Abstract: A slide rail assembly includes a rail member ad a bracket device. The bracket device can be displaced with respect to the rail member and is provided with a first structure. The rail member is provided with a second structure. When the bracket device is at a predetermined position with respect to the rail member, the first structure and the second structure are blocked by each other to prevent the bracket device from being displaced with respect to the rail member in either of a first direction and a second direction.

Abstract: A spiky metal organic framework is provided in the present disclosure. The spiky metal organic framework is formed by a coordination reaction between at least one metal ion and an organic ligand, and includes a body and a plurality of spike-like structures. The body is a spherical shape, and a particle size of the body is 1 ?m to 3 ?m. The spike-like structures are distributed on a surface of the body, a diameter of each spike-like structure is 15 nm to 35 nm, and a length of each spike-like structure is 250 nm to 400 nm.

Abstract: A metal light blocking element includes an outer diameter surface, a first annular surface, a second annular surface and an anti-reflecting layer. The outer diameter surface surrounds the metal light blocking element. The first annular surface is disposed opposite to the outer diameter surface, and the first annular surface is closer to a central axis than the outer diameter surface to the central axis. The second annular surface is disposed opposite to the outer diameter surface, the second annular surface is closer to the central axis than the outer diameter surface to the central axis, and the first annular surface is connected to the second annular surface to form a minimum opening structure. The anti-reflecting layer is disposed on the first annular surface and the second annular surface, and includes a light absorbing layer and a nanostructure layer. The nanostructure layer is disposed on the light absorbing layer.

Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to an edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.

Abstract: Embodiment described herein provide a thermal treatment process following a high-pressure anneal process to keep hydrogen at an interface between a channel region and a gate dielectric layer in a field effect transistor while removing hydrogen from the bulk portion of the gate dielectric layer. The thermal treatment process can reduce the amount of threshold voltage shift caused by a high-pressure anneal. The high-pressure anneal and the thermal treatment process may be performed any time after formation of the gate dielectric layer, thus, causing no disruption to the existing process flow.

Abstract: An imaging lens assembly includes a plurality of optical elements and a lens barrel. At least one optical element of the optical elements is a lens element. The lens element includes an optical effective portion, a peripheral portion, a light-blocking coating layer and a nanostructure layer. The light-blocking coating layer is disposed on at least one surface of the object-side peripheral surface and the image-side peripheral surface and includes a tapered portion. The tapered portion is tapered adjacent to a boundary between the optical effective portion and the peripheral portion. The nanostructure layer is disposed on the optical effective portion and the tapered portion of the light-blocking coating layer, and the nanostructure layer has a plurality of irregular ridge-shaped protrusions. The tapered portion of the light-blocking coating layer forms a light-passing opening adjacent to the boundary along a direction surrounding the optical axis.

Abstract: An optical lens assembly includes at least one optical lens element and at least one optical element. At least one surface of the at least one optical lens element or the at least one optical element includes a low reflection layer, and the low reflection layer includes a rough layer, a nanocrystalline particle and a hydrophobic layer. The nanocrystalline particle is disposed between the rough layer and the hydrophobic layer, and the hydrophobic layer is farther away from the surface of the at least one optical lens element or the at least one optical element than the nanocrystalline particle. A material of the nanocrystalline particle at least includes SiO2.

Abstract: A signal processing method for processing a signal received by a receiver device includes: performing a first correlation calculation on the received signal to obtain a first calculation result; performing carrier frequency offset estimation and compensation on the received signal to obtain a first compensated signal; performing a second correlation calculation on the first compensated signal to obtain a second calculation result; performing carrier frequency offset compensation on the first compensated signal to obtain a second compensated signal; determining whether at least one phase of the second compensated signal is correct; and determining whether at least one decoding result of the second compensated signal is correct. The received signal is determined not a signal conforming to a predetermined standard when the at least one phase of the second compensated signal or the at least one decoding result of the second compensated signal is determined incorrect.

Abstract: A standing training mobile device for carrying a patient to perform active-assisted upright locomotion is provided. The standing training mobile device includes a base, a mobile module, a lifting module, a control module, and a support module. The mobile module and the lifting module are disposed on the base. The control module is disposed on the lifting module and is coupled to the mobile module. The control module includes a manipulation platform and two control assemblies disposed on the manipulation platform for use of the patient. The support module includes a support frame, a first support assembly, a second support assembly, and a third support assembly. The first support assembly, the second support assembly, and the third support assembly are slidably disposed on the support frame respectively. The second support assembly is disposed between the first support assembly and the third support assembly.

