Patents by Inventor Akira Furuya

Akira Furuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10877228
    Abstract: An optical coupling device including a plurality of optical fibers, each including first and second bared optical fiber portions, and first and second coated optical fiber portions; a holder including a first component having a first surface and a rear end, a second component disposed on the first surface of the first component and on the first bared optical fiber portions, and an adhesive resin body disposed between the first surface of the first component and the second component; a first resin body in contact with the first coated optical fiber portions and the first component; and a second resin body extending along the rear end of the first component and covering the first coated optical fiber portions. The first resin body is disposed between the adhesive resin body and the second resin body. The second resin body has a lower Young's modulus than the first resin body.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: December 29, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya
  • Patent number: 10795099
    Abstract: An optical connecting device includes: a holder part having first and second holder members and a resin body therebetween; and multiple optical fibers each having first and second resin-uncoated fiber portions and the first and second resin-coated fiber portions. The first resin-uncoated fiber portion is disposed between first portions of the first and second holder members so as to extend in a direction of a first axis and be arranged along a first reference plane. The second resin-uncoated fiber portion and the first resin-coated fiber portion extend between second portions of the first and second holder members. One of the first and second holder members has a through-hole, extending along a second axis intersecting the first axis in the second portions thereof, receiving the resin body. The first and second holder members have first and second inner faces, separated away from the first reference plane, in the second portions, respectively.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: October 6, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya
  • Publication number: 20200073066
    Abstract: An optical coupling device including a plurality of optical fibers, each including a first and a second bared optical fiber portions, and a first and a second coated optical fiber portions; a holder including a first component having a first surface and a rear end, a second component disposed on the first surface and on the first bared optical fiber portions, and an adhesive resin body disposed between the first surface and the second component; a first resin body in contact with the first coated optical fiber portions and the first component; and a second resin body extending along the rear end of the first component and covering the first coated optical fiber portions. The first resin body is disposed between the adhesive resin body and the second resin body. The second resin body has a lower Young's modulus than the first resin body.
    Type: Application
    Filed: August 19, 2019
    Publication date: March 5, 2020
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu HIRANO, Akira FURUYA
  • Patent number: 10564370
    Abstract: A method for fabricating an optical connecting device with a holder having a through hole, multiple optical fibers, a guide member, and a resin body includes steps of: preparing optical-fiber parts to provide the multiple optical fibers; preparing first and second parts to provide the holder, the first and second parts having grooves for providing the through hole of the holder; fixing the parts providing the holder and the optical-fiber parts to each other to form a first product having the through hole produced from the grooves; providing an optical connector tool; positioning a component of the tool in the through hole of the first product to provide the guide member; and thereafter, fixing the component in the through hole with resin to form a second product in which the resin provides the resin body.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: February 18, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya, Koichi Koyama, Masahiro Shibata
  • Publication number: 20200049910
    Abstract: An optical connecting device includes a holder including a first component including a first outer part having a first ridge, a second outer part having a second ridge and an inner part having a bottom of a recess being defined by the first ridge and the second ridge, a second component being located between the first ridge of the first outer part and the second ridge of the second outer part, and an adhesive member being provided between the first component and the second component; and a plurality of optical fibers being arrayed between the bottom of the first component and the second component, wherein the optical fibers, the first ridge, and the second ridge extend in a direction of a first axis, and the first outer part, the inner part, and the second outer part are arrayed in a direction of a second axis crossing the first axis.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 13, 2020
    Applicant: Sumitomo Electric Industries, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya
  • Publication number: 20190361179
    Abstract: An optical connecting device includes: a holder part having first and second holder members and a resin body therebetween; and multiple optical fibers each having first and second resin-uncoated fiber portions and the first and second resin-coated fiber portions. The first resin-uncoated fiber portion is disposed between first portions of the first and second holder members so as to extend in a direction of a first axis and be arranged along a first reference plane. The second resin-uncoated fiber portion and the first resin-coated fiber portion extend between second portions of the first and second holder members. One of the first and second holder members has a through-hole, extending along a second axis intersecting the first axis in the second portions thereof, receiving the resin body. The first and second holder members have first and second inner faces, separated away from the first reference plane, in the second portions, respectively.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 28, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu HIRANO, Akira FURUYA
  • Patent number: 10466566
    Abstract: An optical transmission apparatus includes: a Mach-Zehnder modulator including a first arm waveguide having electrodes; and a driver driving the Mach-Zehnder modulator in response to a pulse amplitude modulated signal, the driver including driving circuits connected to the respective electrodes and each of the driving circuits including a comparator receiving the pulse amplitude modulated signal.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: November 5, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Akira Furuya
  • Publication number: 20190302380
    Abstract: An optical module that enables to couple a semiconductor optical device with a photonic device by a preset angle is disclosed. The optical module provides a housing that installs the semiconductor optical device. The housing provides a bottom with a bottom opening, a ceiling facing the bottom, and at least one side wall connecting the ceiling to the bottom. The side wall includes an outer surface extending along a direction normal to the bottom and an inner surface making an acute angle against the outer surface. The semiconductor optical device is mounted on the inner surface facing the one end thereof against the bottom opening to optically couple with an optical signal through the bottom opening.
