Abstract: A method for fabricating an optical transmitting apparatus includes steps of: preparing a temporary assembly including a stub device having an optical fiber, a magnetic guide member with a hole, and a holder, an optical connector, and an magnetic alignment member extending in a direction of an axis; applying a magnetic force to the alignment member of the temporary assembly with a magnet device of an electromagnet or a permanent magnet; carrying out optical alignment of the stub device with an optical device by active alignment, the stub device being optically coupled to the optical connector, and; separating the optical connector and the alignment member apart from the stub device. The alignment member is disposed in the hole of the stub device and a guide hole of the optical connector in the temporary assembly such that the alignment member aligns the stub device with the optical connector.

Abstract: An optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has a first to a third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along a first axis intersecting the first end surface. The third end surface is oblique with respect to the first axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers extend in the supporting block and is exposed to the third end surface. The reflecting plate is provided on the third end surface via the intermediate layer. Light from the optical fiber passes through the third end surface which has some roughness, and is reflected by a surface of the reflecting plate.

Abstract: An optical module includes a bench part and a cap on the bench part. The bench part includes a bench, an electrode, a semiconductor optical device and a lens. The electrode is disposed on the first and second areas of the bench. The semiconductor optical device is disposed on the electrode in the first area. The cap includes a pad electrode, a conductor, a ceiling, a front wall, a first side wall, a first wing, and a rear wall. The first wing is disposed on the first side wall. The pad electrode is disposed on the first wing, and the conductor is disposed on the cap base and connected to the pad electrode. The electrode is electrically connected to the conductor on the second area. The ceiling extends along a first plane. The front wall has a front outer face extending along a second plane intersecting the first plane.

Abstract: A method for fabricating an optical transmitting apparatus includes steps of: preparing a temporary assembly including a stub device having an optical fiber, a magnetic guide member with a hole, and a holder, an optical connector, and an magnetic alignment member extending in a direction of an axis; applying a magnetic force to the alignment member of the temporary assembly with a magnet device of an electromagnet or a permanent magnet; carrying out optical alignment of the stub device with an optical device by active alignment, the stub device being optically coupled to the optical connector, and; separating the optical connector and the alignment member apart from the stub device. The alignment member is disposed in the hole of the stub device and a guide hole of the optical connector in the temporary assembly such that the alignment member aligns the stub device with the optical connector.

Abstract: An optical connecting part includes: a holder including an end face for optical connection, one or more optical waveguides and a through-hole, the optical waveguides having a portion extending from the end face in a direction of a first axis, the through-hole extending from the end face in the direction of the first axis; and a coating disposed on an inner surface of the through-hole, the coating having oil repellency. The coating on the inner surface of the through-hole forms a guide hole.

Abstract: A method for manufacturing an optical-assembly includes the steps of preparing an optical connector including a base having an optical waveguide and a first support block holding a first optical fiber, the base having first and second end surfaces; aligning the optical connector to the optical device, the first end surface of the base facing to the optical device, the first support block being fixed to the base in a removable manner; after aligning the optical connector, fixing the base to the optical device; after fixing the base, removing the first support block from the base; after removing the first support block, re-fixing a second support block to the base, the second end surface of the base facing to the second support block. The second support block has an optical fiber and a through hole. The base has a guide pin inserted to the through hole in the re-fixing step.

Abstract: An optical communication apparatus includes a fiber stub, a planar waveguide device optically connected to the fiber stub, and a resin body. The fiber stub includes a holder and an optical fiber held by the holder, the holder having first and second portions arranged along a first reference plane. The resin body connects the planar waveguide device to the fiber stub. The first portion of the holder has first and second end faces, and has a first hole for the optical fibers extending from first to second end faces. The second portion of the holder has third and fourth end faces, and has a second hole for a guide pin. A first distance between the first and the second end faces is larger than a second distance between the third and fourth end faces.

