Patents by Inventor Adam L. Cohen

Adam L. Cohen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100133109
    Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
    Type: Application
    Filed: November 23, 2009
    Publication date: June 3, 2010
    Inventors: Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Vacit Arat, Christopher A. Bang, John C. Dixon
  • Publication number: 20100121307
    Abstract: Embodiments are directed to microneedle array devices for intradermal and/or transdermal interaction with the body of patient to provide therapeutic, diagnostic or preventative treatment wherein portions of the devices may be formed by multi-layer, multi-material electrochemical fabrication methods and wherein individual microneedles may include valve elements or other elements for controlling interaction (e.g. fluid flow). In some embodiments needles are retractable and extendable from a surface of the device. In some embodiments, interaction occurs automatically with movement across the skin of the patient while in other embodiments interaction is controlled by an operator (e.g. doctor, nurse, technician, or patient).
    Type: Application
    Filed: November 2, 2009
    Publication date: May 13, 2010
    Inventors: Michael S. Lockard, Vacit Arat, Adam L. Cohen, Kirk G. Nielsen
  • Publication number: 20100094320
    Abstract: Embodiments are directed to devices for removing material from interior walls of vessels such as during atherectomy or thrombectomy procedures where the devices includes an ablation tool and at least one ablation tool stabilizer that can be used to radially position the ablation tool at desired locations within a vessel. In some embodiments, the ablation tool may a rotary cutting element that has an axis of rotation that is approximately parallel to the local axis of a vessel to be cleared. In some embodiments, the ablation tool may have a single side and or a top that allows clearing of material and which is capable of both radial positioning and rotational positioning via the stabilization device or devices and which may also be capable of axial motion via the stabilization device.
    Type: Application
    Filed: November 6, 2009
    Publication date: April 15, 2010
    Inventors: Vacit Arat, Richard T. Cohen, Ming Ting Wu, Pavel B. Lembrikov, Adam L. Cohen
  • Patent number: 7686770
    Abstract: Some embodiments of the invention provide an instrument for mechanically removing segments of tissue from a patient during a minimally invasive surgical procedure. An exemplary instrument provides an inlet for receiving tissue a mechanism for cutting away received tissue and for simultaneously moving the cut away tissue away from the inlet to allow additional material to enter the inlet for removal wherein multiple specimens can be captured and eventually removed from the patient's body without the need of removing the instrument after each capture.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: March 30, 2010
    Assignee: Microfabrica Inc.
    Inventor: Adam L. Cohen
  • Publication number: 20100065431
    Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.
    Type: Application
    Filed: November 23, 2009
    Publication date: March 18, 2010
    Inventors: Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Marvin M. Kilgo, III
  • Publication number: 20100065432
    Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.
    Type: Application
    Filed: November 23, 2009
    Publication date: March 18, 2010
    Inventors: Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley, Marvin M. Kilgo, III
  • Patent number: 7674361
    Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: March 9, 2010
    Assignee: Microfabrica Inc.
    Inventor: Adam L. Cohen
  • Publication number: 20100051466
    Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
    Type: Application
    Filed: July 21, 2009
    Publication date: March 4, 2010
    Applicant: Microfabrica Inc.
    Inventors: Dennis R. Smalley, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard
  • Publication number: 20100038253
    Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.
    Type: Application
    Filed: September 15, 2009
    Publication date: February 18, 2010
    Inventors: Uri Frodis, Adam L. Cohen, Michael S. Lockard
  • Publication number: 20100033202
    Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.
    Type: Application
    Filed: July 22, 2009
    Publication date: February 11, 2010
    Inventors: Richard T. Chen, Vacit Arat, Christopher R. Folk, Adam L. Cohen
  • Publication number: 20100022913
    Abstract: The invention includes a forceps and collection assembly for acquiring and storing a plurality of tissue samples in a single pass, and accompanying mechanisms for use with the forceps and collection assembly. The accompanying mechanisms include an endoscope working channel cap assembly configured to minimize compression of a pouch of the forceps and collection assembly as it traverses a seal of the cap assembly, and a flush adapter configured to be coupled to the pouch so as to assist in removing tissue samples in the pouch by flowing fluid through the pouch.
    Type: Application
    Filed: August 5, 2009
    Publication date: January 28, 2010
    Inventors: Adam L. Cohen, John B. Golden, Liem T. Vu
  • Publication number: 20100010492
    Abstract: The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.
    Type: Application
    Filed: June 23, 2009
    Publication date: January 14, 2010
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen, Ming-Ting Wu, Gregory P. Schmitz, Eric C. Miller
  • Publication number: 20100006443
    Abstract: Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.
    Type: Application
    Filed: July 16, 2009
    Publication date: January 14, 2010
    Applicant: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Christopher A. Bang, Marvin M. Kilgo, III
  • Publication number: 20100010525
    Abstract: The present invention relates generally to the field of micro-scale or millimeter scale devices and to the use of multi-layer multi-material electrochemical fabrication methods for producing such devices with particular embodiments relate to shredding devices and more particularly to shredding devices for use in medical applications. In some embodiments, tissue removal devices are used in procedures to removal spinal tissue and in other embodiments, similar devices are used to remove thrombus from blood vessel.
    Type: Application
    Filed: June 23, 2009
    Publication date: January 14, 2010
    Inventors: Michael S. Lockard, Uri Frodis, Adam L. Cohen, Richard T. Chen
  • Patent number: 7640651
    Abstract: Embodiments of the invention provide fabrication processes for the co-fabrication of microprobe arrays along with one or more space transformers wherein the fabrication processes include the forming and adhering of a plurality of layers to previously formed layers and wherein at least a portion of the plurality of layers are formed from at least one structural material and at least one sacrificial material that is at least in part released from the plurality of layers after formation and wherein the space transformer includes a plurality of interconnect elements that connect one side to the array of probes that has a first spacing to another side that has a second spacing where the second spacing is greater than the first spacing. In some embodiments, the fabrication process includes a plurality of electrodeposition operations.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: January 5, 2010
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Vacit Arat, Michael S. Lockard, Christopher A. Bang, Pavel B. Lembrikov
  • Publication number: 20090320990
    Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.
    Type: Application
    Filed: April 28, 2009
    Publication date: December 31, 2009
    Inventors: Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
  • Publication number: 20090301893
    Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.
    Type: Application
    Filed: June 5, 2009
    Publication date: December 10, 2009
    Inventors: Adam L. Cohen, Jill R. Thomassian, Michael S. Lockard, Marvin M. Kilgo, III, Uri Frodis, Dennis R. Smalley
  • Patent number: 7623935
    Abstract: Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: November 24, 2009
    Assignee: University of Southern California
    Inventors: Adam L. Cohen, Jeffrey A. Thompson
  • Patent number: 7618525
    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: November 17, 2009
    Assignee: University of Southern California
    Inventor: Adam L. Cohen
  • Patent number: 7611616
    Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: November 3, 2009
    Assignee: Microfabrica Inc.
    Inventors: Adam L. Cohen, Michael S. Lockard, Dennis R. Smalley