Semiconductor module
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Description
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims
The ornamental design for a semiconductor module, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1021829
Type: Grant
Filed: Sep 13, 2021
Date of Patent: Apr 9, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventors: Yoshihisa Tsukamoto (Kyoto), Akihiro Kimura (Kyoto)
Primary Examiner: Derrick E Holland
Assistant Examiner: Caleb M Baker
Application Number: 29/807,560
Type: Grant
Filed: Sep 13, 2021
Date of Patent: Apr 9, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventors: Yoshihisa Tsukamoto (Kyoto), Akihiro Kimura (Kyoto)
Primary Examiner: Derrick E Holland
Assistant Examiner: Caleb M Baker
Application Number: 29/807,560
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)