Abstract: A slide rail assembly includes a first rail, a second rail, a plurality of working members and a damping module. The second rail and the first rail are movable relative to each other. The plurality of working members are arranged on the first rail. The damping module is arranged on the second rail. When the second rail is moved relative to the first rail from a predetermined position along a direction, one of the plurality of working members is configured to interact with the damping module in order to provide damping effect. When the second rail is further moved relative to the first rail along the direction, another one of the plurality of working members is configured to interact with the damping module in order to provide damping effect.

Abstract: The present disclosure provides a manufacturing process of a metal winding, where the manufacturing process includes: cutting a first metal copper foil to form a connector and a pin; performing insulation processing on a surface of at least one of the first metal copper foil and a second metal copper foil; bending the first metal copper foil to form a first metal winding to cover on a magnetic core; and covering the second metal copper foil at least partially on a surface of the first metal copper foil to form a second metal winding, and a pin of the first metal winding passes through the second metal winding.

Abstract: A shiftable image sensor module includes an image sensor and a shiftable circuit element. The shiftable circuit element includes a movable portion, a fixed portion, an elastic connecting portion and a conducting wire portion. The image sensor is disposed on the movable portion. The fixed portion is disposed around the movable portion. The elastic connecting portion is connected to the movable portion and the fixed portion. The conducting wire portion includes a plurality of conducting wire units, and each of the conducting wire units is electrically connected from the fixed portion to the image sensor. Each of the conducting wire units includes at least one conductor line, and the conductor line includes an air insulation layer located on an outer surface of the conductor line.

Abstract: A method of implementing autonomous emergency braking (AEB) for advanced driver-assistance systems (ADAS), the method includes receiving one or more first inputs and identifying one or more targets external to a host vehicle based on the one or more first inputs. The method further includes receiving one or more second inputs related to a turning status of the host vehicle and detecting a U-turn state associated with the host vehicle based on the one or more second inputs. The AEB algorithm may be modified in response to the detected U-turn state, wherein the AEB algorithm initiates an AEB event as necessary to avoid collisions with the one or more identified targets.

Abstract: An optical measurement system measuring optical parameters of an object is provided. The object includes at least two light-transmitting layers. The optical measurement system includes a light source module, an image capture module, and a controller. The light source module emits at least two measurement light beams toward the object. The measurement light beams are respectively incident on the object at different angles. The image capture module receives light spots formed on a sensing surface of the image capture module by at least two first light beams after the measurement light beams are reflected by the object and at least two second light beams after the measurement light beams are refracted and reflected between the object. The controller is electrically connected to the image capture module to obtain positions of the light spots. The controller calculates the optical parameters of the object according to the positions of the light spots.

Abstract: The present disclosure provides an image sensor and control method thereof. The image sensor includes a first transparent conductive layer, a second conductive layer, an optical sensor and a semiconductor substrate. The optical sensor is arranged between the first transparent conductive layer and the second conductive layer, and includes a photoelectric conversion layer, wherein the photoelectric conversion layer has a thickness ranging from 500 to 10000 nm, and the optical sensor has a plurality of absorption spectrum ranges. The semiconductor substrate is below the second conductive layer.

Abstract: An image sensor includes an image sensor die, a light transmitting element, at least one anti-reflection coating and at least one anti-reflection structure. The image sensor die includes a photoelectric conversion layer and a micro lens layer. The micro lens layer is disposed above the photoelectric conversion layer for converging the light onto the photoelectric conversion layer. The light transmitting element is disposed above the micro lens layer, and a gap is formed between the light transmitting element and the micro lens layer, the light passes through the light transmitting element and then travels into the image sensor. The anti-reflection coating is at least disposed on an upper surface of the light transmitting element. The anti-reflection structure is disposed on at least one of a lower surface of the light transmitting element and the micro lens layer.

Abstract: A light-emitting diode includes an N-type cladding layer, and a superlattice structure, an active layer, a P-type electron-blocking layer, and a P-type cladding layer disposed on the N-type cladding layer in such order. The superlattice structure includes at least one first layered element which has a sub-layer made of a nitride-based semiconductor material including Al, and having an energy band gap greater than that of said electron-blocking layer. The P-type electron-blocking layer is made of a nitride-based semiconductor material including Al, and has an energy band gap greater than that of the P-type cladding layer.