    Type: Application
    Filed: March 15, 2019
    Publication date: October 3, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Akira FURUYA, Koichi KOYAMA
  • Patent number: 10411167
    Abstract: A semiconductor light emitting apparatus includes: a stem part having a stem base, a lead terminal, and a metal member having a closed shape, the stem base having an inner portion having a first face, a second face and an opening extending in a first direction from the first face to the second face, and an outer portion surrounding the inner portion, the inner and outer portions being arranged along a reference plane intersecting the first direction, the lead terminal being supported in the opening, and the metal member being disposed on the outer portion so as to surround the inner portion and having a first portion supported by a top face of the outer portion, and a second portion extending outward with reference to an edge of the outer portion; a semiconductor optical element disposed on the inner portion; and a cap disposed on the metal member.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: September 10, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Koichi Koyama, Akira Furuya
  • Patent number: 10371905
    Abstract: An optical processing apparatus includes: a circuit hoard having first and second areas arranged in a direction of a first axis; a semiconductor device having an optical coupling element; an optical connector having an optical fiber and a holder with first and second holder parts, and the optical connector being supported by the second area and the semiconductor device disposed on the first area; and a supporting base having a thickness smaller than that of the semiconductor device. The supporting base is disposed between the second holder part and the second area. The optical fiber has a first optical fiber portion supported by the first holder part, and a second optical fiber portion held by the first and second holder parts. The first optical fiber portion has a tip end and a cladding face which is positioned with respect to the optical coupling element and is separated apart from the semiconductor device.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: August 6, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya
  • Patent number: 10353159
    Abstract: An optical connecting device includes: a holder; an optical fiber supported by the holder; and a guide part supported by the holder. The holder includes first and second resin bodies arranged apart from each other, a supporting part, and a first lid part, a supporting groove, and a groove. The connecting device features: the first resin body being in contact with the optical fiber between the supporting part and the first lid part, the guide part being supported in the groove, the second resin body bonding the guide part to the supporting part, the optical fiber extending in the support groove in the principal surface of the supporting part, and the first lid part being disposed apart from the guide part on the optical fiber, and the optical fiber being between the supporting part and the first lid part.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: July 16, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya
  • Patent number: 10332937
    Abstract: A semiconductor device includes: a printed substrate having a through hole from an upper face to a lower face thereof; a first semiconductor element mounted on the printed substrate; an interposer mounted on the upper face of the printed substrate; a second semiconductor element adjacent to the interposer and arranged to overlap with the through hole; and a bonding wire coupling a first pad to a second pad, the first pad being on an upper face of the interposer and being positioned on the second semiconductor element side, the second pad being on an upper face of the second semiconductor element and being positioned on the interposer side, wherein the interposer has an edge face protruding with respect to a wall face of the through hole of the printed substrate toward the second semiconductor element, and the edge face faces with an edge face of the second semiconductor element.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: June 25, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Akira Furuya, Koichi Koyama, Mitsuharu Hirano
  • Publication number: 20190094647
    Abstract: The apparatus includes: an electric circuit including a first transmission line portion that propagates a second differential signal; a second amplifier that amplifies the second differential signal propagated through the first transmission line portion and outputs the amplified second differential signal as a third differential signal; a second transmission line portion that propagates the third differential signal; and an optical modulator including a first optical phase modulation portion that modulates a phase of an optical signal in response to the second differential signal propagating the first transmission line portion, an optical delay portion that delays the phase of the optical signal modulated, and a second optical phase modulation portion that modulates the phase of the optical signal delayed, in response to the third differential signal.
