Patents by Inventor Akihiro Kimura

Akihiro Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10573584
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: February 25, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • Publication number: 20200023737
    Abstract: A vehicle display device pointer includes a translucent pointer that has a pointer main body disposed on a front side of a dial plate having a penetration hole and extending along the dial plate, a shaft protruding toward the penetration hole, and a light guide connecting the pointer main body and the shaft; a lightproof first shielding member that covers a proximal end portion of the pointer main body and the light guide from a front side and a lateral side; and a lightproof second shielding member that covers the proximal end portion of the pointer main body and the light guide from the back side. The pointer main body emits light by light emitted from a light source and incident on the shaft, and the second shielding member has protrusions that protrude toward the front side, and close gaps.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 23, 2020
    Inventors: Hiromichi Kimura, Toshiki Kobayashi, Mao Nakashima, Akihiro Yatsuzuka
  • Patent number: 10497666
    Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 3, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga
  • Publication number: 20190340395
    Abstract: A card reader device A1 includes: a housing 11; an openable shutter 311 that allows or disallows passing of a magnetic card C into the housing 11; a magnetic head 511 that reads magnetic data of the magnetic card C received in the housing 11; an interfering magnetic field generator 711 provided on a rear surface side of the shutter 311 to generate an interfering magnetic field in at least a region R between the magnetic head 511 and the shutter 311; an interfering magnetic field control unit 61 that controls generation of the interfering magnetic field; and an interfering magnetic field alleviating unit 81 that alleviates an influence of the interfering magnetic field on the magnetic head 511 so that the interfering magnetic field generated by the interfering magnetic field generator 711 does not interfere the reading of the magnetic data by the magnetic head 511.
    Type: Application
    Filed: December 27, 2018
    Publication date: November 7, 2019
    Applicant: HITACHI-OMRON TERMINAL SOLUTIONS, CORP.
    Inventors: Hiroyuki SUZUKI, Tomoya KIMURA, Kenichi MASADA, Akihiro TADAMASA
  • Publication number: 20190342490
    Abstract: An electronic device (1) includes a control device (10) configured to carry out: image capture operation determination processing in which a first subject is determined without a user operation and image capture timing is determined; and autofocus processing in which a second subject is determined without a user operation and an image capture device is controlled to focus on the second subject, the autofocus processing being commenced before the image capture operation determination processing finishes.
    Type: Application
    Filed: April 29, 2019
    Publication date: November 7, 2019
    Inventors: KENJI KIMURA, KOICHI YAMAGUCHI, MITSUHIRO HANEDA, AKIHIRO KODAMA
  • Patent number: 10464447
    Abstract: In a slide rail device for use in a vehicle, a lock control member comprises a pair of facing walls which face a pair of side walls of an upper rail and extend in upward and downward direction, and a pair of anti-rattle projections which project from the pair of facing walls toward the pair of side walls of the upper rail.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: November 5, 2019
    Assignee: SHIROKI CORPORATION
    Inventors: Akihiro Kimura, Naoki Hayashi
  • Publication number: 20190288219
    Abstract: Provided is an organic electroluminescent element having high efficiency, a long lifetime, and bending resistance. An organic electroluminescent element includes a light emitting layer and an electron transport layer adjacent to the light emitting layer between a positive electrode and a negative electrode. A host compound of the light emitting layer has an ionization potential deeper than that of a light emitting dopant of the light emitting layer by 0.3 eV or more. At least one organic compound contained in the electron transport layer has a molecular dipole moment of 6.0 debye or more.
    Type: Application
    Filed: October 17, 2017
    Publication date: September 19, 2019
    Inventors: Kazuhiro OIKAWA, Akihiro KIMURA
  • Patent number: 10406942
    Abstract: In a slide rail device for use in a vehicle , a lock spring support portion of an upper rail includes an upward-downward movement restriction support portion. The upward-downward movement restriction support portion includes an open holding portion which is open at a top thereof and holds a supported portion of a lock spring and an uplift prevention projection which is formed projecting into the open holding portion so as to overlap the supported portion of the lock spring, which is held by the open holding portion, in the upward and downward directions.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: September 10, 2019
    Assignee: SHIROKI CORPORATION
    Inventor: Akihiro Kimura
  • Patent number: 10393890
    Abstract: In an X-ray imaging device according to a first embodiment, an X-ray detector has a configuration in which scintillator elements are defined by light-shielding walls in a lattice shape. Among X-rays incident on the X-ray detector, X-rays incident on the light-shielding walls are not converted into scintillator light and are transmitted by the X-ray detector. Accordingly, by causing X-rays to be incident on the X-ray detector in which the scintillator elements are defined by the light-shielding walls in a lattice shape, an area in which X-rays 3a transmitted by a subject M are incident on the X-ray detector can be limited to an arbitrary range. Accordingly, since a detection mask can be omitted in the X-ray imaging device which is used for EI-XPCi, it is possible to reduce a manufacturing cost of the X-ray imaging device.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: August 27, 2019
    Assignee: SHIMADZU CORPORATION
    Inventors: Koichi Tanabe, Shingo Furui, Toshinori Yoshimuta, Kenji Kimura, Akihiro Nishimura, Taro Shirai, Takahiro Doki, Satoshi Sano, Akira Horiba, Toshiyuki Sato
  • Publication number: 20190235610
    Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Akihiro KIMURA, Hiroki MATSUSHITA
  • Publication number: 20190229042
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 25, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • Patent number: 10358434
    Abstract: Provided is a medicament comprising the compound represented by the following general formula (1) or a salt thereof: In the formula, R1, R2, R3, R4, R5, X1, X2, and X3 are defined. Methods for producing various radioactive compounds are also provided.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: July 23, 2019
    Assignees: NIHON MEDI-PHYSICS CO., LTD., KYOTO UNIVERSITY, NATIONAL HOSPITAL ORGANIZATION
    Inventors: Akihiro Izawa, Kei Akama, Yuki Okumura, Yurie Fukui, Nobuya Kobashi, Tsutomu Abe, Yoshihiro Doi, Miho Ikenaga, Hideo Saji, Hiroyuki Kimura, Mitsuhide Naruse
  • Publication number: 20190168447
    Abstract: The method for manufacturing a soluble material for three-dimensional modeling that is used as a material of a support material that supports a three-dimensional object when manufacturing the three-dimensional object with a 3D printer of a fused deposition modeling system, comprising a kneading step of kneading raw materials of the soluble material for three-dimensional modeling by a twin screw extruder having a screw configuration in which a ratio of a total length K of kneading discs to a total length L of an effective screw is 0.20<K/L<0.70 and in which a temperature Tmix of the raw materials of the soluble material for three-dimensional modeling in the kneading step and a glass transition temperature Tg of a base polymer contained in the raw materials of the soluble material for three-dimensional modeling satisfy a formula Tg+80(° C.)<Tmix<Tg+200(° C.).