Abstract: An imaging lens assembly includes a first optical element and a low-reflection layer. The first optical element has a central opening, and includes a first surface, a second surface and a first outer diameter surface. The first outer diameter surface is connected to the first surface and the second surface. The low-reflection layer is located on at least one of the first surface and the second surface, and includes a carbon black layer, a nano-microstructure and a coating layer. The nano-microstructure is directly contacted with and connected to the carbon black layer, and the nano-microstructure is farther from the first optical element than the carbon black layer from the first optical element. The coating layer is directly contacted with and connected to the nano-microstructure, and the coating layer is farther from the first optical element than the nano-microstructure from the first optical element.

Abstract: A spectrometer includes a plurality of photodetectors, an anti-reflection layer, a grating layer, a distant layer, and a collimator. The anti-reflection layer is disposed on the plurality of photodetectors. The grating layer is disposed above the anti-reflection layer and includes a plurality of grating structures to spread a light into a spectrum to the plurality of photodetectors through the distant layer. The distant layer continuously extends from the grating layer to the anti-reflection layer, the distant layer has a thickness in a range from 400 ?m to 2000 ?m, and a refractive index of the grating layer is greater than a refractive index of the distant layer. The collimator is disposed above the grating layer, in which the collimator is configured to confine an incident angle of the light from a first micro-lens.

Abstract: Energy-collecting display modules are disclosed. The modules include a base substrate with a plurality of sub-pixels, which are laid out in a substantially regular sub-pixel pattern. The sub-pixels are dispersed along the base substrate with sub-pixel spacing regions between individual sub-pixels. The modules also include a photovoltaic region disposed within the sub-pixel spacing regions such that the photovoltaic region minimally obscures a subpixel viewing cone region.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core in a foil structure, and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core in a foil structure, comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring.

Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.

Abstract: Embodiment described herein provide a thermal treatment process following a high-pressure anneal process to keep hydrogen at an interface between a channel region and a gate dielectric layer in a field effect transistor while removing hydrogen from the bulk portion of the gate dielectric layer. The thermal treatment process can reduce the amount of threshold voltage shift caused by a high-pressure anneal. The high-pressure anneal and the thermal treatment process may be performed any time after formation of the gate dielectric layer, thus, causing no disruption to the existing process flow.

Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to a peripheral edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

Abstract: An imaging lens assembly includes optical elements and a light path folding mechanism. The light path folding mechanism is disposed on the optical axis to fold an optical axis at least once, and includes a light folding element, a light blocking structure and a nanostructure layer. The light folding element includes a reflecting surface, an incident surface and an exit surface. The reflecting surface is configured to fold an incident light path towards an exit light path. The light blocking structure is disposed on at least one of the incident surface and the exit surface, and includes a main light blocking portion located on a peripheral portion closest to the optical axis on a cross section passing through the optical axis. The nanostructure layer is continuously distributed over at least one of the incident surface and the exit surface and the main light blocking portion.

Abstract: Structural design of cranial nerve degeneration contrast agent precursor, the cranial nerve degeneration contrast agent prepared using the cranial nerve degeneration contrast agent precursor can be used for positron radiation tomography to detect alpha-synuclein.

Abstract: An intelligent speed regulation system of a connector production apparatus, including: a CCD detection system includes a CCD industrial camera and a CCD detection software module, wherein the CCD industrial camera is configured to shoot a connector plane picture; the CCD detection software module is configured to analyze and identify the connector plane picture, extract true position error value data and generate an error data table file; an intelligent speed regulation software unit configured to calculate an optimal operation speed value of the connector production apparatus according to the true position error value data of a connector; and a PLC apparatus configured to read the optimal operation speed value of the connector production apparatus, and control actions of mechanisms in the connector production apparatus to finish a speed regulation operation. The operation speed of the apparatus can be automatically adjusted according to quality of a connector product.

Abstract: An array type connection structure is disclosed. The structure includes a support and connecting assemblies. There is no signal cable routing in the support. Each connecting assembly penetrates through the support; a first side of each connecting assembly has a connector interface including a plurality of first signal terminals, and the connector interface is configured to be connected to a first electronic component located on a first side of the support. A second side of each connecting assembly is directly connected to a plurality of cables, the plurality of cables are in a one-to-one correspondence with the plurality of second signal terminals of the connecting assembly, and the cable is configured to be connected to a second electronic component located on a second side of the support. The support is provided with a heat dissipation through hole, which is at least partially located between two adjacent connecting assemblies.