Abstract: A wireless communication method and a user equipment (UE) are provided. The wireless communication method by the UE includes operations as follows. The base station or a serving cell of the UE configures with a validity duration, a first information including a satellite ephemeris data and/or a timing advance related parameter is received from the serving cell within the validity duration, and a starting time for the validity time is derived.

Abstract: A sample message processing method and apparatus. The method includes: acquiring interface data generated during a process of performing data interaction by means of an interface; determining additional data corresponding to the interface data; on the basis of the additional data, generating identification data corresponding to the interface data; if the identification data matches historical identification data, determining a request message and a response message, which correspond to message version data, as a historical sample message pair; and if the identification data does not match the historical identification data, determining the request message and the response message, which correspond to the message version data, as a new sample message pair, such that a sample message pair can be formed on the basis of the interface data.

Abstract: A charging system for a mobile device including a charging connector, a first charging component, a second charging component, a flexible printed circuit board, a first battery, and a second battery is provided. The first charging component includes a first input terminal electrically connected to the charging connector and a first output terminal. The second charging component includes a second input terminal electrically connected to the first output terminal and a second output terminal. The flexible printed circuit board includes a first charging connecting terminal and a second charging connecting terminal. The first charging connecting terminal is electrically connected to the second output terminal, and the second charging connecting terminal is electrically connected to a ground terminal. The flexible printed circuit board electrically connects the first battery and the second battery in series between the first charging connecting terminal and the second charging connecting terminal.

Abstract: Methods and systems are presented for analyzing transactions conducted through user accounts with an online service provider based on graph analysis. A graph is generated based on a set of seed accounts that are determined to be involved in suspicious activities. The graph includes a set of seed nodes representing the seed accounts, and a set of nodes representing user accounts that are connected to the set of seed accounts in downstream transactions. A random walk traversal based on multiple dimensions is performed on the graph to determine nodes that are closely related to the set of seed nodes. Transactions conducted through the seed accounts and accounts corresponding to nodes that are closely related to the set of seed nodes are analyzed to detect any malicious activities. The graph may also be presented according to a layered hierarchical structure for better visualization of transaction flows through the accounts.

Abstract: The present invention discloses a data transmission apparatus having clock gating mechanism. Each of data transmission circuits has a flip-flop depth of N and receives a write clock signal and one of read clock signals to receive and output one of data signals. A write clock gating circuit receives a write clock gating enabling signal to transmit the write clock signal to the data transmission circuits. Each of read clock gating circuits receives one of read clock gating enabling signals to transmit one of the read clock signals. The gating signal transmission circuit has a flip-flop depth of N+M and receives the write and the read clock signals to receive the write clock gating enabling signal and output the read clock gating enabling signals. A largest timing difference among the read clock signals is P clock cycles and M is at least ?P?.

Abstract: This application discloses a video sequence selection method, applicable to a computer device, the method including: receiving a to-be-matched video and a to-be-matched text, the to-be-matched text having a to-be-matched text feature sequence; invoking a spatiotemporal candidate region generator to extract a spatiotemporal candidate region set from the to-be-matched video, the spatiotemporal candidate region set including N spatiotemporal candidate regions; performing feature extraction on each spatiotemporal candidate region by using a convolutional neural network, to obtain N to-be-matched video feature sequences; invoking an attention-based interactor to obtain a matching score corresponding to each spatiotemporal candidate region, the matching score being used for representing a matching relationship between the spatiotemporal candidate region and the to-be-matched text; and selecting a target spatiotemporal candidate region from the spatiotemporal candidate region set according to the matching score corr

Abstract: A semiconductor device can be applied to a memory device. The semiconductor device of the disclosure includes a voltage sensor, a convertor and a command/address on-die-termination (CA_ODT) circuit. The voltage sensor receives a voltage setting command, and sense a voltage level of the voltage setting command to generate a sensing signal. The convertor generates a setting signal in response to the sensing signal. The CA_ODT circuit generates a power voltage for the memory device in response to the setting signal, wherein a voltage level of the power voltage corresponds to the voltage level of the voltage setting command.

Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.

Abstract: Systems and methods for precision writing of weight values to a memory capable of storing multiple levels in each cell are disclosed. Embodiments include logic to compare an electrical parameter read from a memory cell with a base reference and an interval reference, and stop writing once the electrical parameter is between the base reference and the base plus the interval reference. The interval may be determined using a greater number of levels than the number of stored levels, to prevent possible overlap of read values of the electrical parameter due to memory device variations.

