Patents by Inventor Akira Okabe
Akira Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12120927Abstract: A TFT layer and an organic EL element layer are provided in this order on a resin substrate layer, the TFT layer includes source wiring lines, high-level power source wiring lines, conductive portions including connection wiring lines between TFTs, and a flattening film covering the conductive portions provided on the interlayer insulating film, a frame region is provided with a bending portion including a portion where a slit is formed in an inorganic insulating film including the interlayer insulating film, and a flattening auxiliary film is provided between each adjacent ones of the conductive portions, formed of a material identical to a material of the frame flattening film that fills the slit of the bending portion, in a layer identical to a layer of the frame flattering film, and covered with the flattening film together with the conductive portions.Type: GrantFiled: September 28, 2018Date of Patent: October 15, 2024Assignee: SHARP KABUSHIKI KAISHAInventors: Ryosuke Gunji, Tohru Okabe, Shinsuke Saida, Hiroki Taniyama, Shinji Ichikawa, Akira Inoue, Yoshihiro Nakada, Hiroharu Jinmura, Koji Tanimura, Yoshihiro Kohara
-
Patent number: 12089463Abstract: A display device according to an aspect of the disclosure includes a first metal protrusion being in contact with a first power-source trunk wire, and a second metal protrusion being in contact with a second power-source trunk wire. A first bank defining the end of an organic sealing film includes the first metal protrusion, the second metal protrusion, and a first resin protrusion. The first resin protrusion overlaps the first and second metal protrusions. The first resin protrusion has a frame shape.Type: GrantFiled: September 19, 2019Date of Patent: September 10, 2024Assignee: SHARP KABUSHIKI KAISHAInventors: Tohru Okabe, Shinsuke Saida, Shinji Ichikawa, Ryosuke Gunji, Akira Inoue, Yoshihiro Nakada, Hiroharu Jinmura
-
Publication number: 20240295678Abstract: A light diffusion sheet 43 includes, at least in its first surface 43a, a plurality of recesses 22 formed in a substantially inverted polygon pyramid or in a substantially inverted truncated polygon pyramid. The ridge 23 parting the plurality of recesses 22 has a recessed shape between the intersections 23a, with respect to a straight line connecting the intersections 23a of the ridge 23. Where P is the arrangement pitch of the plurality of recesses 22 and Wr is the dimension occupied by a curved portion at the top portion of the ridge 23 in the arrangement direction of the plurality of recesses 22, a ratio Wr/P is 0.3 or less. The maximum height difference d between the ridge 23 and the straight line connecting the intersections 23a of the ridge 23 is 1 ?m or more and 10 ?m or less.Type: ApplicationFiled: May 31, 2023Publication date: September 5, 2024Inventors: Masayuki SUKIGARA, Akira FURUTA, Motohiko OKABE
-
Patent number: 12082449Abstract: A separation wall is provided in a frame shape along a circumferential edge of a through-hole in a non-display region, in which the through-hole is formed, defined in an island shape inside a display region. The separation wall includes a wall base portion provided in a frame shape by a part of a second interlayer insulating film and a resin layer provided in an eave shape on the wall base portion to extend to a through-hole side and a display region side. Opening portions opening upward are provided on peripheries of the wall base portion on the through-hole side and the display region side in the second interlayer insulating film.Type: GrantFiled: March 29, 2019Date of Patent: September 3, 2024Assignee: SHARP KABUSHIKI KAISHAInventors: Shinsuke Saida, Shinji Ichikawa, Ryosuke Gunji, Tohru Okabe, Akira Inoue, Yoshihiro Nakada, Hiroharu Jinmura
-
Publication number: 20230265580Abstract: In a vapor phase growth system in which a preheating ring is provided around a susceptor, the flow rate of source gas can be adjusted by changing the position of the susceptor, and the effect on the film thickness variation of a semiconductor single-crystal layer due to the changes of the position of the susceptor is caused to be less likely to occur. The susceptor is raised/lowered by a susceptor position changing mechanism, and the height position of holding the susceptor in a reaction vessel body can be changed. A preheating ring position changing mechanism changes the height position of holding the preheating ring in the reaction vessel body based on raising/lowering of the preheating ring in accordance with the changes of the height position of holding the susceptor.Type: ApplicationFiled: April 11, 2023Publication date: August 24, 2023Inventor: Akira Okabe
-
Publication number: 20230203705Abstract: A vapor phase growth system includes a process chamber that includes a susceptor lifting mechanism that raises and lowers the susceptor between a first position and a second position. With the susceptor in the first position, the top surface of the susceptor is above the bottom surface of the preheating ring, and a source gas distribution space with a predetermined height dimension is secured between the top surface of the susceptor and the bottom surface of a ceiling plate of the reaction vessel body. With the susceptor in the second position, the top surface of the susceptor is located below the bottom surface of a preheating ring, and a substrate loading/unloading space, which has a greater height dimension than that of the source gas distribution space, is secured between the top surface of the susceptor and the bottom surface of the preheating ring.Type: ApplicationFiled: February 15, 2023Publication date: June 29, 2023Inventor: Akira Okabe