    Type: Application
    Filed: September 26, 2018
    Publication date: March 28, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Taizo TATSUMI, Akira Furuya
  • Patent number: 10241378
    Abstract: An optical modulation device includes: a Mach-Zehnder modulator including a semiconductor waveguide; a plurality of phase modulators that are spaced from each other; a first amplifier that is coupled with an input transmission line transmitting an electrical signal, has an input impedance substantially equal to a characteristic impedance of the input transmission line; a first interconnection that is coupled to the first amplifier and transmits the electrical signal to a first end of one of the plurality of phase modulators that is provided on an input side of the Mach-Zehnder modulator; a second interconnection that is coupled to the first amplifier and transmits the electrical signal to a first end of the other of the plurality of phase modulators that is provided on an output side of the Mach-Zehnder modulator; and a plurality of termination resistors respectively coupled to second ends of the plurality of phase modulators.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 26, 2019
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Akira Furuya, Taizo Tatsumi
  • Publication number: 20190086621
    Abstract: An optical processing apparatus includes: a circuit board having first and second areas arranged in a direction of a first axis; a semiconductor device having an optical coupling element; an optical connector having an optical fiber and a holder with first and second holder parts, and the optical connector being supported by the second area and the semiconductor device disposed on the first area; and a supporting base having a thickness smaller than that of the semiconductor device. The supporting base is disposed between the second holder part and the second area. The optical fiber has a first optical fiber portion supported by the first holder part, and a second optical fiber portion held by the first and second holder parts. The first optical fiber portion has a tip end and a cladding face which is positioned to the optical coupling element and separated apart from the semiconductor device.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 21, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu HIRANO, Akira Furuya
  • Publication number: 20190070805
    Abstract: A method for fabricating an optical connecting device includes: preparing a product for an optical connecting device which includes first and second parts for a holder, and optical fibers extending in a direction of a first axis between first faces of the first and second parts, the first and second parts of the product being arranged in a direction of a second axis intersecting that of the first axis, the first faces of the first part and the first face of the second part extending in the direction of the first axis and a direction of a third axis, and the third axis intersecting the direction of the first axis and the direction of the second axis; and moving one of a processing device and the product relative to the other to process the product in the direction of the second axis so as to reach the optical fibers.
    Type: Application
    Filed: September 4, 2018
    Publication date: March 7, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya
  • Publication number: 20190067260
    Abstract: A semiconductor device includes: an interposer mounted on an upper surface of a printed board; a first semiconductor element mounted on an upper surface of the interposer; a second semiconductor element mounted on the upper surface of the printed board and performing conversion between an optical signal and an electrical signal; and a bonding wire connecting a first pad and a second pad, the first pad being provided on the upper surface of the interposer, the second pad being provided on an upper surface of the second semiconductor element, the first semiconductor element lowers a speed of an electrical signal input from the second semiconductor element and outputs the electrical signal to the printed board, and increases a speed of an electrical signal and outputs the electrical signal to the second semiconductor element via the interposer and the bonding wire.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 28, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Koichi KOYAMA, Akira FURUYA
  • Publication number: 20190033534
    Abstract: An optical fiber connector that optically couples a first optical fiber to a second optical fiber is disclosed. The optical fiber connector includes a first ferrule having a first through hole and a first end face, the first through hole receiving the first optical fiber; a second ferrule having a second through hole and a second end face, the second through hole receiving the second optical fiber, the second end face being apart from the first end face with a gap; a sleeve having a third through hole receiving the the first ferrule and the second ferrule; and an adhesive provided in the gap between the first and the second end faces. The first ferrule and the second ferrule are to be fixed to an inner peripheral surface of the sleeve with the adhesive.
    Type: Application
    Filed: July 11, 2018
    Publication date: January 31, 2019
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Koichi KOYAMA, Akira FURUYA
  • Publication number: 20180372970
    Abstract: An optical connecting device includes: a holder having a first end, a second end, and a through hole extending in a direction of a first axis from one of the first end and the second end to the other; multiple optical fibers held by the holder; a guide member extending in the through hole; and a resin body separating a side face of the guide member from an inner face of the through hole.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 27, 2018
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Mitsuharu Hirano, Akira Furuya, Koichi Koyama, Masahiro Shibata
  • Publication number: 20180372966
    Abstract: An optical processing device includes a semiconductor optical device, and an optical device provided on the semiconductor optical device. The optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has first to third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along an axis intersecting the first end surface. The third end surface is oblique with respect to the axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers have facets exposed at the third end surface. The intermediate layer embeds roughness in the exposed facets. It has a refractive index comparable to that of the claddings of the optical fibers.
    Type: Application
    Filed: August 30, 2018
    Publication date: December 27, 2018
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yasunori MURAKAMI, Akira FURUYA, Koichi KOYAMA