Patents by Inventor An Mei Chen

An Mei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220216085
    Abstract: An electrostatic chuck is provided, the electrostatic chuck includes a base; and an insulating layer, an electrode layer, a first dielectric layer, and a second dielectric layer sequentially stacked on the base. The first dielectric layer is aluminum oxide (Al2O3) or aluminum nitride (AlN). A material of the second dielectric layer is different from a material of the first dielectric layer, and the second dielectric layer includes titanium element, IVA group element, and oxygen element.
    Type: Application
    Filed: July 23, 2021
    Publication date: July 7, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yung-Hsiang HUANG, Wei-Cheng TANG, Yi-Che SU, Wen-Pin CHUANG, Su-Mei CHEN WEI, Ya-Tin YU, Yun-Shan HUANG
  • Patent number: 11379085
    Abstract: The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first bridging layer, a first touch sensing layer, a second bridging layer, and a second touch sensing layer. The first bridging layer extends on the substrate along a first direction. The first touch sensing layer is disposed on the substrate and includes a plurality of first touch sensing electrodes, wherein the first bridging layer connects adjacent first touch sensing electrodes of the first touch sensing electrodes. The second bridging layer is disposed on the first bridging layer, located between the adjacent first touch sensing electrodes, and connected in parallel with the first bridging layer. The second touch sensing layer is disposed on the substrate, crosses the second bridging layer along a second direction, and is disposed between the adjacent first touch sensing electrodes.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: July 5, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Qi Bin Liu, Kuo Lung Fang, Ya Mei Chen, Ya Ting Hsu
  • Patent number: 11377526
    Abstract: The present invention relates to a high performance cross-linked triblock cationic functionalized polymer for electrochemical applications, and methods of making and using the same. The invention also relates to a tunable hydrogenated polymer, that can be functionalized with a particular cation for a particular application, and the method of making the hydrogenated polymer and tuning the hydrogenated polymer for the application.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: July 5, 2022
    Assignees: Colorado School of Mines, University of Massachusetts
    Inventors: Andrew M. Herring, Mei-Chen Kuo, E. Bryan Coughlin, Nora Buggy, Yifeng Du
  • Patent number: 11377373
    Abstract: An electrochemical membrane module for selectively removing pollutants and a preparation method thereof are provided. A Ti/SnO2—Sb substrate electrode is coated with a MI—TiO2 sol-gel by means of a dip-coating method, and then sintered to obtain a molecular imprinting type Ti/MI—TiO2/SnO2—Sb coated electrode; the coated electrode is adhered to a ceramic micro-filtration membrane using epoxy resin glue to obtain a Ti/MI—TiO2/SnO2—Sb MI-anodic conductive composite membrane; the MI-anodic conductive composite membrane is used as an anode, and a titanium mesh is used as a cathode, so that the electrochemical membrane module capable of selectively removing pollutants is obtained. The invention effectively combines an electrochemical micro-filtration membrane and a molecular imprinting technique. When the electrochemical membrane module is used, suspended particles and refractory organics in the sewage are removed, and a highly selective removal of certain refractory pollutants can be achieved.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: July 5, 2022
    Assignee: TONGJI UNIVERSITY
    Inventors: Zhiwei Wang, Mei Chen, Zhichao Wu
  • Publication number: 20220188599
    Abstract: A neural architecture search (NAS) with a weak predictor comprises: receiving network architecture scoring information; iteratively sampling a search space, wherein the sampling comprises: generating a set of candidate architectures within the search space; learning a first predictor; evaluating performance of the candidate architectures; and based on at least the performance of the set of candidate architectures and the network architecture scoring information, refining the search space to a smaller search space; based on at least the network architecture scoring information, thresholding the performance of candidate architectures to determine scored output candidate architectures; and reporting the scored output candidate architectures. In some examples, the candidate architectures each comprise a machine learning (ML) model, for example a neural network (NN).
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Inventors: Xiyang DAI, Dongdong CHEN, Yinpeng CHEN, Mengchen LIU, Ye YU, Zicheng LIU, Mei CHEN, Lu YUAN, Junru WU
  • Publication number: 20220188595
    Abstract: A computer device for automatic feature detection comprises a processor, a communication device, and a memory configured to hold instructions executable by the processor to instantiate a dynamic convolution neural network, receive input data via the communication network, and execute the dynamic convolution neural network to automatically detect features in the input data. The dynamic convolution neural network compresses the input data from an input space having a dimensionality equal to a predetermined number of channels into an intermediate space having a dimensionality less than the number of channels. The dynamic convolution neural network dynamically fuses the channels into an intermediate representation within the intermediate space and expands the intermediate representation from the intermediate space to an expanded representation in an output space having a higher dimensionality than the dimensionality of the intermediate space.
