Support for a wafer for fabricating a semiconductor

- EPICREW CORPORATION
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Description

FIG. 1 is a front view of a support for a wafer for fabricating a semiconductor showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a top perspective view thereof; and,

FIG. 8 is a bottom perspective view thereof.

Claims

The ornamental design for a support for a wafer for fabricating a semiconductor, as shown and described.

Referenced Cited
U.S. Patent Documents
6572814 June 3, 2003 Shamoulian
D552565 October 9, 2007 Nakamura
D606952 December 29, 2009 Lee
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D616395 May 25, 2010 Sato
D784276 April 18, 2017 Tiner
D819580 June 5, 2018 Krishnan
D830981 October 16, 2018 Jeong
D864134 October 22, 2019 Watarai
10854498 December 1, 2020 Shoji
20030029570 February 13, 2003 Kawamura
20040124413 July 1, 2004 Arai
Foreign Patent Documents
D1399397 September 2010 JP
Patent History
Patent number: D926715
Type: Grant
Filed: Nov 12, 2019
Date of Patent: Aug 3, 2021
Assignee: EPICREW CORPORATION (Nagasaki)
Inventors: Akira Okabe (Nagasaki), Yukio Takenaga (Nagasaki)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/712,911