Patents by Inventor An-Tung Chen

An-Tung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978758
    Abstract: Methods for forming via last through-vias. A method includes providing an active device wafer having a front side including conductive interconnect material disposed in dielectric layers and having an opposing back side; providing a carrier wafer having through vias filled with an oxide extending from a first surface of the carrier wafer to a second surface of the carrier wafer; bonding the front side of the active device wafer to the second surface of the carrier wafer; etching the oxide in the through vias in the carrier wafer to form through oxide vias; and depositing conductor material into the through oxide vias to form conductors that extend to the active carrier wafer and make electrical contact to the conductive interconnect material. An apparatus includes a carrier wafer with through oxide vias extending through the carrier wafer to an active device wafer bonded to the carrier wafer.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung, Jen-Cheng Liu
  • Publication number: 20240144307
    Abstract: One aspect of systems and methods for segment size estimation includes identifying a segment of users for a first time period based on time series data, wherein the time series data includes a series of interactions between users and a content channel and wherein the segment includes a portion of the users interacting with the content channel during the first time period; computing a segment return value for a second time period based on the time series data by computing a first subset and a second subset of the segment, wherein the first subset includes users that interact with the content channel greater than a threshold number of times during a range of the time series data and the second subset comprises a complement of the first subset with respect to the segment; and providing customized content to a user in the segment based on the segment return value.
    Type: Application
    Filed: October 18, 2022
    Publication date: May 2, 2024
    Inventors: Tung Mai, Ritwik Sinha, Trevor Hyrum Paulsen, Xiang Chen, William Brandon George, Nate Purser, Zhao Song
  • Patent number: 11969349
    Abstract: An implant for the repair of bone and cartilage that includes a cell conductive zone that contains biopolymeric fibers and an osteoconductive zone that contains biopolymeric fibers and calcium-containing mineral particles. The biopolymeric fibers from one zone overlap with the fibers in the other zone forming a stable physical and mechanical integration of the two zones, thus conferring in vivo stability to the implant.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: April 30, 2024
    Assignee: Collagen Matrix, Inc.
    Inventors: Shu-Tung Li, Hui-Chen Chen, Debbie Yuen
  • Publication number: 20240129634
    Abstract: The embodiments of the disclosure provide a method for dynamically controlling shooting parameters of a camera and a tracking device. The method includes: determining a plurality of time frames, wherein the time frames include a plurality of first time frames and a plurality of second time frames; controlling the camera of the tracking device to shoot a first image with a first exposure parameter in each of the first time frames and accordingly performing an environment detection; controlling the camera of the tracking device to shoot a second image with a second exposure parameter in each of the second time frames and accordingly performing a first specific detection, wherein the second exposure parameter is lower than the first exposure parameter.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: HTC Corporation
    Inventors: Yuan-Tung Chen, Jyun-Jhong Lin, Chih Chien Chen
  • Publication number: 20240115782
    Abstract: A portable hemodialysis system is provided including a dialyzer, a closed loop blood flow path, a closed loop dialysate flow path, a blood pump, and a pair of dialysate pumps. A processor controls the flow of blood through the blood flow path, and the processor controls the flow of dialysate through the dialysate flow path. In addition, the processor stores a preprogrammed patient treatment plan wherein the flow rate of the dialysate through the dialysate flow path reduces throughout the patient's treatment to maximize the amount of urea removed by the sorbent filter. In alternative embodiments, the processor stores a patient treatment plan wherein the dialysate flow rate increases throughout the patient's treatment. In still alternative embodiments, the processor stores a patient treatment plan wherein the flow rate of the dialysate through the dialysate flow path both increases and decreases throughout the patient's treatment.