    Type: Application
    Filed: December 16, 2020
    Publication date: June 16, 2022
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Yinpeng CHEN, Xiyang DAI, Mengchen LIU, Dongdong CHEN, Lu YUAN, Zicheng LIU, Ye YU, Mei CHEN, Yunsheng LI
  • Patent number: 11359008
    Abstract: Described herein are compositions that include monoclonal antibodies that specifically bind Hsp90? and methods of using the same to treat HIF-1a-overexpressing cancer. In some embodiments, the cancers are breast cancer or lung cancer. The monoclonal antibodies bind the epitope TKPIWTRNP in Hsp90? or VKHFSVEGQ in Hsp90?.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: June 14, 2022
    Assignee: University of Southern California
    Inventors: Wei Li, David Woodley, Mei Chen, Divya Sahu, Hangming Dong, Mengchen Zou
  • Publication number: 20220169808
    Abstract: An anti-curling film is provided. The anti-curling film includes a first portion and a second portion covering the first portion. The first portion includes polylactic acid (PLA), polycaprolactone (PCL), polyethylene glycol dimethacrylate (PEGDMA) and a photoinitiator. The second portion includes polycaprolactone (PCL), gelatin, hyaluronic acid (HA), alginate (AA), polyvinyl alcohol (PVA) or a combination thereof.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 2, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wei-Hong CHANG, Ching-Mei CHEN, Grace H. CHEN, Hsin-Hsin SHEN, Yuchi WANG, Ming-Chia YANG, Li-Hsin LIN, Sen-Lu CHEN, Yi-Hsuan LEE, Jian-Wei LIN, Liang-Cheng SU
  • Publication number: 20220165877
    Abstract: In some implementations, one or more semiconductor processing tools may form a first terminal of a semiconductor device by depositing a tunneling oxide layer on a first portion of a body of the semiconductor device, depositing a first volume of polysilicon-based material on the tunneling oxide layer, and depositing a first dielectric layer on an upper surface and a second dielectric layer on a side surface of the first volume of polysilicon-based material. The one or more semiconductor processing tools may form a second terminal of the semiconductor device by depositing a second volume of polysilicon-based material on a second portion of the body of the semiconductor device. A side surface of the second volume of polysilicon-based material is adjacent to the second dielectric layer.
    Type: Application
    Filed: January 28, 2022
    Publication date: May 26, 2022
    Inventors: Yu-Chu LIN, Chi-Chung JEN, Wen-Chih CHIANG, Ming-Hong SU, Yung-Han CHEN, Mei-Chen SU, Chia-Ming PAN
  • Publication number: 20220153813
    Abstract: The present invention discloses a method for treating wounds and for accelerating the healing of wounds by administering an effective amount of a pharmaceutical composition containing type VII collagen protein, mini-C7 protein, variants thereof or any combinations thereof. The pharmaceutical composition may be administered through a variety of routes including intravenous injection, topical application, or oral ingestion. The method may further include administering a genetically modified fibroblast capable of expressing type VII collagen protein, miniC7 protein, variants thereof or small growth factors to achieve synergistic healing effect.
    Type: Application
    Filed: January 11, 2022
    Publication date: May 19, 2022
    Inventors: Mei CHEN, David WOODLEY
  • Patent number: 11333578
    Abstract: A method and system of providing customizable service for an asset. The method including generating a predictive model for each asset of a fleet, each predictive model based on an operational profile for the asset and including a probability density function associated with the operational durability of the asset, establishing a maintenance strategy associated with the asset, and combining each of the predictive models to generate a compound fleet performance model, the fleet performance model including a combined probability density function. The method also includes collecting actual asset performance and maintenance data to generate actual asset metrics, determining a fleet performance profile based on the actual asset metrics indicative of a health assessment of the fleet, comparing the predicted fleet performance with the actual fleet performance, and ascertaining actionable choices for managing the assets based on a deviation of the predicted and actual fleet performance.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: May 17, 2022
    Assignee: RAYTHEON TECHNOLOGIES CORPORATION
    Inventors: Thomas A. Frewen, Ozgur Erdinc, Hala Mostafa, Mei Chen, Draguna Vrabie
  • Publication number: 20220137748
    Abstract: The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first bridging layer, a first touch sensing layer, a second bridging layer, and a second touch sensing layer. The first bridging layer extends on the substrate along a first direction. The first touch sensing layer is disposed on the substrate and includes a plurality of first touch sensing electrodes, wherein the first bridging layer connects adjacent first touch sensing electrodes of the first touch sensing electrodes. The second bridging layer is disposed on the first bridging layer, located between the adjacent first touch sensing electrodes, and connected in parallel with the first bridging layer. The second touch sensing layer is disposed on the substrate, crosses the second bridging layer along a second direction, and is disposed between the adjacent first touch sensing electrodes.
