Abstract: An optical processing apparatus includes: a circuit board having first and second areas arranged in a direction of a first axis; a semiconductor device having an optical coupling element; an optical connector having an optical fiber and a holder with first and second holder parts, and the optical connector being supported by the second area and the semiconductor device disposed on the first area; and a supporting base having a thickness smaller than that of the semiconductor device. The supporting base is disposed between the second holder part and the second area. The optical fiber has a first optical fiber portion supported by the first holder part, and a second optical fiber portion held by the first and second holder parts. The first optical fiber portion has a tip end and a cladding face which is positioned to the optical coupling element and separated apart from the semiconductor device.

Abstract: A method for fabricating an optical connecting device includes: preparing a product for an optical connecting device which includes first and second parts for a holder, and optical fibers extending in a direction of a first axis between first faces of the first and second parts, the first and second parts of the product being arranged in a direction of a second axis intersecting that of the first axis, the first faces of the first part and the first face of the second part extending in the direction of the first axis and a direction of a third axis, and the third axis intersecting the direction of the first axis and the direction of the second axis; and moving one of a processing device and the product relative to the other to process the product in the direction of the second axis so as to reach the optical fibers.

Abstract: A semiconductor device includes: an interposer mounted on an upper surface of a printed board; a first semiconductor element mounted on an upper surface of the interposer; a second semiconductor element mounted on the upper surface of the printed board and performing conversion between an optical signal and an electrical signal; and a bonding wire connecting a first pad and a second pad, the first pad being provided on the upper surface of the interposer, the second pad being provided on an upper surface of the second semiconductor element, the first semiconductor element lowers a speed of an electrical signal input from the second semiconductor element and outputs the electrical signal to the printed board, and increases a speed of an electrical signal and outputs the electrical signal to the second semiconductor element via the interposer and the bonding wire.

Abstract: An optical fiber connector that optically couples a first optical fiber to a second optical fiber is disclosed. The optical fiber connector includes a first ferrule having a first through hole and a first end face, the first through hole receiving the first optical fiber; a second ferrule having a second through hole and a second end face, the second through hole receiving the second optical fiber, the second end face being apart from the first end face with a gap; a sleeve having a third through hole receiving the the first ferrule and the second ferrule; and an adhesive provided in the gap between the first and the second end faces. The first ferrule and the second ferrule are to be fixed to an inner peripheral surface of the sleeve with the adhesive.

Abstract: An optical processing device includes a semiconductor optical device, and an optical device provided on the semiconductor optical device. The optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has first to third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along an axis intersecting the first end surface. The third end surface is oblique with respect to the axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers have facets exposed at the third end surface. The intermediate layer embeds roughness in the exposed facets. It has a refractive index comparable to that of the claddings of the optical fibers.

Abstract: An optical connecting device includes: a holder having a first end, a second end, and a through hole extending in a direction of a first axis from one of the first end and the second end to the other; multiple optical fibers held by the holder; a guide member extending in the through hole; and a resin body separating a side face of the guide member from an inner face of the through hole.

Abstract: A method for fabricating an optical transmitting apparatus includes steps of: preparing a temporary assembly including a stub device having an optical fiber, a magnetic guide member with a hole, and a holder, an optical connector, and an magnetic alignment member extending in a direction of an axis; applying a magnetic force to the alignment member of the temporary assembly with a magnet device of an electromagnet or a permanent magnet; carrying out optical alignment of the stub device with an optical device by active alignment, the stub device being optically coupled to the optical connector, and; separating the optical connector and the alignment member apart from the stub device. The alignment member is disposed in the hole of the stub device and a guide hole of the optical connector in the temporary assembly such that the alignment member aligns the stub device with the optical connector.

Abstract: An optical device includes one or more optical fibers and a holder having a supporting block, a reflecting plate, and an intermediate layer. The supporting block has a first to a third end surfaces at one end. The first end surface extends from a bottom surface of the holder to claddings of the optical fibers. The second end surface extends along a first axis intersecting the first end surface. The third end surface is oblique with respect to the first axis at an angle greater than zero degrees and less than 90 degrees. The optical fibers extend in the supporting block and is exposed to the third end surface. The reflecting plate is provided on the third end surface via the intermediate layer. Light from the optical fiber passes through the third end surface which has some roughness, and is reflected by a surface of the reflecting plate.

Abstract: A stub device includes: a holder having a first portion and a second portion, the first portion and the second portion being arranged in a direction of a first axis, the first portion having a first end face and a second end face, and the second portion having an installation face; and optical fibers held by the holder to extend in the direction of the first axis. Core ends of the optical fibers and the first end face are arranged along a first reference plane. The second end face and the installation face extend along second and third reference planes, respectively, which are inclined with the first reference plane at acute angles. The second end face is apart from cores of the optical fibers in the first portion, and the installation face having a surface roughness larger than that of the second end face.

Abstract: An optical connecting device includes: a holder; an optical fiber supported by the holder; and a guide part supported by the holder including first and second resin bodies, a supporting part, and a first lid part, the supporting part having a principal surface and a groove extending in a direction of a first axis the groove having first and second faces, the first resin body being in contact with the optical fiber between the supporting part and the first lid part, the guide part being supported in the groove, the second resin body bonding the guide part to the supporting part, the optical fiber extending in the direction of the first axis on the principal surface of the supporting part, and the first lid part being disposed apart from the guide part on the optical fiber, the optical fiber being between the supporting part and the first lid part.

Abstract: An optical transmission apparatus includes: a Mach-Zehnder modulator including a first arm waveguide having electrodes; and a driver driving the Mach-Zehnder modulator in response to a pulse amplitude modulated signal, the driver including driving circuits connected to the respective electrodes and each of the driving circuits including a comparator receiving the pulse amplitude modulated signal.