Abstract: An optical device comprises optical fibers and a holder. The holder includes one end portion, an other end portion, and a supporting portion extending in a direction of a first axis from the one end portion to the other end portion. The one end portion includes a first end face extending along a first reference plane intersecting with the first axis from a side of the holder to cladding regions of the optical fibers; a second end face extending along a second reference plane from the one end portion to the other end portion; and a third end face extending along a third reference plane inclined at an angle of less than 90 degrees and more than zero degrees relative to the first axis. The cladding regions of the optical fibers are disposed at the second end face. The optical fibers have respective tips disposed at the third end face.

Abstract: An optical module includes a bench part and a cap on the bench part. The bench part includes a bench, an electrode, a semiconductor optical device and a lens. The electrode is disposed on the first and second areas of the bench. The semiconductor optical device is disposed on the electrode in the first area. The cap includes a base, a pad electrode, a conductor, a ceiling, a front wall, and a rear wall. The pad electrode is disposed on the base. The conductor is disposed on the base and connected to the pad electrode. The electrode is electrically connected to the conductor on the second area. The ceiling extends along a first plane. The front wall has a front outer face extending along a second plane intersecting the first plane. The rear wall extends from the ceiling in a direction from the cap to the bench.

Abstract: An electrostatic chuck device including: a plurality of adsorption areas having an electrode generating electrostatic attractive force; and a control portion controlling the electrostatic attractive force against each of the plurality of the adsorption areas independently of other adsorption areas.

Abstract: An optical module includes: a bench part including a bench having a principal surface including first and second areas arranged in a direction of a first axis, a semiconductor optical device disposed on the first area, and a lens disposed on the first area; and a cap including a base made of silicon, the cap being disposed on the bench part. The cap has a cavity containing the semiconductor optical device and the lens, and includes a ceiling extending along a first reference plane, a front wall extending from the ceiling along a second reference plane, and a rear wall extending from the ceiling in a direction from the cap to the bench. The semiconductor optical device, the lens and the cap are arranged along an optical reference plane. The second reference plane is inclined with respect to the first reference plane.

Abstract: An optical device comprises optical fibers and a holder. The holder includes one end portion, another end portion, and a supporting portion extending in a direction of a first axis from the one end portion to the other end portion. The one end portion includes a first end face extending along a first reference plane intersecting with the first axis from a side of the holder to cladding regions of the optical fibers; a second end face extending along a second reference plane from the one end portion to the other end portion; and a third end face extending along a third reference plane inclined at an angle of less than 90 degrees and more than zero degrees relative to the first axis. The cladding regions of the optical fibers are disposed at the second end face. The optical fibers have respective tips disposed at the third end face.

Abstract: A method for producing an optical assembly includes the steps of forming an optical semiconductor device including a substrate, a recess and an first optical waveguide, the optical semiconductor device having a principal surface, the recess extending from the principal surface to a middle portion of the substrate; forming an optical waveguide device including a through-hole and a second optical waveguide; positioning the optical semiconductor device and the optical waveguide device so that the principal surface of the optical semiconductor device and a back surface of the optical waveguide device face each other; aligning the optical semiconductor device and the optical waveguide device by inserting a guide pin into the through-hole and the recess so that the first optical waveguide is optically coupled with the second optical waveguide; and joining the optical semiconductor device and the optical waveguide device to each other.

Abstract: An axial gap-type power generator has: a rotor fixed to a crankshaft of an engine; a stator fixed to a crankcase of the engine and opposing the rotor across a spacing in an axial direction; and a housing to house the rotor and the stator and to fix the stator. The stator is configured by arraying, in a peripheral direction, a plurality of coils C each configured through winding of a winding about a stator core. The housing is formed of a resin-based material. Winding ends of the coils are wired using connector fittings each of which is formed of a metal plate, is held on the housing, and has a clamp into which the winding end is inserted and clamped.