-
Patent number: 11459041Abstract: A suction traveling device includes: a main pressure reducing chamber, sub pressure reducing chambers communicating with the main pressure reducing chamber and disposed in drive parts, ventilation holes on a same side of the sub pressure reducing chamber as suction holes and communicating the sub pressure reducing chambers and suction holes, and an open/close unit for releasing the ventilation holes when a pressure in suction chambers formed by a wall surface and the suction holes is equal to a pressure in the sub pressure reducing chamber and for closing the ventilation holes when the pressure in the suction chambers is higher than in the sub pressure reducing chamber. When the ventilation hole is closed, a gap of a size preventing the pressure in the sub pressure reducing chamber from affecting the pressure in the other suction chamber is formed in the ventilation hole.Type: GrantFiled: January 6, 2018Date of Patent: October 4, 2022Assignees: INDUSTRY NETWORK CO., LTD., NEXCO-EAST ENGINEERING COMPANY LIMITEDInventors: Toshio Ohashi, Takuya Akagi, Yuichi Takazakura, Akira Okabe
-
Patent number: 11427928Abstract: Embodiments described herein relate to a lower side wall for use in a processing chamber. a lower side wall for use in a processing chamber is disclosed herein. The lower side wall includes an inner circumference, an outer circumference, a top surface, a plurality of flanges, and a first concave portion. The outer circumference is concentric with the inner circumference. The plurality of flanges project from the inner circumference. The first concave portion includes a plurality of grooves arranged along a circumferential direction of the lower side wall. Each groove has an arc shape such that the plurality of grooves concentrate a gas when the gas contacts the plurality of grooves.Type: GrantFiled: September 10, 2018Date of Patent: August 30, 2022Assignee: Applied Materials, Inc.Inventors: Akira Okabe, Yoshinobu Mori
-
Publication number: 20220254676Abstract: A process chamber of an epitaxial growth apparatus is directed to a process chamber configured to perform reaction processing on a semiconductor substrate, which includes a susceptor supported and disposed in the process chamber by a shaft member supporting only a central portion in a radial direction and extending in an upward/downward direction, and on which the semiconductor substrate is placed, a finger plate wafer lift disposed below the susceptor and configured to be movable in an axial direction of the shaft member, and a lift pin configured to displace the semiconductor substrate upward from an upper surface of the susceptor to approach the finger plate wafer lift to the susceptor, and a through-hole through which the lift pin passes is formed in the susceptor.Type: ApplicationFiled: July 25, 2019Publication date: August 11, 2022Inventors: Akira Okabe, Yukio Takenaga
-
Publication number: 20200079447Abstract: A suction traveling device includes: a main pressure reducing chamber, sub pressure reducing chambers communicating with the main pressure reducing chamber and disposed in drive parts, ventilation holes on a same side of the sub pressure reducing chamber as suction holes and communicating the sub pressure reducing chambers and suction holes, and an open/close unit for releasing the ventilation holes when a pressure in suction chambers formed by a wall surface and the suction holes is equal to a pressure in the sub pressure reducing chamber and for closing the ventilation holes when the pressure in the suction chambers is higher than in the sub pressure reducing chamber. When the ventilation hole is closed, a gap of a size preventing the pressure in the sub pressure reducing chamber from affecting the pressure in the other suction chamber is formed in the ventilation hole.Type: ApplicationFiled: January 6, 2018Publication date: March 12, 2020Applicants: Industry Network Co., Ltd., Nexco-East Engineering Company LimitedInventors: Toshio OHASHI, Takuya AKAGI, Yuichi TAKAZAKURA, Akira OKABE
-
Patent number: 10443129Abstract: An epitaxial growth device comprises a reaction chamber defined by a substrate setting portion, a ceiling board and a sidewall portion, a heating member and reactant gas-introduction member. The ceiling board is fixed to a ring-like support portion having a through-hole as viewed from above. A diameter of the through-hole becomes reduced gradually toward a substrate-side. The ceiling board is fixed to an end portion of the substrate-side of the through-hole.Type: GrantFiled: February 7, 2013Date of Patent: October 15, 2019Assignee: Applied Materials, Inc.Inventors: Yoshinobu Mori, Akira Okabe
-
Publication number: 20190281352Abstract: [Problem to be Solved] To provide a digital signage method and a system for implementing the same that perform content distribution, and the like, to each particular reproduction terminal without depending on the public line network, allowing it to avoid occurrence of a problem, such as an illegal alteration of a distribution content, and also to make schedule management of each particular reproduction terminal, being based on the time setting.Type: ApplicationFiled: July 12, 2018Publication date: September 12, 2019Inventors: Ryoji KOSHI, Akira OKABE
-
Publication number: 20190093254Abstract: Embodiments described herein relate to a lower side wall for use in a processing chamber. a lower side wall for use in a processing chamber is disclosed herein. The lower side wall includes an inner circumference, an outer circumference, a top surface, a plurality of flanges, and a first concave portion. The outer circumference is concentric with the inner circumference. The plurality of flanges project from the inner circumference. The first concave portion includes a plurality of grooves arranged along a circumferential direction of the lower side wall. Each groove has an arc shape such that the plurality of grooves concentrate a gas when the gas contacts the plurality of grooves.Type: ApplicationFiled: September 10, 2018Publication date: March 28, 2019Inventors: Akira OKABE, Yoshinobu MORI
