Abstract: This absorbent sheet (1) has: an absorbent core (10) provided with a liquid-absorbing fiber and a superabsorbent polymer; a liquid-permeable front sheet (11); and a back sheet (12). The maximum thickness of the absorbent sheet (1) is 2.0 mm or less, and both the average value of longitudinal bending rigidity B of the absorbent sheet (1) according to KES and the average value of lateral bending rigidity B of the absorbent sheet (1) according to KES are 0.5 gf·cm2/cm or more.

Abstract: A present invention is a power supply device, comprising a battery unit, a heater configured to generate heat on the basis of power of the battery unit, and a driving unit configured to drive the heater with a driving force according to a temperature of the battery unit.

Abstract: A position inspection system includes a gripping unit that grips an object, a shooting unit that shoots an inspection image of the object gripped by the gripping unit, and a processor. The processor identifies a first rotational amount of the object from the proper position within a plane of the inspection image. The processor identifies, based on control information of the gripping unit, a correction angle between a direction in which a particular portion of the object is facing and a shooting direction of the inspection image. The processor identifies, based on the first rotational amount and the correction angle, a second rotational amount of the object from the proper position about the direction in which the particular portion of the object is facing.

Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.

Abstract: A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.

Abstract: A gripping device according to an embodiment includes a bag body that comes into contact with a workpiece that a magnetic body, the bag body having flexibility and airtightness and accommodating a granular material, an intake and exhaust unit that deforms the bag body to follow the shape of the workpiece, by discharging gas from the bag body or supplying gas to the bag body, when the bag body comes into contact with the workpiece, and a magnetic attraction unit that grips the workpiece by applying a magnetic force to the workpiece in a state where the bag body is deformed to follow the shape of the workpiece.

Abstract: Provided is a vehicle seat having a variable cushion length. The vehicle seat includes: a front panel of metal arranged on a front-end side of a seat cushion to form a frame of the seat cushion; a sliding device allowing a movable portion to be displaceable and including a sliding member of resin displaceable relative to the front panel in seat front-rear directions; and a bracket of metal that is coupled to the front panel in a manner displaceable relative to the front panel in the seat front-rear directions and that is displaced integrally with the sliding member, the bracket transmitting a load acting on the movable portion to the front panel.

Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.

Abstract: A communication device, in which a protocol is workable, the protocol enabling formation of a redundancy configuration including a plurality of communication devices by use of a virtual IP address, includes: a table storage unit configured to store a table in which, for each of a plurality of destination networks connected to the communication device through a path, the virtual IP address and the destination network are associated with each other; and a control unit configured to identify, in response to detection of a failure in the path connected to one of the destination networks, the virtual IP address associated with the destination network by reference to the table and cause the identified virtual IP address to transition to another communication device, the another communication device forming the redundancy configuration with the communication device.

Abstract: The semiconductor device A1 includes a support member 2, a metal part 30 having obverse and reverse surfaces 301-302 spaced in z direction, with the reverse surface 302 bonded to the support member 2, a second bonding layer 42 boding the support member 2 and the metal part 30, a semiconductor element 10 facing the obverse surface 301 and bonded to the metal part 30, and a sealing member 7 covering the support member 2, metal part 30, second bonding layer 42 and semiconductor element 10. The metal part 30 includes a first body 31 of a first material and a second body 32 of a second material, with a boundary between the bodies 31-32. The second material has a linear thermal expansion coefficient smaller than that of the first material. The semiconductor device is improved in reliability by reducing thermal stress from heat generation of the semiconductor element.

Abstract: According to one embodiment, the memory system includes a nonvolatile semiconductor memory, a data buffer, a volatile memory for storing a management table uniquely associates the user data with an address of the physical storage region of nonvolatile semiconductor memory, a controller that carries out a force quit process for writing the user data stored in a data buffer, the management table stored in volatile memory into the nonvolatile semiconductor memory, and a storage battery. The controller starts the force quit process prior to the power supply of the internal power supply regulator is switched from an external power supply to the storage battery.

Abstract: A position inspection system includes a gripping unit that grips an object, a shooting unit that shoots an inspection image of the object gripped by the gripping unit, and a processor. The processor identifies a first rotational amount of the object from the proper position within a plane of the inspection image. The processor identifies, based on control information of the gripping unit, a correction angle between a direction in which a particular portion of the object is facing and a shooting direction of the inspection image. The processor identifies, based on the first rotational amount and the correction angle, a second rotational amount of the object from the proper position about the direction in which the particular portion of the object is facing.

Abstract: A semiconductor device includes a lead, a semiconductor element, and a sealing resin. The lead includes a mounting surface facing in a thickness direction, and an end surface facing in a direction orthogonal to the thickness direction and connected to the mounting surface. The semiconductor element is electrically bonded to the mounting surface. The sealing resin covers the semiconductor element and is in contact with the mounting surface and the end surface. The end surface is formed with a first portion that includes at least one of a projecting portion protruding from the end surface or a recessed portion recessed from the end surface. The projecting portion is located outside an outer edge of the mounting surface as viewed in the thickness direction. The recessed portion is enclosed in the outer edge as viewed in the thickness direction.

Abstract: A communication apparatus which terminates an L2 tunnel and an L3 tunnel includes a table storage unit which stores an ARP table where a broadcast MAC address is set as a destination MAC address linked to a destination IP address, and a transmission unit which acquires the broadcast MAC address as a destination MAC address corresponding to a destination IP address of an IP packet received via the L3 tunnel by referring to the ARP table and transmits a frame to which the broadcast MAC address is added as a destination MAC address, via the L2 tunnel.

Abstract: A semiconductor device includes a substrate, a lead, and a semiconductor element. The substrate has an obverse surface facing in a thickness direction. The lead includes a die pad bonded to the substrate and a terminal connected to the pad. The semiconductor element is bonded to the pad. The bonding layer is disposed between the obverse surface and the pad. The obverse surface includes a first edge extending in a first direction crossing the thickness direction and a second edge extending in a second direction crossing the thickness direction and the first direction. As viewed in the thickness direction, the terminal protrudes outward from the obverse surface relative to the first edge. The distance from the first edge to the bonding layer in the second direction is shorter than the distance from the second edge to the bonding layer in the first direction.

Abstract: An electric power charge and discharge system for an electronic device having a battery, by which the electronic device can be used for a long period of time. In a wireless communication device including a wireless driving portion including a first battery and a wireless charging portion including a second battery, the first battery is charged by electric power from a fixed power supply and the second battery is charged by using electromagnetic waves existing in an external space. Further, the first battery and the second battery are discharged alternately, and during a period in which the first battery is discharged, the second battery is charged.

Abstract: The present invention addresses the problem of providing: a composition for electronic devices in which when a film is formed therefrom, the amount of residual solvents including fluorine-containing solvents within the film is reduced, the effects of residual solvents on a device are minimized, and it is thus possible to achieve high element performance; an ink for electronic devices that is suitable for wet processes and that makes it possible to achieve high liquid stability and element performance as a result of containing the composition for electronic devices; and a method for producing an electronic device. This composition for electronic devices contains a component A and a component B and is characterized in that the component A is a fluorine-containing solvent and the component B is a compound having a structure represented by general formula (1).

Abstract: A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections, the resin encapsulation portion configured to cover the die pad sections and the semiconductor chips, and a heat radiation layer arranged in the recess portion. The heat radiation layer includes an elastic layer exposed toward a direction in which the recess portion is opened. The heat radiation layer directly faces at least a portion of the die pad sections. The elastic layer overlaps with at least a portion of the die pad sections when seen in a thickness direction of the heat radiation layer.