Abstract: To provide a semiconductor storage unit that has a simple structure requiring only a small number of processes to produce, and is provided with a gate insulating film having a memory function. The semiconductor storage unit has a semiconductor layer, two diffusion layer regions forming a source region and a drain region, which are formed on the semiconductor layer, a channel region fixed between the two diffusion layer regions, a gate insulating film that is formed on the channel region, and made of a silicon oxide film containing carbon atoms of 0.1 to 5.0 atomic percent, and a gate electrode formed on the gate insulating film.

Abstract: A memory cell array employs a memory element as a memory cell. The memory element is constructed of a gate electrode formed via a gate insulation film on a semiconductor layer, a channel region arranged under the gate electrode, diffusion regions that are arranged on both sides of the channel region and have a conductive type opposite to that of the channel region, and memory function bodies that are arranged on both sides of the gate electrode and have a function to retain electric charges. When first and second power voltages VCC1 and VCC2 supplied from the outside are lower than a prescribed voltage, a rewrite command to a memory circuit 34 that includes the memory cell array is inhibited by a lockout circuit 33a.

Abstract: There is provided a semiconductor storage device capable of high integration. On a top surface of a semiconductor substrate, a plurality of device isolation regions (16) each extending and meandering in a lateral direction are formed so as to be arrayed with respect to a longitudinal direction, by which active regions are defined between neighboring ones of the device isolation regions (16), respectively. Dopant diffusion regions (source or drain) are formed at individual turnover portions (corresponding to contacts (14), (15)), respectively, of the meanders within the active regions. A plurality of word lines (11) extending straight in the longitudinal direction run on the channel regions within the active regions via a film having memory function, respectively. A first bit line (12) extending straight in the lateral direction runs on the dopant diffusion region (corresponding to contact (14)) provided at a crest-side turnover portion.

Abstract: An integrated circuit device of the present invention includes a substrate on which at least two types of nano wire element are provided. These nano wire elements have functions and materials different from each other. The nano wire elements are constituted by nano wires having sizes differing depending on types of nano wire element. With this, it is possible to dramatically improve a function of the integrated circuit device, as compared with an integrated circuit device including a substrate on which one type of nano wire element is provided.

Abstract: There is provided a semiconductor storage device and portable electronic equipment including a nonvolatile memory element that can easily be miniaturized. The semiconductor storage device includes a memory cell array 21 in which a plurality of memory elements 1 are arranged and a write state machine 32. The memory element 1 includes a gate electrode 104 formed on a semiconductor layer 102 via a gate insulator 103, a channel region arranged below the gate electrode 104, diffusion regions 107a, 107b that are located on both sides of the channel region and have a conductive type opposite to that of the channel region and memory function bodies 109 that are located on both sides of the gate electrode 104 and have a function to retain electric charge. The write state machine 32 can selectively prevent program and erase of data in the memory elements within a predetermined range.

Abstract: A semiconductor storage device has a single gate electrode formed on a semiconductor substrate through a gate insulation film. First and second memory function bodies formed on both sides of the gate electrode. A P-type channel region is formed in a surface of the substrate on the side of the gate electrode. N-type first and second diffusion regions are formed on both sides of the channel region. The channel region is composed of an offset region located under the first and second memory function bodies and a gate electrode beneath region located under the gate electrode. The concentration of a dopant which imparts a P-type conductivity to the offset region is effectively lower than the concentration of a dopant which imparts the P-type conductivity to the gate electrode beneath region. This makes it possible to provide the semiconductor storage device which is easily shrunk in scale.

Abstract: A semiconductor storage device includes a field effect transistor which has a gate insulator, a gate electrode and a pair of source/drain diffusion regions on a semiconductor substrate. The device also includes a coating film made of a dielectric having a function of storing electric charge and formed on the substrate in such a manner as to cover an upper surface and side surfaces of the gate electrode. The device further includes an interlayer insulator formed on and in contact with the coating film. The device still further includes contact members which extend vertically through the interlayer insulator and the coating film on the source/drain diffusion regions and which are electrically connected to the source/drain diffusion regions, respectively. The coating film and the interlayer insulator are made of materials which are selectively etchable to each other. Thus, the issues of overerase and read failures due to the overerase can be solved, and the device reliability can be enhanced.