Abstract: A semiconductor device includes: a printed substrate having a through hole from an upper face to a lower face thereof; a first semiconductor element mounted on the printed substrate; an interposer mounted on the upper face of the printed substrate; a second semiconductor element adjacent to the interposer and arranged to overlap with the through hole; and a bonding wire coupling a first pad to a second pad, the first pad being on an upper face of the interposer and being positioned on the second semiconductor element side, the second pad being on an upper face of the second semiconductor element and being positioned on the interposer side, wherein the interposer has an edge face protruding with respect to a wall face of the through hole of the printed substrate toward the second semiconductor element, and the edge face faces with an edge face of the second semiconductor element.

Abstract: An optical connecting part includes: a holder including an end face for optical connection, one or more optical waveguides and a through-hole, the optical waveguides having a portion extending from the end face in a direction of a first axis, the through-hole extending from the end face in the direction of the first axis; and a coating disposed on an inner surface of the through-hole, the coating having oil repellency. The coating on the inner surface of the through-hole forms a guide hole.

Abstract: A semiconductor light emitting apparatus includes: a stem part having a stem base, a lead terminal, and a metal member having a closed shape, the stem base having an inner portion having a first face, a second face and an opening extending in a first direction from the first face to the second face, and an outer portion surrounding the inner portion, the inner and outer portions being arranged along a reference plane intersecting the first direction, the lead terminal being supported in the opening, and the metal member being disposed on the outer portion so as to surround the inner portion and having a first portion supported by a top face of the outer portion, and a second portion extending outward with reference to an edge of the outer portion; a semiconductor optical element disposed on the inner portion; and a cap disposed on the metal member.

Abstract: An optical connecting device includes: a holder having a first side face extending in a direction of a first axis, and first and second parts arranged arranged in a direction of a second axis intersecting the first axis; a guiding member having a side face extending in the direction of the first axis; optical fibers extending in the direction of the first axis, and a resin body disposed between the first and second parts, the first part having a first portion with a first groove extending in the direction of the second axis, and a second portion with a first opening extending from the first side face to the first groove. The resin body is disposed in the first opening and between the side face of the guiding member and the first groove and between the side face of the guiding member and the first portion of the first part.

Abstract: An optical modulation device includes: a Mach-Zehnder modulator including a semiconductor waveguide; a plurality of phase modulators that are spaced from each other; a first amplifier that is coupled with an input transmission line transmitting an electrical signal, has an input impedance substantially equal to a characteristic impedance of the input transmission line; a first interconnection that is coupled to the first amplifier and transmits the electrical signal to a first end of one of the plurality of phase modulators that is provided on an input side of the Mach-Zehnder modulator; a second interconnection that is coupled to the first amplifier and transmits the electrical signal to a first end of the other of the plurality of phase modulators that is provided on an output side of the Mach-Zehnder modulator; and a plurality of termination resistors respectively coupled to second ends of the plurality of phase modulators.

Abstract: An optical module includes a bench part and a cap on the bench part. The bench part includes a bench, an electrode, a semiconductor optical device and a lens. The electrode is disposed on the first and second areas of the bench. The semiconductor optical device is disposed on the electrode in the first area. The cap includes a pad electrode, a conductor, a ceiling, a front wall, a first side wall, a first wing, and a rear wall. The first wing is disposed on the first side wall. The pad electrode is disposed on the first wing, and the conductor is disposed on the cap base and connected to the pad electrode. The electrode is electrically connected to the conductor on the second area. The ceiling extends along a first plane. The front wall has a front outer face extending along a second plane intersecting the first plane.

Abstract: An optical module includes a bench part and a cap on the bench part. The bench part includes a bench, an electrode, a semiconductor optical device and a lens. The electrode is disposed on the first and second areas of the bench. The semiconductor optical device is disposed on the electrode in the first area. The cap includes a base, a pad electrode, a conductor, a ceiling, a front wall, and a rear wall. The pad electrode is disposed on the base. The conductor is disposed on the base and connected to the pad electrode. The electrode is electrically connected to the conductor on the second area. The ceiling extends along a first plane. The front wall has a front outer face extending along a second plane intersecting the first plane. The rear wall extends from the ceiling in a direction from the cap to the bench.

Abstract: An optical module includes: a bench part including a bench having a principal surface including first and second areas arranged in a direction of a first axis, a semiconductor optical device disposed on the first area, and a lens disposed on the first area; and a cap including a base made of silicon, the cap being disposed on the bench part. The cap has a cavity containing the semiconductor optical device and the lens, and includes a ceiling extending along a first reference plane, a front wall extending from the ceiling along a second reference plane, and a rear wall extending from the ceiling in a direction from the cap to the bench. The semiconductor optical device, the lens and the cap are arranged along an optical reference plane. The second reference plane is inclined with respect to the first reference plane.

Abstract: A method for fabricating an optical transmitting apparatus includes steps of: preparing a temporary assembly including a stub device having an optical fiber, a magnetic guide member with a hole, and a holder, an optical connector, and an magnetic alignment member extending in a direction of an axis; applying a magnetic force to the alignment member of the temporary assembly with a magnet device of an electromagnet or a permanent magnet; carrying out optical alignment of the stub device with an optical device by active alignment, the stub device being optically coupled to the optical connector, and; separating the optical connector and the alignment member apart from the stub device. The alignment member is disposed in the hole of the stub device and a guide hole of the optical connector in the temporary assembly such that the alignment member aligns the stub device with the optical connector.