Patents by Inventor Ali Heydari

Ali Heydari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220338368
    Abstract: Configurations for exhaust baffles are disclosed. In at least one embodiment, one or more baffles direct an outlet air flow from a heat exchanger.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 20, 2022
    Inventors: Jeremy Rodriguez, Ali Heydari
  • Publication number: 20220338377
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes an evaporator to remove heat from at least one computing device using a two-phase fluid and using a buffer to perform flow stabilization represented by different volumes or different flow rates of a two-phase fluid that is enabled to flow between an evaporator and a condensing or compressor unit located external to a cold plate.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 20, 2022
    Inventor: Ali Heydari
  • Publication number: 20220338374
    Abstract: Configurations for cooling systems are disclosed. In at least one embodiment, a fluid manifold is positioned to couple directly to one or more liquid-cooled server connections to form a connection when the liquid-cooled server is in an installed position within a server rack.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 20, 2022
    Inventor: Ali Heydari
  • Publication number: 20220330458
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate is coupled to a condenser section of a heat pipe and to a primary computing device, with the heat pipe coupled to an auxiliary computing device at an evaporator section of the heat pipe, so that the cold plate draws heat from the primary computing device and from the heat pipe.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 13, 2022
    Inventor: Ali Heydari
  • Patent number: 11435794
    Abstract: A cooling system for a datacenter is disclosed. An evaporative cooling subsystem provides blown air for cooling the datacenter and a repurposable refrigerant cooling subsystem controls moisture of the blown air in a first configuration and independently cools the datacenter in a second configuration.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: September 6, 2022
    Assignee: NVIDIA CORPORATION
    Inventor: Ali Heydari
  • Publication number: 20220264772
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 18, 2022
    Inventor: Ali Heydari
  • Publication number: 20220264771
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant-to-air (R2A) heat exchanger is interfaced with at least one cold plate to absorb heat from at least one computing device using a two-phase fluid and is interfaced with a compressor or condensing unit that causes dissipation of at least part of the heat within a datacenter.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 18, 2022
    Inventor: Ali Heydari
  • Publication number: 20220264764
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air (L2A) heat exchanger located overhead relative to plurality of racks of a datacenter and extending across the plurality of racks has fluid or secondary coolant from at least one computing device and is cooled by a fan wall that is associated with a rear door of at least one of a plurality of racks.
    Type: Application
    Filed: February 18, 2021
    Publication date: August 18, 2022
    Inventor: Ali Heydari
  • Publication number: 20220256735
    Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Inventor: Ali Heydari
  • Publication number: 20220256736
    Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Inventor: Ali Heydari
  • Publication number: 20220240422
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air heat exchanger is associated with a fan wall and a refrigerant-based cooling system to provide air cooling and refrigerant-based cooling to cool secondary coolant or fluid received from at least one cold plate.
    Type: Application
    Filed: January 27, 2021
    Publication date: July 28, 2022
    Inventor: Ali Heydari
  • Publication number: 20220236779
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-liquid heat exchanger associated with a rear door of a rack exchanges heat between a primary coolant associated with a chilling facility and a secondary coolant or fluid associated with a computing device of the rack.
    Type: Application
    Filed: January 22, 2021
    Publication date: July 28, 2022
    Inventor: Ali Heydari
  • Publication number: 20220228951
    Abstract: Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal test vehicle can be used to simulate a thermal performance of a computing unit.
    Type: Application
    Filed: January 19, 2021
    Publication date: July 21, 2022
    Inventors: Harold Karl Miyamura, Ali Heydari, Jeremy Rodriguez, Uschas Chowdhury
  • Publication number: 20220232739
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate has microchannels and a heat pipe to support a first fluid in an active mode of operation of a cold plate that uses microchannels, and to support a second fluid in a passive mode of operation of a cold plate that uses a heat pipe.
    Type: Application
    Filed: January 21, 2021
    Publication date: July 21, 2022
    Inventor: Ali Heydari
  • Publication number: 20220225545
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air heat exchanger is associated with a fan wall of a rack and enables a datacenter cooling system to address a first cooling requirement of the rack in a first mode by air through the rack from the fan wall and to address a second cooling requirement of a fluid from at least one cold plate in the rack using the air through the liquid-to-air heat exchanger.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 14, 2022
    Inventor: Ali Heydari
  • Publication number: 20220217872
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first flow controller within a cooling manifold is associated with a second flow controller and with a tube there between; and the first flow controller is movable in at least one direction relative to dimensions of the cooling manifold so that it can be positioned for mating with a server tray or box and so that the second flow controller can be mated with a rack manifold.
    Type: Application
    Filed: January 6, 2021
    Publication date: July 7, 2022
    Inventor: Ali Heydari
  • Publication number: 20220206547
    Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to adjust one or more flow control valves, of a liquid cooling system for a data center, to control a variation in liquid flow rate across the data center.
    Type: Application
    Filed: December 30, 2020
    Publication date: June 30, 2022
    Inventor: Ali Heydari
  • Publication number: 20220210955
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a modular unit is swappable or hot-swappable and has a heat exchanger, a variable speed fan, and at least one flow controller to pass fluid through microchannels of a cold plate, so that the fluid extracts heat from at least one computing device and so that fluid through a heat exchanger enables dissipation of heat by forced air from a variable speed fan.
    Type: Application
    Filed: December 30, 2020
    Publication date: June 30, 2022
    Inventor: Ali Heydari
  • Publication number: 20220174846
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-air heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 2, 2022
    Inventor: Ali Heydari
  • Publication number: 20220174847
    Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-liquid heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 2, 2022
    Inventor: Ali Heydari