Abstract: An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board.

Abstract: An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.

Abstract: An optical lens assembly includes at least one optical element. At least one of the at least one optical element includes a multi-layer coating membrane, and the multi-layer coating membrane is formed by alternately stacking high refractive index layers and low refractive index layers. The multi-layer coating membrane is a dual-bandpass filtering membrane.

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

Abstract: Still frame detection for single pass video data, including: determining that an average quantization parameter of a frame of video data falls below a quantization parameter threshold; determining whether an amount of skipped macroblocks in the frame meets a skipped macroblock threshold; and responsive to the amount of skipped macroblocks exceeding the skipped macroblock threshold, identifying the frame as a still frame.

Abstract: A power supply system with self-excited drive function includes a power supply apparatus, a logic disconnection circuit, a self-boosting circuit, a protection circuit, and a current sensing unit. The logic disconnection circuit is coupled between a positive power wire and a negative power wire. The self-boosting circuit converts a voltage into an auxiliary voltage, and the self-boosting circuit is coupled to the logic disconnection circuit to receive the auxiliary voltage. The current sensing unit outputs a current sensing signal according to a current flowing through the positive power wire or the negative power wire. The protection circuit makes a short circuit or an open circuit between the positive power wire and the negative power wire according to the current sensing signal. The logic disconnection circuit disables or enables the self-boosting circuit according to the voltage between the positive power wire and the negative power wire.

Abstract: The invention discloses a glass carrier having a protection structure, comprising a glass body and a protection layer. The glass body has a top surface, a bottom surface, and a lateral surface. The protection layer covers the lateral surface of the glass body. The protection layer is a hard material with a stiffness coefficient higher than a stiffness coefficient of the glass body. The invention further discloses a manufacturing method of a glass carrier having a protection structure, comprising the following steps: covering the protection layer around the lateral surface of the glass body, wherein the protection layer is the hard material with the stiffness coefficient higher than the stiffness coefficient of the glass body.

Abstract: A water quality monitoring system is provided, including several sensors, several actuators, and an embedded system. The sensors sense environmental parameters and separately output a plurality of sensing signals including the environmental parameters. The actuators change the environmental parameters. The embedded system includes a storage module, a data collection module, a data analysis module, and a control module. The storage module stores a plurality of normal parameter ranges that correspond to the respective environmental parameters. The data collection module is connected to the sensors for receiving the sensing signals. The data analysis module is connected to the storage module and the data collection module to determine whether the sensing signals are abnormal according to the normal parameter ranges and output a determination result. The control module is connected to the data analysis module to control the actuators or output a warning signal according to the determination result.

Abstract: A display device with sensing element includes a substrate having a disposing surface, a plurality of display elements, at least one sensing element, and at least one lighting adjustment element. The display elements are disposed above the disposing surface to present an image. The at least one sensing element disposed above the disposing surface to sense a light brightness projected toward either side of the substrate. The at least one light adjustment element is in signal transmittable connection with the display elements and the at least one sensing element. The at least one light adjustment element adjusts a plurality of control signals inputted into the display elements to determine a contrast of the image.

Abstract: An imaging lens includes a lens element, a light blocking sheet, and a lens barrel accommodating the lens element and the light blocking sheet. The light blocking sheet includes a first object-side surface, a first image-side surface, a first inner ring surface, a first microstructure, and a first nanostructure layer. The first image-side surface is opposite to the first object-side surface. The first inner ring surface is located between the first object-side surface and the first image-side surface and defines a first light passage opening. The first microstructure is disposed on the first object-side surface or the first image-side surface. The first microstructure has a plurality of protrusions. The first nanostructure layer is disposed on the first inner ring surface. The first nanostructure layer has a plurality of ridge-like protrusions extending non-directionally.

Abstract: A fluid storage tank can be configured to store a cooling fluid in a liquid state and a gas state. A first heat exchanger can be configured to release heat into the fluid storage tank. A second heat exchanger can be disposed fluidly downstream of the fluid storage tank and configured to exchange heat between the cooling fluid and a heat load. A pressure control device can be disposed fluidly downstream of the second heat exchanger. One of the first cooling fluid that has been heated by the second heat exchanger or a second cooling fluid different than the first cooling fluid can pass through the first heat exchanger and thereby heat upstream first cooling fluid resident in the fluid storage tank.