Patents by Inventor Akira Muto
Akira Muto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180047649Abstract: Each of first and second semiconductor devices mounted on a substrate includes an emitter terminal electrically connected with a front surface electrode of a semiconductor chip and exposed from a main surface of a sealing body located on a front surface side of the semiconductor chip. Each of the first and second semiconductor devices includes a collector terminal electrically connected with a back surface electrode of the semiconductor chip and exposed from the main surface of the sealing body located on a back surface side of the semiconductor chip. The collector terminal of the first semiconductor device is electrically connected with the emitter terminal of the second semiconductor device via a conductor pattern formed on an upper surface of the substrate.Type: ApplicationFiled: July 20, 2017Publication date: February 15, 2018Inventors: Koji BANDO, Akira MUTO
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Patent number: 9887151Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.Type: GrantFiled: June 6, 2016Date of Patent: February 6, 2018Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Yukihiro Sato, Akira Muto, Ryo Kanda, Takamitsu Kanazawa
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Patent number: 9839744Abstract: An occlusion detection device detects an occlusion of a flexible fluid path on either of upstream and downstream sides of a pump mechanism, the pump mechanism transporting a liquid through the fluid path by elastically deforming the fluid path. The occlusion detection device is provided with: an occlusion sensor that is disposed on the downstream side of the pump mechanism and detects an internal pressure of the fluid path during a liquid transporting operation of the pump mechanism; and a data processing circuit that analyzes on which side of the upstream and downstream sides of the pump mechanism the occlusion of the fluid path occurs, based on a change of the internal pressure of the fluid path detected by the occlusion sensor and outputs an analysis result.Type: GrantFiled: June 29, 2015Date of Patent: December 12, 2017Assignee: Minebea Co., Ltd.Inventors: Akira Muto, Hiroyuki Ohmae, Kiyoshi Omori
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Publication number: 20170287818Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.Type: ApplicationFiled: June 13, 2017Publication date: October 5, 2017Inventors: Akira Muto, Nobuya Koike, Masaki Kotsuji, Yukihiro Narita
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Publication number: 20170264223Abstract: A motor drive controlling apparatus includes a controller that generates a drive control signal in response to input of a speed command signal and a motor driver that generates a drive signal in response to input of the drive control signal and outputs the drive signal to a motor, and the controller repeatedly generates the drive control signal in a period during which the speed command signal is inputted and stops generating the drive control signal in a period during which the speed command signal is not inputted to repeat an operation period in which the motor performs rotational operation and a stop period in which the motor stops operating in a non-excited state.Type: ApplicationFiled: February 28, 2017Publication date: September 14, 2017Applicant: MINEBEA MITSUMI INC.Inventors: Takamichi KITANO, Masaaki NAGAI, Akira MUTO
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Publication number: 20170229428Abstract: For example, a semiconductor device capable of achieving a high performance applicable to an SR motor is provided. The semiconductor device includes a chip mounting portion TAB1 on which a semiconductor chip CHP1 having an IGBT is mounted, and a chip mounting portion TAB2 on which a semiconductor chip CHP2 having a diode is formed. The semiconductor device also includes a lead LD1A electrically connected to an emitter electrode pad EP of the semiconductor chip CHP1 via a clip CLP1, and a lead LD1B electrically connected to an anode electrode pad ADP of the semiconductor chip CHP2 via a clip CLP2. At this time, the chip mounting portion TAB1 is separated electrically from the chip mounting portion TAB2, and the clip CLP1 is separated electrically from the clip CLP2.Type: ApplicationFiled: August 25, 2014Publication date: August 10, 2017Inventors: Akira MUTO, Norio KIDO
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Publication number: 20170227413Abstract: A pressure sensor includes a sensor member including a sensor face to which pressure is imparted and a cover member that covers at least part of the peripheral face of the sensor member while exposing the sensor face out of one end side. With such a configuration, the sensor member can be protected from a lateral force (side pressure), whereby the sensor member can be prevented from being broken by the application of the side pressure to the sensor member.Type: ApplicationFiled: February 7, 2017Publication date: August 10, 2017Applicant: MINEBEA MITSUMI Inc.Inventors: Kiyoshi OMORI, Hiroyuki OMAE, Akira MUTO, Tomoaki WATANUKI