    Type: Application
    Filed: July 31, 2023
    Publication date: April 11, 2024
    Inventors: Brandon Borillo, Tzu Tung Chen, Clayton Poppe
  • Patent number: 11952498
    Abstract: Disclosed herein are a colored functionalized paracyclophane represented by Formula (I) and a colored chemical film represented by Formula (II): wherein A, o, and p in Formula (I) and Formula (II) are as defined herein. The colored chemical film may be formed from the colored functionalized [2,2]paracyclophane by chemical vapor deposition.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: April 9, 2024
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Hsien-Yeh Chen, Sheng-Tung Huang
  • Patent number: 11952386
    Abstract: The present invention relates to compounds of formula I: in which p, q, Y1, Y2, R1, R2a, R2b, R3a, R3b, R4a, R4b, R5a, R5b, R7 and R8 are defined in the Summary of the Invention; capable of inhibiting the activity of SHP2. The invention further provides a process for the preparation of compounds of the invention, pharmaceutical preparations comprising such compounds and methods of using such compounds and compositions in the management of diseases or disorders associated with the aberrant activity of SHP2.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: April 9, 2024
    Assignee: NOVARTIS AG
    Inventors: Christine Hiu-Tung Chen, Zhuoliang Chen, Michael Dore, Jorge Garcia Fortanet, John William Giraldes, Rajesh Karki, Mitsunori Kato, Matthew J. LaMarche, Lawrence Blas Perez, Martin Sendzik, Troy Douglas Smith, Bakary-Barry Toure, Sarah Williams
  • Patent number: 11955154
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
  • Publication number: 20240112963
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor wafer and a test structure. The semiconductor wafer has a substrate having a scribe line area, a first die area and a second die area. The first die area and the second die area are separated by the scribe line area extending along a first direction. The test structure is disposed in the scribe line area. The test structure includes a test device and a first test pad. The test device has a physical characteristic similar to a semiconductor device fabricated in the first die area or the second die area. The first test pad is electrically connected to the test device. A first distance between the first test pad and the first die area gradually increases from a center region to a peripheral region of the first test pad in the first direction.
    Type: Application
    Filed: August 8, 2023
    Publication date: April 4, 2024
    Inventors: Yu-Tung CHEN, Pei-Haw TSAO, Kuo-Lung FAN, Yuan-Fu CHUNG
  • Publication number: 20240110576
    Abstract: An impeller is provided, including a metal housing, a shaft, and a plastic member. The metal housing has a shaft mounting hole. The inner surface of the shaft mounting hole includes three or more contact points, and the contact points are closer to the shaft than other portions of the inner surface of the shaft mounting hole. The shaft passes through the shaft mounting hole and is affixed by the contact points. The metal housing divides the shaft into an upper section, a middle section, and a lower section. The plastic member passes through the shaft mounting hole and is in contact with the middle section.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Inventors: Wei-I LING, Chao-Fu YANG, Chih-Chung CHEN, Kuo-Tung HSU
  • Publication number: 20240107680
    Abstract: A subtractive method for manufacturing a circuit board with fine interconnect includes steps of disposing a resist film on a metal layer on a surface of a wiring substrate, and performing a dry etching process to etch and penetrate the resist film and form a wiring pattern groove in the metal layer, the depth of the wiring pattern groove is less than the thickness of the first metal layer; further wet etching process is performed, and the metal layer is etched again from the wiring pattern groove to penetrate the metal layer to form wires in the metal layer, and finally the resist film is removed. By first using dry etching to form wiring pattern grooves in the metal layer, the thickness of the metal layer to be removed by wet etching is reduced, thereby reducing side etching generated by the wet etching process and improving the wiring quality.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Inventor: HSU-TUNG CHEN
  • Publication number: 20240103520
    Abstract: A method of controlling movement of an autonomous mobile apparatus including a driving module, a processor, and a positioning module includes steps of: the processor moving the autonomous mobile apparatus at a default speed from a first location toward a second location along a straight path; the positioning module obtaining data related to a current location; when the processor determines that a distance between the current location and the second location is greater than a predetermined distance, the processor obtaining a deviating direction and a minimum distance of the current location relative to the straight path; the processor setting a movement speed and an angular velocity based on the deviating direction, a tolerant distance, the minimum distance, and the default speed; and the processor controlling the driving apparatus to move the autonomous mobile apparatus at the movement speed and turning the autonomous mobile apparatus at the angular velocity.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Inventors: Chien-Tung CHEN, Chung-Hou WU, Chao-Cheng CHEN, Wen-Wei CHIANG
  • Patent number: 11942130
    Abstract: A bottom-pinned spin-orbit torque magnetic random access memory (SOT-MRAM) is provided in the present invention, including a substrate, a bottom electrode layer on the substrate, a magnetic tunnel junction (MTJ) on the bottom electrode layer, a spin-orbit torque (SOT) layer on the MTJ, a capping layer on the SOT layer, and an injection layer on the capping layer, wherein the injection layer is divided into individual first part and second part, and the first part and the second part are connected respectively with two ends of the capping layer.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: March 26, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jian-Jhong Chen, Yi-Ting Wu, Jen-Yu Wang, Cheng-Tung Huang, Po-Chun Yang, Yung-Ching Hsieh
  • Patent number: 11935947
    Abstract: An enhancement mode high electron mobility transistor (HEMT) includes a group III-V semiconductor body, a group III-V barrier layer and a gate structure. The group III-V barrier layer is disposed on the group III-V semiconductor body, and the gate structure is a stacked structure disposed on the group III-V barrier layer. The gate structure includes a gate dielectric and a group III-V gate layer disposed on the gate dielectric, and the thickness of the gate dielectric is between 15 nm to 25 nm.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: March 19, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Tung Yeh, Chun-Ming Chang, Bo-Rong Chen, Shin-Chuan Huang, Wen-Jung Liao, Chun-Liang Hou
  • Publication number: 20240071758
    Abstract: A method for fabricating a high electron mobility transistor (HEMT) includes the steps of forming a buffer layer on a substrate, forming a barrier layer on the buffer layer, forming a p-type semiconductor layer on the barrier layer, forming a gate electrode layer on the p-type semiconductor layer, and patterning the gate electrode layer to form a gate electrode. Preferably, the gate electrode includes an inclined sidewall.
