Patents by Inventor Ali Heydari

Ali Heydari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11343940
    Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 24, 2022
    Assignee: NVIDIA CORPORATION
    Inventor: Ali Heydari
  • Publication number: 20220151114
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, at least one rigid manifold having flow controllers to extend out of a platform and out from at least one row manifold so that push coupling is enabled with one or more mating couplers of at least one rack manifold of a rack that is positioned in a designated position on the platform.
    Type: Application
    Filed: November 11, 2020
    Publication date: May 12, 2022
    Inventor: Ali Heydari
  • Publication number: 20220142007
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a thermal buffer is provided to collect coolant from a plurality of coolant distribution units (CDUs), to enable thermal stability for the coolant within the thermal buffer, and to facilitate a cooling loop with one or more cooling manifolds associated with at least one computing device.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Inventor: Ali Heydari
  • Publication number: 20220142006
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) is provided to determine a change in a power state or a coolant state of at least one server and to enable a coolant response from an overhead cooling unit (OCU) to dissipate heat from secondary coolant of a secondary cooling loop.
    Type: Application
    Filed: October 29, 2020
    Publication date: May 5, 2022
    Inventor: Ali Heydari
  • Publication number: 20220117121
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) comprises control logic to cause at least one power controller to provide a power response or to cause at least one flow controller to provide a coolant response from the PCDU upon a determined change in a power state or coolant state.
    Type: Application
    Filed: October 13, 2020
    Publication date: April 14, 2022
    Inventors: Ali Heydari, Jeremy Rodriguez
  • Publication number: 20220117119
    Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, a cooling assembly can be used to monitor and control fluid quality associated with one or more servers.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 14, 2022
    Inventor: Ali Heydari
  • Publication number: 20220110223
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a fluid reservoir in a form-factor of at least one rack is provided, the fluid reservoir to store fluid, the fluid to be passed to a cold plate or an immersive-cooled server, and the fluid to be cooled by a secondary cooling loop or an air-cooling system.
    Type: Application
    Filed: October 1, 2020
    Publication date: April 7, 2022
    Inventor: Ali Heydari
  • Publication number: 20220104403
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an absorption chiller includes a generator vessel to enable removal of heat from fluid returned from at least one computing component of the datacenter.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Inventor: Ali Heydari
  • Publication number: 20220095476
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate has an opening and a cavity so that the cold plate can be hermetically sealed around at least one computing component at the cavity and so that the cold plate can comprise fluid to immerse at least a portion of the at least one computing component.
    Type: Application
    Filed: September 22, 2020
    Publication date: March 24, 2022
    Inventor: Ali Heydari
  • Publication number: 20220087054
    Abstract: Systems and methods for cooling a data center are disclosed. In at least one embodiment, a radiator is associated with one or more racks of a datacenter and has a first portion to function as an air-to-liquid heat exchanger having a primary cooling loop to absorb first heat away from the one or more racks and has a second portion to function as a liquid-to-liquid heat exchanger to enable at least one secondary cooling loop to exchange second heat with the primary cooling loop.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 17, 2022
    Inventor: Ali Heydari
  • Publication number: 20220087075
    Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to determine one or more temperature control settings associated with one or more servers.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 17, 2022
    Inventors: Ali Heydari, Vladimir Troy
  • Publication number: 20220071063
    Abstract: A datacenter liquid cooling system is disclosed. At least two liquid distribution units (LDUs) are enabled to concurrently serve coolant to at least one server tray in a first configuration, and the at least two LDUs are enabled for replacement of a first one of the at least two LDUs in a second configuration, in which a second one of the at least two LDUs is enabled to serve the coolant to the at least one server tray.
    Type: Application
    Filed: September 2, 2020
    Publication date: March 3, 2022
    Inventor: Ali Heydari
  • Publication number: 20220071055
    Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 3, 2022
    Inventor: Ali Heydari
  • Publication number: 20220071049
    Abstract: A remediation system for threshold leaks in a datacenter liquid cooling system is disclosed. The system includes a fluid controller and a power controller that are adapted to receive input from a learning subsystem that can determine that a threshold leak has occurred even though a computing component is functioning normally, so that a change in power state to reduce reliance on the coolant and so that a change of flow of the coolant may be effected.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 3, 2022
    Inventors: Ali Heydari, Mike Sabotta, Harold Miyamura
  • Publication number: 20220046828
    Abstract: A redundancy shut-off system for a datacenter liquid cooling system is disclosed. The redundancy shut-off system has a first ball valve located above a datacenter platform and coupling between a row manifold of a secondary cooling loop and a rack manifold of a rack, where the first ball valve provides redundancy to a second ball valve located below the datacenter platform.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 10, 2022
    Inventors: Harold Miyamura, Jeremy Rodriguez, Alexander Ishii, Alex Naderi, Ali Heydari
  • Publication number: 20220046826
    Abstract: A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop.
    Type: Application
    Filed: October 25, 2021
    Publication date: February 10, 2022
    Inventor: Ali Heydari
  • Publication number: 20220043413
    Abstract: A thermal load system for testing a datacenter liquid cooling system is disclosed. The system includes a server box having at least one thermal feature associated with at least one cooling feature and at least one flow controller, where the at least one thermal feature and the at least one flow controller are adjustable to cause cooling stress on the datacenter liquid cooling system.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 10, 2022
    Inventor: Ali Heydari
  • Publication number: 20220011835
    Abstract: A cooling system for a datacenter is disclosed. A multiple mode cooling subsystem of the cooling system has a form factor for one or more racks of the datacenter, has two or more different cooling systems, and is adjustable to different cooling requirements of the datacenter within different cooling capacities offered by the two or more different cooling systems.
    Type: Application
    Filed: July 9, 2020
    Publication date: January 13, 2022
    Inventor: Ali Heydari
  • Publication number: 20220015270
    Abstract: An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 13, 2022
    Inventors: Harold Miyamura, Jeremy Rodriguez, Ali Heydari
  • Publication number: 20220011834
    Abstract: A cooling system for a datacenter is disclosed. An evaporative cooling subsystem provides blown air for cooling the datacenter and a repurposable refrigerant cooling subsystem controls moisture of the blown air in a first configuration and independently cools the datacenter in a second configuration.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 13, 2022
    Inventor: Ali Heydari