Abstract: A semiconductor storage element has a memory function body on opposite sides of a gate electrode formed on a semiconductor substrate. Each end of source/drain regions is located in the semiconductor substrate just under the memory function body and offset with respect to an edge of the gate electrode in a gate length direction to improve efficiency of electric charge injection into the memory function body. A storage state in the memory function body is found by detecting a amount of current between the source/drain regions, which current changes depending on the amount of the electric charge retained in the charge retention portion.

Abstract: A semiconductor switching element and a semiconductor storage element each have a gate electrode, a pair of source/drain regions and a channel forming region. Memory function bodies having a function of storing electric charges are provided on opposite sides of the gate electrode of the semiconductor storage element. In the semiconductor storage element, an amount of current that flows from one of the source/drain regions to the other of the source/drain regions upon application of a voltage to the gate electrode is variable depending on an amount of electric charges retained in the memory function body.

Abstract: A display driver includes a display driving part for receiving image data and outputting a drive signal to a display panel; a nonvolatile memory part for storing control information for controlling output of the display driving part; and a control part for controlling output of the display driving part on the basis of the control information, wherein the nonvolatile memory part has a nonvolatile memory cell, and the nonvolatile memory cell includes a gate electrode formed on a semiconductor layer via a gate insulating film, a channel region disposed under the gate electrode, diffusion regions disposed on both sides of the channel region and having a conductive type opposite to that of the channel region, and memory functional units formed on both sides of the gate electrode and having a function for retaining charges.

Abstract: A semiconductor memory device includes: a gate electrode formed on a semiconductor layer via a gate insulating film; a channel region disposed under the gate electrode; diffusion regions disposed on both sides of the channel region and having a conductive type opposite to that of the channel region; and memory functional units formed on both sides of the gate electrode and having the function of retaining charges, wherein each of the diffusion regions has: a high-concentration impurity region disposed so as to be offset from the gate electrode; and a low-concentration impurity region disposed in contact with the high-concentration impurity region so as to overlap with the gate electrode, and an amount of current flowing from one of the diffusion regions to the other diffusion region is changed when a voltage is applied to the gate electrode in accordance with an amount of charges retained in the memory functional units.

Abstract: A hearing aid comprising a data memory includes a plurality of semiconductor memory cells. The semiconductor memory cell has a gate insulating film formed on a semiconductor substrate, on a well region provided in the semiconductor substrate, or on a semiconductor film deposited on an insulator; a single gate electrode formed on the gate insulating film; two memory functional units formed on both sidewalls of the single gate electrode; a channel formation region formed under the single gate electrode; and first diffusion regions disposed on both sides of the channel formation region. The semiconductor memory cell is constituted so as to change an amount of currents flowing from one of the first diffusion regions to the other first diffusion region according to an amount of charges retained in the memory functional unit or a polarization vector when a voltage is applied to the gate electrode.

Abstract: A semiconductor memory device includes a nonvolatile memory section; and a volatile memory section, wherein the nonvolatile memory section includes a nonvolatile memory cell having a gate electrode formed on a semiconductor layer via a gate insulating film, a channel region disposed under the gate electrode, diffusion regions disposed on both sides of the channel region and having a conductive type opposite to that of the channel region, and memory functional units formed on both sides of the gate electrode and having a function for retaining charges.

Abstract: A semiconductor storage device includes a plurality of memory elements and a redundancy circuit. Each of the memory elements includes a gate electrode provided on a semiconductor layer, a gate insulating film intervening between the gate electrode and the semiconductor layer, a channel region provided under the gate electrode, diffusion regions respectively provided at both sides of the channel region, the diffusion regions having a conductivity type which is opposite a conductivity type of the channel region, and memory functioning members respectively provided at both sides of the gate electrode, the memory functioning members having a function of holding charge. The redundancy circuit addresses a single chip memory including cells associated with a plurality of redundant lines and includes a decoder for selecting a redundant row. The semiconductor storage device can permanently inactivate further programming of the redundancy circuit in order to prevent a user from performing inadvertent programming.

