Patents by Inventor Ali Heydari

Ali Heydari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963339
    Abstract: Systems and methods for cooling a data center are disclosed. In at least one embodiment, a radiator is associated with one or more racks of a datacenter and has a first portion to function as an air-to-liquid heat exchanger having a primary cooling loop to absorb first heat away from the one or more racks and has a second portion to function as a liquid-to-liquid heat exchanger to enable at least one secondary cooling loop to exchange second heat with the primary cooling loop.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: April 16, 2024
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Patent number: 11953957
    Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to adjust one or more flow control valves, of a liquid cooling system for a data center, to control a variation in liquid flow rate across the data center.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: April 9, 2024
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Patent number: 11956931
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: April 9, 2024
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Patent number: 11950396
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a modular unit is swappable or hot-swappable and has a heat exchanger, a variable speed fan, and at least one flow controller to pass fluid through microchannels of a cold plate, so that the fluid extracts heat from at least one computing device and so that fluid through a heat exchanger enables dissipation of heat by forced air from a variable speed fan.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: April 2, 2024
    Assignee: NVIDIA Corporation
    Inventor: Ali Heydari
  • Publication number: 20240098945
    Abstract: Systems and methods include a first valve that controls a flow rate of a coolant. A processor is configured to set the flow rate of the coolant to a rate that maintains a vapor quality, measured at an outlet of the coolant, within a predetermined quality range.
    Type: Application
    Filed: July 21, 2022
    Publication date: March 21, 2024
    Inventor: Ali Heydari
  • Publication number: 20240098934
    Abstract: Systems and methods include pressure sensors that measure a pressure differential of coolant between a first coolant line and a second coolant line. Coolant flow control valves control respective valve flow rates. A processor selects a valve from the flow control valves to provide coolant to a coolant output, responsive to the measured pressure differential.
    Type: Application
    Filed: July 14, 2022
    Publication date: March 21, 2024
    Inventors: Ali Heydari, Pardeep Shahi
  • Publication number: 20240085961
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-liquid heat exchanger associated with a rear door of a rack exchanges heat between a primary coolant associated with a chilling facility and a secondary coolant or fluid associated with a computing device of the rack.
    Type: Application
    Filed: November 10, 2023
    Publication date: March 14, 2024
    Inventor: Ali Heydari
  • Patent number: 11910576
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an absorption chiller includes a generator vessel to enable removal of heat from fluid returned from at least one computing component of the datacenter.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: February 20, 2024
    Assignee: NVIDIA CORPORATION
    Inventor: Ali Heydari
  • Patent number: 11910577
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a hybrid coolant distribution unit (HCDU) provides first stage cooling of secondary coolant returning from at least one cold plate in a liquid to air heat exchanger (L2AHE) and provides second stage cooling in a liquid to liquid heat exchanger (L2LHE) for secondary coolant exiting an L2AHE using varying flow rates of a primary coolant based in part on a residual temperature that is determined for such secondary coolant exiting an L2AHE.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: February 20, 2024
    Assignee: NVIDIA Corporation
    Inventor: Ali Heydari
  • Patent number: 11895808
    Abstract: A cooling system for a datacenter is disclosed. The datacenter cooling system includes a refrigerant cooling loop to extract heat from a secondary cooling loop that is located within the datacenter or to provide supplemental cooling to one or more components of the datacenter that are coupled to the secondary cooling loop.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: February 6, 2024
    Assignee: NVIDIA Corporation
    Inventor: Ali Heydari
  • Patent number: 11895809
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a sensor string is associated with a first fluid line having a first flow controller and with a second fluid line having a second flow controller, so that sections of such a sensor string are enabled to maintain electrical connectivity there through by a mechanical coupling of a first flow controller and a second flow controller.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: February 6, 2024
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Patent number: 11882678
    Abstract: A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 23, 2024
    Assignee: Nvidia Corporation
    Inventors: Harold Miyamura, Jeremy Rodriguez, Alexander Ishii, Alex Naderi, Ali Heydari
  • Patent number: 11860067
    Abstract: Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal test vehicle can be used to simulate a thermal performance of a computing unit.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: January 2, 2024
    Assignee: Nvidia Corporation
    Inventors: Harold Karl Miyamura, Ali Heydari, Jeremy Rodriguez, Uschas Chowdhury
  • Patent number: 11864359
    Abstract: A remediation system for threshold leaks in a datacenter liquid cooling system is disclosed. The system includes a fluid controller and a power controller that are adapted to receive input from a learning subsystem that can determine that a threshold leak has occurred even though a computing component is functioning normally, so that a change in power state to reduce reliance on the coolant and so that a change of flow of the coolant may be effected.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: January 2, 2024
    Assignee: Nvidia Corporation
    Inventors: Ali Heydari, Mike Sabotta, Harold Miyamura
  • Publication number: 20230413466
    Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, a quick disconnect (QD) adapter can be associated with a mating rotational coupler of a rack-mounted coolant distribution unit (CDU) by a rotational action on a rotational coupler of a first side of a QD adapter and can be associated with a mating QD coupler of at least one cooling loop by a linear action on a linear coupler of a second side a QD adapter.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 21, 2023
    Inventor: Ali Heydari
  • Publication number: 20230413477
    Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, reconfigurable terminations are provided for fluid loops in a datacenter cooling system with individual ones of such reconfigurable terminations are to be configured in a first state to enable non-cooling fluid runs through individual ones of such fluid loops, taken individually and in combination, during commissioning of a datacenter cooling system, and are to be configured in a second state to enable cooling fluid runs to cool at least one cold plate after commissioning of a datacenter cooling system.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 21, 2023
    Inventor: Ali Heydari
  • Publication number: 20230403829
    Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, a thermal test vehicle (TTV) includes an air-cooled heat element associated with a plurality of fins to enable air cooling of a TTV and includes a liquid-cooled heat trace associated with a cold plate to enable liquid cooling of a TTV, where an air-cooled heat element and a liquid-cooled heat trace generate heat to enable separate or concurrent testing of air cooling and liquid cooling in a datacenter cooling system.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 14, 2023
    Inventor: Ali Heydari
  • Publication number: 20230397376
    Abstract: Systems and methods for testing in a datacenter are disclosed. In at least one embodiment, an aluminum nitride (Al—N) heat spreader includes, on one side, a patterned heat trace having a first concentration pattern that is dense relative to a second concentration pattern of a patterned heat trace, which all form part of a thermal test vehicle (TTV) to replicate heat generation by a computing device in a test of a datacenter cooling system.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 7, 2023
    Inventor: Ali Heydari
  • Patent number: 11829215
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-liquid heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: November 28, 2023
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari
  • Patent number: 11829213
    Abstract: A cooling system for a datacenter is disclosed. A multiple mode cooling subsystem of the cooling system has a form factor for one or more racks of the datacenter, has two or more different cooling systems, and is adjustable to different cooling requirements of the datacenter within different cooling capacities offered by the two or more different cooling systems.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: November 28, 2023
    Assignee: Nvidia Corporation
    Inventor: Ali Heydari