen Yu, Robert Chiu