Abstract: An element module includes a cooler, a plurality of elements, and a conductive member. The cooler includes a first element disposition portion and a second element disposition portion which are provided on both sides in a predetermined direction. The plurality of elements are disposed in each of the first element disposition portion and the second element disposition portion. The conductive member is disposed in a space portion of the cooler. The space portion penetrates the cooler between the plurality of elements in each of the first element disposition portion and the second element disposition portion. The space portion allows the first element disposition portion and the second element disposition portion to communicate with each other. The conductive member is connected to the element of the first element disposition portion and the element of the second element disposition portion.

Abstract: A vehicle rear structure includes an interposed member and an attachment part. The interposed member is disposed at a center area in a vehicle width direction of the vehicle under a floor panel of a vehicle body of the vehicle, and interposed between at least one under-floor component of the vehicle and the vehicle body. The attachment part is provided for a hitch member for a trailer. The attachment part is disposed at a rear end of the interposed member and at a center area of the interposed member in the vehicle width direction.

Abstract: A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

Abstract: A laminate including a metallic base material, a first nickel-containing plating film layer formed on the metallic base material, a gold plating film layer formed on the first nickel-containing plating film layer, a second nickel-containing plating film layer formed on the gold plating film layer, and a nickel fluoride film layer formed on the second nickel-containing plating film layer. Also disclosed is a method for producing the laminate as well as a constituent member of a semiconductor production device including the laminate.

Abstract: A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a fluorinated passive film having a thickness of 8 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

Abstract: A semiconductor optical device in which a light emitting region that emits light and a reflecting region that reflects the light to the light emitting region side are integrated includes a core layer that is provided in the light emitting region, and a waveguide layer that is provided in the reflecting region, that is optically coupled to the core layer, and that has a band gap that is larger than energy of the light. The reflecting region has a first thyristor that overlaps the waveguide layer in a direction that intersects a propagation direction of the light.

Abstract: An optical coupling device including a plurality of optical fibers, each including first and second bared optical fiber portions, and first and second coated optical fiber portions; a holder including a first component having a first surface and a rear end, a second component disposed on the first surface of the first component and on the first bared optical fiber portions, and an adhesive resin body disposed between the first surface of the first component and the second component; a first resin body in contact with the first coated optical fiber portions and the first component; and a second resin body extending along the rear end of the first component and covering the first coated optical fiber portions. The first resin body is disposed between the adhesive resin body and the second resin body. The second resin body has a lower Young's modulus than the first resin body.

Abstract: An optical connecting device includes: a holder part having first and second holder members and a resin body therebetween; and multiple optical fibers each having first and second resin-uncoated fiber portions and the first and second resin-coated fiber portions. The first resin-uncoated fiber portion is disposed between first portions of the first and second holder members so as to extend in a direction of a first axis and be arranged along a first reference plane. The second resin-uncoated fiber portion and the first resin-coated fiber portion extend between second portions of the first and second holder members. One of the first and second holder members has a through-hole, extending along a second axis intersecting the first axis in the second portions thereof, receiving the resin body. The first and second holder members have first and second inner faces, separated away from the first reference plane, in the second portions, respectively.

Abstract: An optical coupling device including a plurality of optical fibers, each including a first and a second bared optical fiber portions, and a first and a second coated optical fiber portions; a holder including a first component having a first surface and a rear end, a second component disposed on the first surface and on the first bared optical fiber portions, and an adhesive resin body disposed between the first surface and the second component; a first resin body in contact with the first coated optical fiber portions and the first component; and a second resin body extending along the rear end of the first component and covering the first coated optical fiber portions. The first resin body is disposed between the adhesive resin body and the second resin body. The second resin body has a lower Young's modulus than the first resin body.

Abstract: A method for fabricating an optical connecting device with a holder having a through hole, multiple optical fibers, a guide member, and a resin body includes steps of: preparing optical-fiber parts to provide the multiple optical fibers; preparing first and second parts to provide the holder, the first and second parts having grooves for providing the through hole of the holder; fixing the parts providing the holder and the optical-fiber parts to each other to form a first product having the through hole produced from the grooves; providing an optical connector tool; positioning a component of the tool in the through hole of the first product to provide the guide member; and thereafter, fixing the component in the through hole with resin to form a second product in which the resin provides the resin body.

Abstract: An optical connecting device includes a holder including a first component including a first outer part having a first ridge, a second outer part having a second ridge and an inner part having a bottom of a recess being defined by the first ridge and the second ridge, a second component being located between the first ridge of the first outer part and the second ridge of the second outer part, and an adhesive member being provided between the first component and the second component; and a plurality of optical fibers being arrayed between the bottom of the first component and the second component, wherein the optical fibers, the first ridge, and the second ridge extend in a direction of a first axis, and the first outer part, the inner part, and the second outer part are arrayed in a direction of a second axis crossing the first axis.