Abstract: semiconductor memory device comprising: a semiconductor layer; a gate electrode formed on the semiconductor layer through a gate insulating film; a channel region provided beneath the gate electrode; source/drain diffusion regions having a conductivity type opposite to that of the channel region and provided on both sides of the channel region; and memory function bodies having a function of holding a charge and formed on at least both sides of the gate electrode, wherein the memory function body is formed of a charge holding film and a tunnel insulating film, the tunnel insulating film exists on the side wall portion of the gate electrode and between the charge holding film and the semiconductor layer, and the tunnel insulating film between the charge holding film and the semiconductor layer is thicker than the tunnel insulating film between the charge holding film and the side wall portion of the gate electrode.

Abstract: When an input voltage determining circuit 24 determines that an input voltage exceeds a prescribed voltage, a control circuit 25 of a positive polarity power selector circuit 22 turns on a first switch SW1 and turns off second and third switches SW2 and SW3, thereby supplying the input voltage to a memory cell array 21 via the first switch SW1. When the input voltage determining circuit 24 determines that the input voltage is not higher than the prescribed voltage, the control circuit 25 turns off the first switch SW1 and turns on the second and third switches SW2 and SW3, thereby supplying a voltage from a charge pump 23 via the second and third switches SW2 and SW3. By this operation, the memory element is able to retain storage of two bits or more even if miniaturized, to execute stable operation with a small circuit area and to prevent circuit malfunction attributed to a small current supplied to the memory cell array.

Abstract: A semiconductor storage device includes a semiconductor substrate, a gate insulating film formed on the semiconductor substrate, a single gate electrode formed on the gate insulating film, two charge holding portions formed on both sides of the gate electrode, source/drain regions respectively corresponding to the charge holding portions, and a channel region disposed under the single gate electrode. A memory function implemented by these two charge holding portions and a transistor operation function implemented by the gate insulating film is separated from each other for securing sufficient memory function as well as easily suppressing short channel effect by making the gate insulating film thinner.

Abstract: A volatile memory element and a nonvolatile memory element, each of which is constituted of a field effect transistor, are formed on a single semiconductor chip. The volatile memory element includes a body region, a gate electrode, and two diffusion layer regions, and varies an amount of a current, flowing between the diffusion layer regions in applying a voltage to a gate electrode, in accordance with an amount of electric charge retained in the body region. The nonvolatile memory element includes diffusion layer regions, a gate electrode, and two memory function sections, and varies an amount of a current, flowing between the diffusion layer regions in applying a voltage to the gate electrode, in accordance with an amount of electric charge retained in the memory function sections. Thus, it is possible to form the volatile memory and the nonvolatile memory on a single chip with a simple process.

Abstract: A semiconductor memory device includes: a memory cell having a gate electrode formed on a semiconductor layer via a gate insulating film, a channel region disposed below the gate electrode, a diffusion region disposed on both sides of the channel region and having a conductive type opposite to that of the channel region, and memory functional units formed on both sides of the gate electrode and having a function of retaining charges; and an amplifier, the memory cell and the amplifier being connected to each other so that an output of the memory cell is inputted to the amplifier.

Abstract: A semiconductor device 1910 comprises a semiconductor substrate 100 including an isolation region 101 and an active region 102, a gate electrode 104 provided on the active region 102 via a gate insulating film 103, part of a side of the gate electrode 104 being covered with a gate electrode side wall insulating film 105, and a source region 106 and a drain region 106 provided on opposite sides of the gate electrode 104 via the gate electrode side wall insulating film 105. At least one of the source region 106 and the drain region 106 has a second surface for contacting a contact conductor. The second surface is tilted with respect to a first surface A–A?. An angle between the second surface and a surface of the isolation region is 80 degrees or less.