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Patent number: 9704979Abstract: A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a sealing body, and signal terminals protrude from a second sides of the sealing body. Namely, the side of the sealing body from which the emitter terminal protrudes and the side of the sealing body from which the signal terminals protrude are different. More particularly, the signal terminals protrude from the side of the sealing body opposite the side thereof from which the emitter terminal protrudes. Further, a second semiconductor chip including a diode formed therein is mounted over a first surface of a chip mounting portion in such a manner as to be situated between the emitter terminal and the a first semiconductor chip including an IGBT formed therein in plan view.Type: GrantFiled: May 26, 2014Date of Patent: July 11, 2017Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Akira Muto, Nobuya Koike, Masaki Kotsuji, Yukihiro Narita
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Publication number: 20170103940Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.Type: ApplicationFiled: December 20, 2016Publication date: April 13, 2017Inventors: Akira MUTO, Koji BANDO, Yukihiro SATO, Kazuhiro MITAMURA
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Publication number: 20170033035Abstract: To improve the reliability of a semiconductor device. A chip mounting portion TAB5 is arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP1 (LV) and a pad of a semiconductor chip CHP3 are electrically coupled by a wire W1a and a wire W1b through a relay lead RL1. Likewise, a gate electrode pad of a semiconductor chip CHP1 (LW) and the pad of the semiconductor chip CHP3 are electrically coupled by a wire W1c and a wire W1d through a relay lead RL2. At this time, the structures of parts of the relay leads RL1 and RL2, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LD1 and LD2 which function as external terminals.Type: ApplicationFiled: June 6, 2016Publication date: February 2, 2017Inventors: Yukihiro SATO, Akira MUTO, Ryo KANDA, Takamitsu KANAZAWA
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Patent number: 9530723Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.Type: GrantFiled: September 22, 2015Date of Patent: December 27, 2016Assignee: Renesas Electronics CorporationInventors: Akira Muto, Koji Bando, Yukihiro Sato, Kazuhiro Mitamura
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Publication number: 20160148859Abstract: On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.Type: ApplicationFiled: September 22, 2015Publication date: May 26, 2016Inventors: Akira MUTO, Koji BANDO, Yukihiro SATO, Kazuhiro MITAMURA
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Publication number: 20160013163Abstract: An improvement is achieved in the performance of an electronic device. A first semiconductor device and a second semiconductor device are mounted over the upper surface of a wiring board such that, e.g., in plan view, the orientation of the second semiconductor device intersects the orientation of the first semiconductor device. That is, the first semiconductor device is mounted over the upper surface of the wiring board such that a first emitter terminal and a first signal terminal are arranged along an x-direction in which the pair of shorter sides of the wiring board extend. On the other hand, the second semiconductor device is mounted over the upper surface of the wiring board such that a second emitter terminal and a second signal terminal are arranged along a y-direction in which the pair of longer sides of the wiring board extend.Type: ApplicationFiled: September 22, 2015Publication date: January 14, 2016Inventors: Akira Muto, Takafumi Furukawa
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Publication number: 20150374903Abstract: An occlusion detection device detects an occlusion of a flexible fluid path on either of upstream and downstream sides of a pump mechanism, the pump mechanism transporting a liquid through the fluid path by elastically deforming the fluid path. The occlusion detection device is provided with: an occlusion sensor that is disposed on the downstream side of the pump mechanism and detects an internal pressure of the fluid path during a liquid transporting operation of the pump mechanism; and a data processing circuit that analyzes on which side of the upstream and downstream sides of the pump mechanism the occlusion of the fluid path occurs, based on a change of the internal pressure of the fluid path detected by the occlusion sensor and outputs an analysis result.Type: ApplicationFiled: June 29, 2015Publication date: December 31, 2015Inventors: Akira MUTO, Hiroyuki OHMAE, Kiyoshi OMORI
