Abstract: A tag structure suitable for attachment to an object includes one or more bimorphs comprised of a thin strip of a magnetostrictive material attached to a thicker bar of hard magnetic material. The tag is preferably excited using either magnetic or acoustic fields, tuned to the resonance of the bimorphs. The excitation induces strain in the bimorph which causes mechanical vibrations in the bimorph which are sensed acoustically or magnetically, giving rise to a code. A device for detecting the output of the tag is provided along with a device for decoding the output from the detecting means thereby to identify the object.

Abstract: The invention provides a multilayer laminar interconnect package comprising a plurality of conductor circuit layers adhering to and sandwiched between a plurality of dielectric polyimide polymer layers where the conductor circuit layers are a circuit pattern of lines of conductive metal. The conductive metal, e.g. copper, is coated with a capping layer of a metal, e.g. cobalt, which capping layer is further characterized as having a thin layer of the capping metal oxide adhered to the surface thereof. The conductive layer is in contact with an overcoated polyimide dielectric layer such that the surface oxidized capping layer forms an adherent barrier layer at the interface of the polyimide and conductive line layers. The invention also provides a process for producing such interconnect packages.

Abstract: The invention provides a multilayer laminar interconnect package comprising a plurality of conductor circuit layers adhering to and sandwiched between a plurality of dielectric polyimide polymer layers where the conductor circuit layers are a circuit pattern of lines of conductive metal. The conductive metal, e.g. copper, is coated with a capping layer of a metal, e.g. cobalt, which capping layer is further characterized as having a thin layer of the capping metal oxide adhered to the surface thereof. The conductive layer is in contact with an overcoated polyimide dielectric layer such that the surface oxidized capping layer forms an adherent barrier layer at the interface of the polyimide and conductive line layers. The invention also provides a process for producing such interconnect packages.

Abstract: A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilute solution of Cu.sup.+2 ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu.sup.+2 and 1 H-BTA results in a spontaneous interaction of Cu.sup.+2 and the metal to produce a film layer of Cu(I) BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.

Abstract: Precise, adherent deposits of a metal such as palladium are formed on an substrate such as polyimide, silicon dioxide, tantalum oxide and polyethylene terephthalate by contacting the substrate surface with a solution of the metal, and then exposing the surface through the solution to laser radiation characterized by a wavelength absorbable by the substrate and a power density and fluence effective to release electrons to promote deposition of the metal onto the substrate without thermal activation of the substrate or the solution.