Abstract: An optical connecting device includes: a holder part having first and second holder members and a resin body therebetween; and multiple optical fibers each having first and second resin-uncoated fiber portions and the first and second resin-coated fiber portions. The first resin-uncoated fiber portion is disposed between first portions of the first and second holder members so as to extend in a direction of a first axis and be arranged along a first reference plane. The second resin-uncoated fiber portion and the first resin-coated fiber portion extend between second portions of the first and second holder members. One of the first and second holder members has a through-hole, extending along a second axis intersecting the first axis in the second portions thereof, receiving the resin body. The first and second holder members have first and second inner faces, separated away from the first reference plane, in the second portions, respectively.

Abstract: An optical transmission apparatus includes: a Mach-Zehnder modulator including a first arm waveguide having electrodes; and a driver driving the Mach-Zehnder modulator in response to a pulse amplitude modulated signal, the driver including driving circuits connected to the respective electrodes and each of the driving circuits including a comparator receiving the pulse amplitude modulated signal.

Abstract: An optical module that enables to couple a semiconductor optical device with a photonic device by a preset angle is disclosed. The optical module provides a housing that installs the semiconductor optical device. The housing provides a bottom with a bottom opening, a ceiling facing the bottom, and at least one side wall connecting the ceiling to the bottom. The side wall includes an outer surface extending along a direction normal to the bottom and an inner surface making an acute angle against the outer surface. The semiconductor optical device is mounted on the inner surface facing the one end thereof against the bottom opening to optically couple with an optical signal through the bottom opening.

Abstract: A semiconductor light emitting apparatus includes: a stem part having a stem base, a lead terminal, and a metal member having a closed shape, the stem base having an inner portion having a first face, a second face and an opening extending in a first direction from the first face to the second face, and an outer portion surrounding the inner portion, the inner and outer portions being arranged along a reference plane intersecting the first direction, the lead terminal being supported in the opening, and the metal member being disposed on the outer portion so as to surround the inner portion and having a first portion supported by a top face of the outer portion, and a second portion extending outward with reference to an edge of the outer portion; a semiconductor optical element disposed on the inner portion; and a cap disposed on the metal member.

Abstract: An optical processing apparatus includes: a circuit hoard having first and second areas arranged in a direction of a first axis; a semiconductor device having an optical coupling element; an optical connector having an optical fiber and a holder with first and second holder parts, and the optical connector being supported by the second area and the semiconductor device disposed on the first area; and a supporting base having a thickness smaller than that of the semiconductor device. The supporting base is disposed between the second holder part and the second area. The optical fiber has a first optical fiber portion supported by the first holder part, and a second optical fiber portion held by the first and second holder parts. The first optical fiber portion has a tip end and a cladding face which is positioned with respect to the optical coupling element and is separated apart from the semiconductor device.

Abstract: An optical connecting device includes: a holder; an optical fiber supported by the holder; and a guide part supported by the holder. The holder includes first and second resin bodies arranged apart from each other, a supporting part, and a first lid part, a supporting groove, and a groove. The connecting device features: the first resin body being in contact with the optical fiber between the supporting part and the first lid part, the guide part being supported in the groove, the second resin body bonding the guide part to the supporting part, the optical fiber extending in the support groove in the principal surface of the supporting part, and the first lid part being disposed apart from the guide part on the optical fiber, and the optical fiber being between the supporting part and the first lid part.

Abstract: A semiconductor device includes: a printed substrate having a through hole from an upper face to a lower face thereof; a first semiconductor element mounted on the printed substrate; an interposer mounted on the upper face of the printed substrate; a second semiconductor element adjacent to the interposer and arranged to overlap with the through hole; and a bonding wire coupling a first pad to a second pad, the first pad being on an upper face of the interposer and being positioned on the second semiconductor element side, the second pad being on an upper face of the second semiconductor element and being positioned on the interposer side, wherein the interposer has an edge face protruding with respect to a wall face of the through hole of the printed substrate toward the second semiconductor element, and the edge face faces with an edge face of the second semiconductor element.

Abstract: The apparatus includes: an electric circuit including a first transmission line portion that propagates a second differential signal; a second amplifier that amplifies the second differential signal propagated through the first transmission line portion and outputs the amplified second differential signal as a third differential signal; a second transmission line portion that propagates the third differential signal; and an optical modulator including a first optical phase modulation portion that modulates a phase of an optical signal in response to the second differential signal propagating the first transmission line portion, an optical delay portion that delays the phase of the optical signal modulated, and a second optical phase modulation portion that modulates the phase of the optical signal delayed, in response to the third differential signal.

Abstract: An optical modulation device includes: a Mach-Zehnder modulator including a semiconductor waveguide; a plurality of phase modulators that are spaced from each other; a first amplifier that is coupled with an input transmission line transmitting an electrical signal, has an input impedance substantially equal to a characteristic impedance of the input transmission line; a first interconnection that is coupled to the first amplifier and transmits the electrical signal to a first end of one of the plurality of phase modulators that is provided on an input side of the Mach-Zehnder modulator; a second interconnection that is coupled to the first amplifier and transmits the electrical signal to a first end of the other of the plurality of phase modulators that is provided on an output side of the Mach-Zehnder modulator; and a plurality of termination resistors respectively coupled to second ends of the plurality of phase modulators.