Abstract: This on-vehicle system is to be mounted in a vehicle and is provided with an electronic control device and an externality recognition sensor. The externality recognition sensor is equipped with a sensing unit for acquiring pre-processing externality information through sensing operations. The on-vehicle system is further equipped with: a condition calculation unit that, on the basis of a vehicle position, a vehicle traveling direction, and map information, calculates a processing condition in which information specifying an area on a map is associated with processing priority of the pre-processing externality information acquired by the externality recognition sensor; and a processing object determination unit that, on the basis of the pre-processing externality information and the processing condition, creates externality information having a smaller amount of information compared with the pre-processing externality information.

Abstract: An electronic control device comprises a sensor information acquisition unit which acquires state quantities including a position of an object to be measured using an output of a plurality of sensors, or calculates the state quantities of the object to be measured by using the output of the plurality of sensors, a storage unit which stores position determination information as a condition of a classification related to the position, a position determination unit which classifies the object to be measured by using the position determination information, and a fusion unit which determines, by referring to the state quantities, a match among a plurality of the objects to be measured which are classified identically by the position determination unit and which were measured by different sensors, and fuses the positions of the plurality of objects to be measured determined to be a match, wherein the objects to be measured are objects that can be measured by each of the plurality of sensors.

Abstract: Provided is a method for cleaning a rolling bearing and a rolling bearing cleaning device capable of cleaning a rolling bearing easily in a short time. The method for cleaning a rolling bearing including a plurality of rolling elements and a race provided with a race groove along which the rolling elements roll involves arranging a cleaning liquid in a pressurized state on one side in an axial direction of the rolling bearing across a whole circumference thereof with respect to a gap between the rolling elements and the race groove, and cleaning the rolling bearing by passing the cleaning liquid through the gap from one side in the axial direction toward the gap on the other side thereof.

Abstract: Provided is a method for cleaning a rolling bearing and a rolling bearing cleaning device capable of cleaning a rolling bearing easily in a short time. The method for cleaning a rolling bearing including a plurality of rolling elements and a race provided with a race groove along which the rolling elements roll involves arranging a cleaning liquid in a pressurized state on one side in an axial direction of the rolling bearing across a whole circumference thereof with respect to a gap between the rolling elements and the race groove, and cleaning the rolling bearing by passing the cleaning liquid through the gap from one side in the axial direction toward the gap on the other side thereof.

Abstract: Some embodiments include a method of forming a pattern. A first layer is formed to extend over a photoresist feature and along sidewalls of the photoresist feature. The first layer is etched to form first features. The photoresist feature is removed. A second layer is formed to extend over the first features and along sidewalls of the first features. The second layer is etched to form second features. A third layer is formed to extend over the first and second features and along sidewalls of the second features. A fourth layer is spin-coated over the third layer. A portion of the fourth layer is removed from over the first and second features. Segments of the third layer remain along the sidewalls of the second features. Regions of the fourth layer remain as blocks adjacent the segments. The first features and the segments are removed to leave the pattern.

Abstract: An electronic apparatus includes a wiring board including a main surface on which a first wiring and a second wiring are formed, a first semiconductor device mounted on the main surface of the wiring board, and a second semiconductor device mounted on the main surface of the wiring board. Each of the first semiconductor device and the second semiconductor device includes a first semiconductor chip including an insulated gate bipolar transistor, a second semiconductor chip including a diode, a first lead electrically connected to an emitter electrode pad formed on a first front surface of the first semiconductor chip, a second lead electrically connected to an anode electrode pad formed on a second front surface of the second semiconductor chip, and a first terminal electrically connected to a collector electrode formed on a first back surface of the first semiconductor chip.

Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.

Abstract: A motor drive controlling apparatus includes a controller that generates a drive control signal in response to input of a speed command signal and a motor driver that generates a drive signal in response to input of the drive control signal and outputs the drive signal to a motor, and the controller repeatedly generates the drive control signal in a period during which the speed command signal is inputted and stops generating the drive control signal in a period during which the speed command signal is not inputted to repeat an operation period in which the motor performs rotational operation and a stop period in which the motor stops operating in a non-excited state.

Abstract: An electronic apparatus includes a wiring board including a main surface on which a first wiring and a second wiring are formed, a first semiconductor device mounted on the main surface of the wiring board, and a second semiconductor device mounted on the main surface of the wiring board. Each of the first semiconductor device and the second semiconductor device includes a first semiconductor chip including an insulated gate bipolar transistor, a second semiconductor chip including a diode, a first lead electrically connected to an emitter electrode pad formed on a first front surface of the first semiconductor chip, a second lead electrically connected to an anode electrode pad formed on a second front surface of the second semiconductor chip, and a first terminal electrically connected to a collector electrode formed on a first back surface of the first semiconductor chip.

Abstract: For example, a semiconductor device capable of achieving a high performance applicable to an SR motor is provided. The semiconductor device includes a chip mounting portion TAB1 on which a semiconductor chip CHP1 having an IGBT is mounted, and a chip mounting portion TAB2 on which a semiconductor chip CHP2 having a diode is formed. The semiconductor device also includes a lead LD1A electrically connected to an emitter electrode pad EP of the semiconductor chip CHP1 via a clip CLP1, and a lead LD1B electrically connected to an anode electrode pad ADP of the semiconductor chip CHP2 via a clip CLP2. At this time, the chip mounting portion TAB1 is separated electrically from the chip mounting portion TAB2, and the clip CLP1 is separated electrically from the clip CLP2.

Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.

Abstract: Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.

Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.

Abstract: Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.

Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.

Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.

Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.

Abstract: A pressure sensor includes a sensor member including a sensor face to which pressure is imparted and a cover member that covers at least part of the peripheral face of the sensor member while exposing the sensor face out of one end side. With such a configuration, the sensor member can be protected from a lateral force (side pressure), whereby the sensor member can be prevented from being broken by the application of the side pressure to the sensor member.

Abstract: There is provided a detection device including: a detection electrode that is arranged at a position on an arrangement plane near a tubular body; a drive electrode that is arranged on the arrangement plane; and a controller configured to generate lines of electric force between the detection electrode and the drive electrode and to detect a state of the tubular body by detecting lines of electric force entering the detection electrode.

Abstract: Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.