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Patent number: 9153563Abstract: An improvement is achieved in the performance of an electronic device. A first semiconductor device and a second semiconductor device are mounted over the upper surface of a wiring board such that, e.g., in plan view, the orientation of the second semiconductor device intersects the orientation of the first semiconductor device. That is, the first semiconductor device is mounted over the upper surface of the wiring board such that a first emitter terminal and a first signal terminal are arranged along an x-direction in which the pair of shorter sides of the wiring board extend. On the other hand, the second semiconductor device is mounted over the upper surface of the wiring board such that a second emitter terminal and a second signal terminal are arranged along a y-direction in which the pair of longer sides of the wiring board extend.Type: GrantFiled: August 29, 2014Date of Patent: October 6, 2015Assignee: Renesas Electronics CorporationInventors: Akira Muto, Takafumi Furukawa
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Publication number: 20150276804Abstract: There is provided a detection device including: a detection electrode that is arranged at a position on an arrangement plane near a tubular body a drive electrode that is arranged on the arrangement plane; and a controller configured to generate lines of electric force between the detection electrode and the drive electrode and to detect a state of the tubular body by detecting lines of electric force entering the detection electrode.Type: ApplicationFiled: March 27, 2015Publication date: October 1, 2015Inventors: Akira MUTO, Yasutoshi OBATA, Hiroyuki OHMAE, Kiyoshi OMORI, Yohei ISHII
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Patent number: 9024423Abstract: A semiconductor chip in which a power MOSFET is placed above a semiconductor chip in which another power MOSFET is formed and they are sealed with an encapsulation resin. The semiconductor chips are so arranged that the upper semiconductor chip does not overlap with a gate pad electrode of the lower semiconductor chip in a plan view. The semiconductor chips are identical in size and the respective source pad electrodes and gate pad electrodes of the lower semiconductor chip and the upper semiconductor chip are identical in shape and arrangement. The lower semiconductor chip and the upper semiconductor chip are arranged with their respective centers displaced from each other. Accordingly, the size of a semiconductor device can be reduced.Type: GrantFiled: April 26, 2010Date of Patent: May 5, 2015Assignee: Renesas Electronics CorporationInventors: Akira Muto, Yuichi Machida, Nobuya Koike, Atsushi Fujiki, Masaki Tamura
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Patent number: 8994159Abstract: To prevent, in a resin-sealed type semiconductor package, generation of cracks in a die bonding material used for mounting of a semiconductor chip. A semiconductor chip is mounted over the upper surface of a die pad via a die bonding material, followed by sealing with an insulating resin. The top surface of the die pad to be brought into contact with the insulating resin is surface-roughened, while the bottom surface of the die pad and an outer lead portion are not surface-roughened.Type: GrantFiled: January 14, 2013Date of Patent: March 31, 2015Assignee: Renesas Electronics CorporationInventors: Hiroyuki Nakamura, Akira Muto, Nobuya Koike, Atsushi Nishikizawa, Yukihiro Sato, Katsuhiko Funatsu
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Publication number: 20150060940Abstract: An improvement is achieved in the performance of an electronic device. A first semiconductor device and a second semiconductor device are mounted over the upper surface of a wiring board such that, e.g., in plan view, the orientation of the second semiconductor device intersects the orientation of the first semiconductor device. That is, the first semiconductor device is mounted over the upper surface of the wiring board such that a first emitter terminal and a first signal terminal are arranged along an x-direction in which the pair of shorter sides of the wiring board extend. On the other hand, the second semiconductor device is mounted over the upper surface of the wiring board such that a second emitter terminal and a second signal terminal are arranged along a y-direction in which the pair of longer sides of the wiring board extend.Type: ApplicationFiled: August 29, 2014Publication date: March 5, 2015Inventors: Akira MUTO, Takafumi FURUKAWA
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Patent number: 8929722Abstract: A recording and reproducing device reproduces content management information from a recording medium and inputs the content management information to a control unit via a recording and reproducing processing unit. An image generation unit generates a menu screen using content information in the management information extracted by the control unit, and outputs the menu screen via a display processing unit. When content is to be dubbed by a user, the content dubbing destination and the preset time to dub the content are entered to the control unit via an operation unit, and these entries are held in a schedule management unit.Type: GrantFiled: September 2, 2005Date of Patent: January 6, 2015Assignee: Panasonic CorporationInventors: Satoshi Kondo, Akira Muto