    Type: Application
    Filed: November 2, 2020
    Publication date: May 5, 2022
    Inventors: Qi Bin Liu, Kuo Lung Fang, Ya Mei Chen, Ya Ting Hsu
  • Publication number: 20220110232
    Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 7, 2022
    Inventors: Sung-Sheng CHIU, Pei-Haw TSAO, Tsui-Mei CHEN, Shih-Hsing LIN, Li-Huan CHU
  • Publication number: 20220092420
    Abstract: Embodiments of the present disclosure provide a method, a device, and a storage medium for domain adaptation for efficient learning fusion (DAELF). The method includes acquiring data from a plurality of data sources of a plurality of sensors; for each of the plurality of sensors, training an auxiliary classifier generative adversarial network (AC-GAN) by a hardware processor with data from each data source of the plurality of data sources, thereby obtaining a trained feature extraction network and a trained label prediction network for each data source; forming a decision-level fusion network or a feature-level fusion network; and training the decision-level fusion network or the feature-level fusion network with a source-only mode or a generate to adapt (GTA) mode; and applying the trained decision-level fusion network or the trained feature-level fusion network to detect a target of interest.
    Type: Application
    Filed: September 21, 2021
    Publication date: March 24, 2022
    Inventors: Jingyang LU, Erik BLASCH, Roman ILIN, Hua-mei CHEN, Dan SHEN, Nichole SULLIVAN, Genshe CHEN
  • Patent number: 11261235
    Abstract: The present invention discloses a method for treating wounds and for accelerating the healing of wounds by administering an effective amount of a pharmaceutical composition containing type VII collagen protein, mini-C7 protein, variants thereof or any combinations thereof. The pharmaceutical composition may be administered through a variety of routes including intravenous injection, topical application, or oral ingestion. The method may further include administering a genetically modified fibroblast capable of expressing type VII collagen protein, miniC7 protein, variants thereof or small growth factors to achieve synergistic healing effect.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: March 1, 2022
    Assignee: UNIVERSITY OF SOUTHERN CALIFORNIA
    Inventors: Mei Chen, David Woodley
  • Patent number: 11262878
    Abstract: The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first touch sensing layer, a metal wiring layer, and a transparent conductive layer. The substrate has a visible area and a peripheral area located around the visible area. The first touch sensing layer extends from the visible area to the peripheral area of the substrate. The metal wiring layer is located in the peripheral area of the substrate and is laterally separated from the first touch sensing layer. The transparent conductive layer is located in the peripheral area of the substrate and has a first portion and a second portion. The first portion is in contact with the first touch sensing layer and the second portion is in contact with the metal wiring layer.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: March 1, 2022
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Qi Bin Liu, Kuo Lung Fang, Ya Mei Chen, Ya Ting Hsu
  • Patent number: 11257963
    Abstract: In some implementations, one or more semiconductor processing tools may form a first terminal of a semiconductor device by depositing a tunneling oxide layer on a first portion of a body of the semiconductor device, depositing a first volume of polysilicon-based material on the tunneling oxide layer, and depositing a first dielectric layer on an upper surface and a second dielectric layer on a side surface of the first volume of polysilicon-based material. The one or more semiconductor processing tools may form a second terminal of the semiconductor device by depositing a second volume of polysilicon-based material on a second portion of the body of the semiconductor device. A side surface of the second volume of polysilicon-based material is adjacent to the second dielectric layer.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: February 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chu Lin, Chi-Chung Jen, Wen-Chih Chiang, Ming-Hong Su, Yung-Han Chen, Mei-Chen Su, Chia-Ming Pan
  • Patent number: 11240947
    Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: February 1, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu
  • Publication number: 20210382350
    Abstract: A reflective filter includes a first substrate provided with a first electrode, a second substrate provided with a second electrode, and a liquid crystal layer filled with a liquid crystal composition including cholesteric liquid crystals, wherein the reflective filter includes at least two reflective areas that reflect light of different colors. By applying an external electric field to align the liquid crystal molecules, ultraviolet light is used to induce a chiral compound to subject to chiral inversion, such that the division control of the reflective areas is realized in a same kind of a liquid crystal material matrix.
    Type: Application
    Filed: July 10, 2020
    Publication date: December 9, 2021
    Inventor: Mei CHEN
  • Publication number: 20210357744
    Abstract: Providing a task-aware recommendation of hyperparameter configurations for a neural network architecture. First, a joint space of tasks and hyperparameter configurations are constructed using a plurality of tasks (each of which corresponds to a dataset) and a plurality of hyperparameter configurations. The joint space is used as training data to train and optimize a performance prediction network, such that for a given unseen task corresponding to one of the plurality of tasks and a given hyperparameter configuration corresponding to one of the plurality of hyperparameter configurations, the performance prediction network is configured to predict performance that is to be achieved for the unseen task using the hyperparameter configuration.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 18, 2021
    Inventors: Gaurav MITTAL, Victor Manuel FRAGOSO ROJAS, Nikolaos KARIANAKIS, Mei CHEN, Chang LIU