    Type: Application
    Filed: September 23, 2022
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Tung Yeh, You-Jia Chang, Bo-Yu Chen, Yun-Chun Wang, Ruey-Chyr Lee, Wen-Jung Liao
  • Patent number: 11916131
    Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: De-Fang Chen, Teng-Chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
  • Patent number: 11904078
    Abstract: A portable hemodialysis system is provided including a dialyzer, a closed loop blood flow path which transports blood from a patient through the dialyzer and back to the patient, and a closed loop dialysate flow path which transports dialysate through the dialyzer. Preferably, the hemodialysis system includes a sorbent filter in the dialysate flow path. Furthermore, the hemodialysis machine includes a blood pump, and a pair of dialysate pumps. A processor controls the flow of blood through the blood flow path, and the processor controls the flow of dialysate through the dialysate flow path. In addition, the processor stores a patient treatment plan wherein the flow rate of the dialysate through the dialysate flow path reduces throughout the patient's treatment to maximize the amount of urea removed by the sorbent filter.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: February 20, 2024
    Assignee: DIALITY INC.
    Inventors: Brandon Borillo, Tzu Tung Chen, Clayton Poppe
  • Publication number: 20240055798
    Abstract: This disclosure provides an active audio and video signal transmission device, which comprises a cable, a display-side connector, and a signal source connector. The cable comprises a first end and a second end. The display-side connector comprises a first shell, a first circuit board configured within the first shell, a first plug configured on the first circuit board and protruded from the first shell, a repeater configured on the first circuit board and electrically connected to the first plug and the first end of the cable, and a microprocessor. The microprocessor is configured on the first circuit board, electrically connected to the repeater, and used for controlling an operation of the repeater. The signal source connector is connected to the second end of the cable. In the disclosure, the repeater is only configured within the display-side connector, and is not configured within the signal source connector.
    Type: Application
    Filed: October 31, 2022
    Publication date: February 15, 2024
    Inventors: YI-CHIEH CHENG, YEN-TUNG CHEN, YU-SHUO PAN
  • Publication number: 20240045442
    Abstract: A method for controlling a plurality of mobile robots is to be implemented by a server that communicates with the plurality of mobile robots and a communication device. The server stores a predetermined working route related to a target area. The method includes steps of: receiving a working instruction from the communication device, the working instruction including area information related to the target area and an input quantity of mobile robots; in response to receipt of the working instruction, dividing the predetermined working route into a plurality of sub-routes, wherein a quantity of the sub-routes equals the input quantity of mobile robots; and sending the sub-routes respectively to a plurality of selected robots that are selected from among the plurality of mobile robots to make the selected robots cooperatively implement a task on the target area by moving along the sub-routes, respectively.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 8, 2024
    Applicant: URSrobot AI Inc.
    Inventors: Chien-Tung CHEN, Chung-Hou WU, Chao-Cheng CHEN, Wen-Wei CHIANG, Yi-Jin LIN
  • Publication number: 20240045443
    Abstract: A method for controlling a plurality of autonomous robots for performing environment maintenance operations includes: generating a setup command that indicates a selected location, a plurality of selected robots, an available time slot, and a distribution mode signal that indicates whether the selected robots are to be controlled based on the available time slot or an inputted priority section; and generating a plurality of sub-routes based on different parameters, depending on the distribution mode signal. The sub-routes are generated to be connected into an unbroken trail. Then, the sub-routes are transmitted to the selected robots, respectively, so as to control each of the selected robots to move along the respective one of the sub-routes.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 8, 2024
    Applicant: URSrobot AI Inc.
    Inventors: Chien-Tung Chen, Chung-Hou Wu, Chao-Cheng Chen, Wen-Wei Chiang, Yi-Jin Lin