-
Patent number: 10222779Abstract: A semiconductor wafer position display system, a semiconductor wafer position display method, and a semiconductor wafer position display program with which a deviation from an appropriate placement position of a semiconductor wafer mounted in a wafer mounting part can be displayed to a user in an easily understood manner are provided.Type: GrantFiled: March 12, 2015Date of Patent: March 5, 2019Assignee: Epicrew CorporationInventors: Akira Okabe, Masanori Tanoguchi
-
Patent number: 10072354Abstract: Embodiments described herein relate to a lower side wall for use in a processing chamber. In one embodiment, the lower side wall includes an annular body. The annular body as an inner circumference, an outer circumference, a plurality of flanges projecting from the inner circumference, and a first concave portion formed in the outer circumference. The outer circumference has a plurality of grooves arranged in a circumferential direction of the lower side wall. In another embodiment, the annular body further includes a top surface having a mounting surface formed thereon and a second concave portion formed opposite the first concave portion. The second concave portion has a plurality of purge holes. In another embodiment, each groove of the plurality of grooves formed in the first concave portion has an arc shape.Type: GrantFiled: March 25, 2015Date of Patent: September 11, 2018Assignee: Applied Materials, Inc.Inventors: Akira Okabe, Yoshinobu Mori
-
Patent number: 9945516Abstract: A method provide high-purity nitric oxide by preserving quality of the nitric oxide by suitably inhibiting the disproportionation reaction of the nitric oxide that is transported in a state of being stored in a high-pressure gas cylinder, and decreasing the amount of nitrous oxide and nitrogen dioxide that are produced during the transportation. When the nitric oxide is transported in a state of being stored in the high-pressure gas cylinder, the nitric oxide is filled into the high-pressure gas cylinder at a gauge pressure between 1.96 MPa to 3.5 MPa to be stored, and is transported in a state in which the exterior surface temperature of the high-pressure gas cylinder is held in a range from ?15° C. to 5° C.Type: GrantFiled: September 4, 2013Date of Patent: April 17, 2018Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.Inventors: Junichi Kawakami, Akira Okabe, Masahiro Komatsu, Yukiyoshi Sawatani
-
Patent number: 9663873Abstract: A ceiling portion for use in a processing apparatus and an epitaxial growth apparatus having the ceiling portion are disclosed herein. In one embodiment the ceiling portion includes a ring shaped support and a ceiling plate. The ring shaped support includes an inner surface having a first slope portion decreasing from a top surface of the ring shaped support towards a center of the ring shaped support and a protrusion, protruding from the inner surface, having a second slope portion decreasing in a protruding direction towards the center of the ring shaped support. The ceiling plate is coupled to the support. In another embodiment, the first slope portion and the second slope portion meet at a point, wherein an angle formed by the first slope portion and the second slope portion is less than 90 degrees.Type: GrantFiled: March 25, 2015Date of Patent: May 30, 2017Assignee: Applied Materials, Inc.Inventors: Akira Okabe, Yoshinobu Mori
-
Patent number: 9627943Abstract: A motor cooling structure for cooling a motor, which includes a shaft transmitting power and a rotor core attached to an outside of the shaft, by a cooling medium, includes: a cooling medium supply passage that extends to an inside of the shaft in an axial direction of the shaft and passes the cooling medium through the cooling medium supply passage; and a plurality of cooling medium passages that are branched from the cooling medium supply passage to cool the rotor core while flowing the cooling medium without branching the cooling medium in the axial direction and then eject the cooling medium from a plurality of ejection holes opened to a surface of the rotor core, wherein distances from a cooling medium inlet, through which the cooling medium flows into the cooling medium supply passage, to the respective ejection holes are equal between the plurality of cooling medium passages.Type: GrantFiled: March 1, 2012Date of Patent: April 18, 2017Assignee: Komatsu Ltd.Inventors: Hiroyuki Tokunaga, Akira Okabe, Kazuhiro Okamoto, Teiichirou Chiba, Natsuki Watanabe
-
Patent number: 9583990Abstract: An electrical motor that includes a circular stator attached to an inner side of a housing and a rotor disposed at an inner side of the stator in a radial direction, the electrical motor includes: a terminal connected to a power supply cable drawn from a coil of the stator; a terminal box that is attached to the housing and stores the terminal; and an insulating material that is disposed between the terminal box and the terminal and separable from the terminal.Type: GrantFiled: November 14, 2012Date of Patent: February 28, 2017Assignee: Komatsu Ltd.Inventors: Hiroyuki Tokunaga, Ryo Ono, Akira Okabe, Natsuki Watanabe, Teiichirou Chiba
-
Patent number: D926715Type: GrantFiled: November 12, 2019Date of Patent: August 3, 2021Assignee: EPICREW CORPORATIONInventors: Akira Okabe, Yukio Takenaga