Abstract: A device includes a device layer comprising a first transistor and a second transistor; a first interconnect structure on a front-side of the device layer; and a second interconnect structure on a backside of the device layer. The second interconnect structure comprising a first dielectric layer on the backside of the device layer, wherein a semiconductor material is disposed between the first dielectric layer and a first source/drain region of the first transistor; a contact extending through the first dielectric layer to a second source/drain region of the second transistor; and a first conductive line electrically connected to the second source/drain region of the second transistor through the contact.

Abstract: An apparatus is provided which comprises: a stack comprising a magnetic insulating material (MI such as EuS, EuO, YIG, TmIG, or GaMnAs) and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, or graphene), wherein the magnetic insulating material has a first magnetization; a magnet with a second magnetization, wherein the magnet is adjacent to the TMD of the stack; and an interconnect comprising a spin orbit material, wherein the interconnect is adjacent to the magnet.

Abstract: A semiconductor structure includes a semiconductor fin extending from a substrate, a source/drain (S/D) feature disposed over the semiconductor fin, a silicide layer disposed over the S/D feature, where the silicide layer extends along a sidewall of the S/D feature, and an etch-stop layer (ESL) disposed along a sidewall of the silicide layer.

Abstract: The present disclosure provides a semiconductor processing apparatus according to one embodiment. The semiconductor processing apparatus includes a chamber; a base station located in the chamber for supporting a semiconductor substrate; a preheating assembly surrounding the base station; a first heating element fixed relative to the base station and configured to direct heat to the semiconductor substrate; and a second heating element moveable relative to the base station and operable to direct heat to a portion of the semiconductor substrate.

Abstract: A method includes applying a first voltage to a source of a first transistor of a detector unit of a semiconductor detector in a test wafer and applying a second voltage to a gate of the first transistor and a drain of a second transistor of the detector unit. The first transistor is coupled to the second transistor in series, and the first voltage is higher than the second voltage. A pre-exposure reading operation is performed to the detector unit. Light of an exposure apparatus is illuminated to a gate of the second transistor after applying the first and second voltages. A post-exposure reading operation is performed to the detector unit. Data of the pre-exposure reading operation is compared with the post-exposure reading operation. An intensity of the light is adjusted based on the compared data of the pre-exposure reading operation and the post-exposure reading operation.

Abstract: A structure is provided that includes a first conductive component and a first interlayer dielectric (ILD) that surrounds the first conductive component. A self-assembly layer is formed on the first conductive component but not on the first ILD. A first dielectric layer is formed over the first ILD but not over the first conductive component. A second ILD is formed over the first conductive component and over the first ILD. An opening is etched in the second ILD. The opening is at least partially aligned with the first conductive component. The first dielectric layer protects portions of the first ILD located therebelow from being etched. The opening is filled with a conductive material to form a second conductive component in the opening.

Abstract: A method of manufacturing a semiconductor device includes forming a first protective layer over an edge portion of a first main surface of a semiconductor substrate. A metal-containing photoresist layer is formed over the first main surface of the semiconductor substrate. The first protective layer is removed, and the metal-containing photoresist layer is selectively exposed to actinic radiation. A second protective layer is formed over the edge portion of the first main surface of the semiconductor substrate. The selectively exposed photoresist layer is developed to form a patterned photoresist layer, and the second protective layer is removed.

Abstract: A semiconductor device includes an active fin disposed on a substrate, a gate structure, and a pair of gate spacers disposed on sidewalls of the gate structure, in which the gate structure and the gate spacers extend across a first portion of the active fin, and a bottom surface of the gate structure is higher than a bottom surface of the gate spacers.

Abstract: A light-emitting device, a light-emitting assembly and an integrated circuit (IC) flip-chip are provided. The light-emitting device includes the IC flip-chip, a plurality of light-emitting diode (LED) flip-chips and a substrate. The IC flip-chip includes a plurality of flip-chip pads. The LED flip-chips are spaced apart from the IC flip-chip. The substrate carries the IC flip-chip and the LED flip-chips. The LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are disposed on the substrate by way of soldering. The LED flip-chips are electrically coupled to the IC flip-chip through the substrate.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a first semiconductor device. The semiconductor structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first oxide layer formed below the a first substrate, a first bonding layer formed below the first oxide layer, and a first bonding via formed through the first bonding layer and the first oxide layer. The second semiconductor device includes a second oxide layer formed over a second substrate, a second bonding layer formed over the second oxide layer, and a second bonding via formed through the second bonding layer and the second oxide layer. The semiconductor structure also includes a bonding structure between the first substrate and the second substrate, and the bonding structure includes the first bonding via bonded to the second bonding via.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base portion and a fin portion over the base portion. The semiconductor device structure includes an epitaxial structure over the fin portion. The semiconductor device structure includes a dielectric fin over the base portion. The semiconductor device structure includes a silicide layer between the dielectric fin and the epitaxial structure. A void is between the silicide layer and the dielectric fin.