Abstract: A cooling system for a datacenter is disclosed. A multiple mode cooling subsystem of the cooling system has a form factor for one or more racks of the datacenter, has two or more different cooling systems, and is adjustable to different cooling requirements of the datacenter within different cooling capacities offered by the two or more different cooling systems.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, system includes one or more processors to use one or more neural networks to control a direction of air flow caused by one or more fans to cool a coolant circulating within a liquid-to-air heat exchanger or to cool one or more servers of a rack, based at least in part on sensor data associated with at least one of: the coolant or the rack.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an alternate cooling loop with its own fluid source and a liquid-to-air heat exchanger is used to provide cooling for the at least one computing component alternatively from a secondary cooling loop that is associated with a primary cooling loop and a chilling facility.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a primary cooling loop includes at least one primary flow controller to control flow of a primary coolant to a coolant distribution unit (CDU) at a primary flow rate that is determined based in part on heat generated from one or more computing devices that is to be addressed by a secondary coolant, which is to be cooled in a CDU by a primary coolant at a primary flow rate enabled by at least one primary flow controller.

Abstract: A system includes one or more manifolds having at least one fixed flow controller and at least one movable flow controller.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant distribution unit (RDU) distributes first refrigerant from a refrigerant reservoir to one or more cold plates to extract heat from at least one computing device and also interfaces between a first refrigerant cooling loop having a first refrigerant and a second refrigerant cooling loop, so that a second refrigerant cooling loop uses second refrigerant to dissipate at least part of such heat through a second condenser unit to an ambient environment.

Abstract: A system comprising an adapter plate to couple a plurality of different types of cooling manifolds to one or more racks in a datacenter is disclosed. Additionally, a system comprising an adapter plate to adaptively couple a cooling manifold to a plurality of different types of server racks is disclosed.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes folded heat dissipation features to be cooled by at least one two-phase fluid via folded heat dissipation features having first and second channels of different widths; having first mechanical couplings for top portions of such folded heat dissipation features to an upper section of a cold pate; and having second mechanical couplings for bottom portions of the folded heat dissipation features to a lower section of the cold plate.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more outlet reservoirs are associated with a stabilizing subsystem and a rack so that one or more outlet reservoirs can receive two-phase fluid that is outlet from a plurality of cold plates of a rack and so that a stabilizing subsystem can stabilize a quality factor of a two-phase fluid to a predetermined quality factor before heat is removed from a two-phase fluid and it is cycled to such cold plates.

Abstract: A datacenter liquid cooling system is disclosed. A processor detects whether one or more liquid distribution units (LDUs) of the datacenter cooling system can be deactivated based on one or more workloads of one or more servers cooled by the datacenter cooling system.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first interfacing flow controller includes a sensor and is associated with a first server tray of a rack, so that a first interfacing flow controller can receive sensor inputs and can communicate with a second interfacing flow controller by a communication line there between, where a second interfacing flow controller can be associated with a coolant distribution unit (CDU) to cause a balance of coolant flow to be provided from a CDU to one or more second server trays based in part on a change in a coolant flow to a first server tray as indicated by such sensor inputs.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first flow controller within a cooling manifold is associated with a second flow controller and with a tube there between; and the first flow controller is movable in at least one direction relative to dimensions of the cooling manifold so that it can be positioned for mating with a server tray or box and so that the second flow controller can be mated with a rack manifold.

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, an apparatus comprises a controller to control a proportion of coolant provided by an air cooling unit and a liquid cooling unit based, at least in part, on temperature of one or more electronic components.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.

Abstract: An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a plurality of in-rack coolant distribution units (IRCDUs) include a first IRCDU and a second IRCDU that are interchangeable within a rack depending on a type of coolant to be provided to a rack from a coolant distribution unit (CDU), so that a first IRCDU that is calibrated to a first coolant can distribute a first coolant and a second IRCDU that is calibrated to a second coolant can distribute a second coolant to a rack manifold of a rack.

Abstract: A cooling system for a datacenter is disclosed. An evaporative cooling subsystem provides blown air for cooling the datacenter and a repurposable refrigerant cooling subsystem controls moisture of the blown air in a first configuration and independently cools the datacenter in a second configuration.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a flow controller adapter of a cooling manifold is to interchangeably receive a flow controller of a plurality of flow controllers, wherein a flow controller adapter is associated with a rack-side flow controller and with a tube there between and is configured to be movable within cooling manifold to allow different positions for mating a flow controller with a server-side flow controller of server tray or box.

Abstract: Systems and methods for operating a datacenter are disclosed. In at least one embodiment, hybrid cooling unit is disclosed wherein an evaporative cooler is to provide a source of cooled air and a liquid heat exchanger is to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, multiple parallel refrigerant paths are associated with one or more flow controllers to cool multiple computing devices associated therewith, so that one or more flow controllers can distribute equal measures of a liquid phase of refrigerant, relative to a vapor phase of a refrigerant, to such parallel refrigerant paths based in part on a cooling requirement from at least one of such multiple computing devices.