Patents by Inventor Akio Furusawa

Akio Furusawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder, electronic component mounted by soldering, and electronic circuit board
    Patent number: 5962133
    Abstract: The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: October 5, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Atsushi Yamaguchi, Kenichiro Suetsugu, Tetsuo Fukushima, Akio Furusawa