    Type: Application
    Filed: July 25, 2017
    Publication date: June 6, 2019
    Applicant: KAO CORPORATION
    Inventors: Tomoya TSUBOI, Jouji HIRAI, Takuma KIMURA, Tadanori YOSHIMURA, Akihiro ONOUE
  • Publication number: 20190169169
    Abstract: Provided is a medicament comprising the compound represented by the following general formula (1) or a salt thereof: In the formula, R1, R2, R3, R4, R5, X1, X2, and X3 are defined. Methods for producing various radioactive compounds are also provided.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 6, 2019
    Applicants: NIHON MEDI-PHYSICS CO., LTD., Kyoto University, National Hospital Organization
    Inventors: Akihiro IZAWA, Kei AKAMA, Yuki OKUMURA, Yurie FUKUI, Nobuya KOBASHI, Tsutomu ABE, Yoshihiro DOI, Miho IKENAGA, Hideo SAJI, Hiroyuki KIMURA, Mitsuhide NARUSE
  • Publication number: 20190157193
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA, SHOUJI YASUNAGA, AKIHIRO KOGA
  • Publication number: 20190157239
    Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Inventors: AKIHIRO KIMURA, TAKESHI SUNAGA
  • Patent number: 10295678
    Abstract: A X-ray detector having enhanced X-ray sensitivity, which enables dual energy imaging having high diagnostic performance. This X-ray detector includes: scintillator elements which are partitioned by light blocking walls and which convert low-energy X-rays to light; and scintillator elements which are partitioned by light blocking walls and which convert high-energy X-rays to light. When seen from the direction of incidence of the X-rays, the positional pattern of the light blocking walls and that of the light blocking walls are configured so as not to be in alignment with each other. Accordingly, the X-rays incident on the X-ray detector are converted to light by at least either one of the scintillator elements and are finally outputted as X-ray detection signals.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: May 21, 2019
    Assignee: Shimadzu Corporation
    Inventors: Koichi Tanabe, Shingo Furui, Toshinori Yoshimuta, Kenji Kimura, Akihiro Nishimura, Taro Shirai, Takahiro Doki, Satoshi Sano, Akira Horiba, Toshiyuki Sato
  • Patent number: 10290565
    Abstract: A method includes the steps of: preparing a lead frame including a plurality of die pads, and preparing a plurality of semiconductor chips; disposing each of the semiconductor chips on a respective one of the die pads; forming a sealing resin to cover the die pads and the semiconductor chips; and attaching a heat dissipation plate to the die pads by pressing the heat dissipation plate against the die pads via a resin sheet which is an adhesive layer after the sealing resin is formed.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: May 14, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Akihiro Kimura, Takeshi Sunaga, Shouji Yasunaga, Akihiro Koga
  • Patent number: 10286496
    Abstract: A brazing sheet formed of an aluminum alloy and exhibiting excellent post-brazing strength, corrosion resistance and brazability with a thickness of less than 200 ?m is provided. The brazing sheet includes a core layer, a filler layer of an Al—Si based alloy on one side of the core layer, and a sacrificial layer on the other side of the core layer. The core layer includes more than 1.5 mass % and 2.5 mass % or less of Cu, 0.5 mass % to 2.0 mass % of Mn, Al, and inevitable impurities. The sacrificial layer includes 2.0 mass % to 7.0 mass % of Zn, more than 0.10 mass % and 3.0 mass % or less of Mg, Al, and inevitable impurities. The filler layer and the sacrificial layer each have a thickness of 15 ?m to 50 ?m. A total clad rate of the filler layer and the sacrificial layer is equal to or less than 50%.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: May 14, 2019
    Assignees: Kobe Steel, Ltd., DENSO CORPORATION
    Inventors: Shimpei Kimura, Akihiro Tsuruno, Takahiro Izumi, Yuji Shibuya, Hayaki Teramoto, Shoei Teshima, Manabu Hasegawa, Michiyasu Yamamoto
  • Patent number: 10254817
    Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: April 9, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Akihiro Kimura, Hiroki Matsushita