Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.

Abstract: Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal testing rig for a data center can include one or more pluggable heat-generating elements to direct a heat flux in an upward direction towards one or more thermal distribution elements.

Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, reconfigurable terminations are provided for fluid loops in a datacenter cooling system with individual ones of such reconfigurable terminations are to be configured in a first state to enable non-cooling fluid runs through individual ones of such fluid loops, taken individually and in combination, during commissioning of a datacenter cooling system, and are to be configured in a second state to enable cooling fluid runs to cool at least one cold plate after commissioning of a datacenter cooling system.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more outlet reservoirs are associated with a stabilizing subsystem and a rack so that one or more outlet reservoirs can receive two-phase fluid that is outlet from a plurality of cold plates of a rack and so that a stabilizing subsystem can stabilize a quality factor of a two-phase fluid to a predetermined quality factor before heat is removed from a two-phase fluid and it is cycled to such cold plates.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a flow controller adapter of a cooling manifold is to interchangeably receive a flow controller of a plurality of flow controllers, wherein a flow controller adapter is associated with a rack-side flow controller and with a tube there between and is configured to be movable within cooling manifold to allow different positions for mating a flow controller with a server-side flow controller of server tray or box.

Abstract: Systems and methods for cooling a mobile datacenter are disclosed. In at least one embodiment, a cooling loop is located on a mobile unit and includes at least one cold plate within a pod on a mobile unit and includes a dry cooler external to a pod on a mobile unit so as to enable coolant to be provided to a cold plate and to enable such coolant to be provided to a dry cooler for removal of heat from at least one computing device to an ambient environment.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a control unit within a rack has a pump or compressor unit to cause two-phase fluid to circulate through a cold plate associated with a computing device and to circulate through a heat exchanger associated with a rear door of a rack, so as to dissipate heat from a computing device through a heat exchanger by a control unit within a rack.

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, method for operating a datacenter includes receiving a source of gas to a fuel cell to produce electrical power. The method further includes providing the electrical power to one or more electronic components in the datacenter. The method further includes capturing waste heat, generated by the fuel cell in converting the gas to the electrical power, using a heat exchanger. The method further includes providing the waste heat to an absorption chiller to produce cooled liquid to be utilized with a cooling system to remove heat from the one or more electronic components.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate is coupled to a condenser section of a heat pipe and to a primary computing device, with the heat pipe coupled to an auxiliary computing device at an evaporator section of the heat pipe, so that the cold plate draws heat from the primary computing device and from the heat pipe.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a modular unit is swappable or hot-swappable and has a heat exchanger, a variable speed fan, and at least one flow controller to pass fluid through microchannels of a cold plate, so that the fluid extracts heat from at least one computing device and so that fluid through a heat exchanger enables dissipation of heat by forced air from a variable speed fan.

Abstract: A system includes one or more first cooling loops to cool one or more first components within one or more servers having a first power density, and one or more second cooling loops to cool one or more second components within the one or more servers having a second power density. The system can flow first coolant to cold plates to cool high-power server components and flow second coolant to cool low-power server components by immersion cooling.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an in-row cooling unit is located within a row of racks and between racks so that it can use an interchangeable heat exchanger (IHE) to receive a primary coolant and can use one or more flow controllers to provide a first part of the primary coolant to cool a secondary coolant that is to be distributed to at least one cold plate, and to provide a second part of the primary coolant to cool air to be circulated through at least one server tray or rack.

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, a power delivery system includes one or more fuel cells to provide a source of electrical power for a datacenter, where waste heat produced by a fuel cell is to be captured and provided to an absorption chiller to produce a cooled liquid for use in a cooling system for this datacenter.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) is provided to determine a change in a power state or a coolant state of at least one server and to enable a coolant response from an overhead cooling unit (OCU) to dissipate heat from secondary coolant of a secondary cooling loop.

Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, a cooling assembly can be used to monitor and control fluid quality associated with one or more servers.

Abstract: Systems and methods for cooling in a datacenter are disclosed. In at least one embodiment, a thermal load bank (TLB) system to test a hybrid datacenter cooling system includes one or more thermal features to generate heat within a TLB system and includes one or more hybrid cooling features to provide air and liquid cooling responses to such heat generated by one or more thermal features.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, flow controllers are associated with cold plates and have direct and bypass ports, so that when direct ports are disabled for removal of a first cold plate, bypass ports are enabled to bypass a first cold plate and to enable a second cold plate to be continuously cooled by a datacenter cooling system.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more flow controllers is associated with a cold plate and with a thermosyphon condenser that is elevated with respect to a cold plate so that two-phase fluid is enabled for gravity-assisted downflow in a liquid phase to a cold plate for absorption of heat and is enabled for buoyancy-driven upflow through a riser tube into a thermosyphon condenser for dissipation of heat of at least one computing device.