Abstract: An optical signal processor including: optical fibers arranged in a first direction, each optical fiber having a side surface; a flexible holding member covering the side surfaces of the optical fibers; a first optical connector having a first end face and a second end face; a second optical connector having a third end face and a fourth end face; a supporting block disposed under the first optical connector; and an optical integrated circuit including optical couplers facing the third end face of the second optical connector and optical waveguides, the optical couplers being optically coupled to the optical fibers. The optical fibers extend from the second end face in a second direction. The optical fibers extend from the fourth end face in a third direction that intersects with the second direction. The flexible holding member has a bending portion located between the first optical connector and the second optical connector.

Abstract: An optical signal processor including: optical fibers arranged in a first direction, each optical fiber having a side surface; a flexible holding member covering the side surfaces of the optical fibers; a first optical connector having a first end face and a second end face; a second optical connector having a third end face and a forth end face; a supporting block disposed under the first optical connector; and an optical integrated circuit including optical couplers facing the third end face of the second optical connector and optical waveguides, the optical couplers being optically coupled to the optical fibers. The optical fibers extends from the second end face in a second direction. The optical fibers extend from the forth end face in a third direction that intersects with the second direction. The flexible holding member has a bending portion located between the first optical connector and the second optical connector.

Abstract: A semiconductor optical waveguide device includes a substrate having a first area and a second area, and first, second, and semiconductor mesas on the substrate. The first semiconductor mesa includes a cladding layer and a first mesa portion on the second area, the first mesa portion including first and second portions. The second semiconductor mesa includes an intermediate layer, a first core layer, and first and second mesa portions on the first and second areas, respectively. The third semiconductor mesa includes a second core layer, and first and second mesa portions having a greater width than that of the second semiconductor mesa. The first portion of the first semiconductor mesa has a substantially same width as the second mesa portion of the second semiconductor mesa. The first core layer is optically coupled to the second core layer through the intermediate layer disposed between the first and second core layers.

Abstract: A method for manufacturing an optical-assembly includes the steps of preparing an optical connector including a base having an optical waveguide and a first support block holding a first optical fiber, the base having first and second end surfaces; aligning the optical connector to the optical device, the first end surface of the base facing to the optical device, the first support block being fixed to the base in a removable manner; after aligning the optical connector, fixing the base to the optical device; after fixing the base, removing the first support block from the base; after removing the first support block, re-fixing a second support block to the base, the second end surface of the base facing to the second support block. The second support block has an optical fiber and a through hole. The base has a guide pin inserted to the through hole in the re-fixing step.

Abstract: A method for producing an optical assembly includes the steps of forming an optical semiconductor device including a substrate, a recess and an first optical waveguide, the optical semiconductor device having a principal surface, the recess extending from the principal surface to a middle portion of the substrate; forming an optical waveguide device including a through-hole and a second optical waveguide; positioning the optical semiconductor device and the optical waveguide device so that the principal surface of the optical semiconductor device and a back surface of the optical waveguide device face each other; aligning the optical semiconductor device and the optical waveguide device by inserting a guide pin into the through-hole and the recess so that the first optical waveguide is optically coupled with the second optical waveguide; and joining the optical semiconductor device and the optical waveguide device to each other.

Abstract: A method for fabricating a semiconductor device includes performing thermal cleaning for a surface of a silicon substrate in an atmosphere including hydrogen under a condition that a thermal cleaning temperature is higher than or equal to 700° C. and is lower than or equal to 1060° C., and a thermal cleaning time is longer than or equal to 5 minutes and is shorter than or equal to 15 minutes; forming a first AlN layer on the substrate with a first V/III source ratio, the forming of the first AlN layer including supplying an Al source to the surface of the substrate without supplying a N source, and supplying both the Al source and the N source; forming a second AlN layer on the first AlN layer with a second V/III source ratio that is greater than the first ratio; and forming a GaN-based semiconductor layer on the second AlN layer.