Patents by Inventor An-Tung Chen

An-Tung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240045443
    Abstract: A method for controlling a plurality of autonomous robots for performing environment maintenance operations includes: generating a setup command that indicates a selected location, a plurality of selected robots, an available time slot, and a distribution mode signal that indicates whether the selected robots are to be controlled based on the available time slot or an inputted priority section; and generating a plurality of sub-routes based on different parameters, depending on the distribution mode signal. The sub-routes are generated to be connected into an unbroken trail. Then, the sub-routes are transmitted to the selected robots, respectively, so as to control each of the selected robots to move along the respective one of the sub-routes.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 8, 2024
    Applicant: URSrobot AI Inc.
    Inventors: Chien-Tung Chen, Chung-Hou Wu, Chao-Cheng Chen, Wen-Wei Chiang, Yi-Jin Lin
  • Publication number: 20240001508
    Abstract: A conditioning assembly, a method for manufacturing the same, and an assembled conditioner using the same are provided. The conditioning assembly includes a composite substrate and a dressing part. The composite substrate includes a porous reinforced structure and a filling material. The filling material covers the porous reinforced structure and fills into the inside of the porous reinforced structure. The dressing part is combined with the composite substrate.
    Type: Application
    Filed: November 17, 2022
    Publication date: January 4, 2024
    Inventor: YING-TUNG CHEN
  • Patent number: 11860530
    Abstract: A photolithographic mask assembly according to the present disclosure accompanies a photolithographic mask. The photolithographic mask includes a capping layer over a substrate and an absorber layer disposed over the capping layer. The absorber layer includes a first main feature area, a second main feature area, and a venting feature area disposed between the first main feature area and the second main feature area. The venting feature area includes a plurality of venting features.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: January 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Ta Lu, Chih-Chiang Tu, Cheng-Ming Lin, Ching-Yueh Chen, Wei-Chung Hu, Ting-Chang Hsu, Yu-Tung Chen
  • Publication number: 20230394581
    Abstract: An analysis method of a financial securities product value model based on artificial intelligence includes performing a determining step, a data acquiring step, an analyzing step and a strategy generating step. The determining step is performed to determine that the customer is one of a long-term investing customer and a short-term investing customer. The data acquiring step is performed to acquire one of a plurality of long-term trading parameters and a short-term trading data. The analyzing step includes dividing the financial securities products into a plurality of groups, and calculate a plurality of classify conditions and analyzing a product relevance and a purchasing sequence of the financial securities products. The strategy generating step is performed to generate a purchasing strategy according to the groups, the classify conditions, the importance value of each of the long-term trading parameters, the product relevance and the purchasing sequence.
    Type: Application
    Filed: November 23, 2022
    Publication date: December 7, 2023
    Inventors: Chi-Tung CHEN, Wei-Jie HAN
  • Publication number: 20230386954
    Abstract: A wafer level chip scale package includes a bare silicon die having an active surface, a rear surface opposite to the active surface, and a sidewall surface between the active surface and the rear surface. The bare silicon die includes a backside corner between the rear surface and the sidewall surface. A plurality of pads is disposed on the active surface. A plurality of conductive elements is disposed on the plurality of pads, respectively. A backside tape is adhered to the rear surface by using an adhesive layer. The adhesive layer and the backside tape protrude beyond the sidewall surfaces of the bare silicon die. The adhesive layer extends along the sidewall surface and wraps around the backside corner.
    Type: Application
    Filed: April 10, 2023
    Publication date: November 30, 2023
    Applicant: MEDIATEK INC.
    Inventors: Yu-Tung Chen, Pei-Haw Tsao, Kuo-Lung Fan
  • Publication number: 20230367197
    Abstract: A photolithographic mask assembly according to the present disclosure accompanies a photolithographic mask. The photolithographic mask includes a capping layer over a substrate and an absorber layer disposed over the capping layer. The absorber layer includes a first main feature area, a second main feature area, and a venting feature area disposed between the first main feature area and the second main feature area. The venting feature area includes a plurality of venting features.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Inventors: Chi-Ta Lu, Chih-Chiang Tu, Cheng-Ming Lin, Ching-Yueh Chen, Wei-Chung Hu, Ting-Chang Hsu, Yu-Tung Chen
  • Publication number: 20230359219
    Abstract: A robot system is used to trace and record boundaries of multiple sites, and data of the recorded boundaries are transmitted to a server for storage therein. The server computes moving paths for the sites based on the data of the recorded boundaries. Upon receipt of a setting signal from a mobile device that indicates a selected robot and a target site, the server transmits a maintenance instruction that includes the boundary and the moving path for the target site to the selected robot, so that the selected robot performs maintenances on the target site based on the maintenance instruction.
    Type: Application
    Filed: April 28, 2023
    Publication date: November 9, 2023
    Inventors: Chien-Tung CHEN, Chung-Hou WU, Chao-Cheng CHEN, Wen-Wei CHIANG, Yi-Jin LIN
  • Patent number: 11796151
    Abstract: An optical film and a light emitting module using the same are disclosed. The light emitting module includes a light emitting assembly and an optical film. The light emitting assembly includes a substrate and a plurality of light emitting units disposed on the substrate. The optical film is disposed above the light emitting units, and includes a base layer and a first optical structure. The first optical structure is disposed on the base layer and includes a first high refractive index layer and a first low refractive index layer. The first high refractive index layer is located between the light emitting assembly and the first low refractive index layer. The first inclined surfaces are formed on an interface between the first high refractive index layer and the first low refractive index layer. Each first inclined surface is inclined relative to a thickness direction of the base layer.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: October 24, 2023
    Assignee: YTDIAMOND CO., LTD.
    Inventor: Ying-Tung Chen
  • Publication number: 20230335208
    Abstract: A test circuit coupled to a memory device and configured to read data stored in the memory device during a memory dump, includes a dump controller and a pattern generator. The dump controller triggers the pattern generator to start a pattern generating operation in response to a setting of memory dump mode by a processor. The pattern generator generates multiple control signals in the pattern generating operation and provides the control signals to the memory device. The control signals include an address signal, a memory enable signal and a read enable signal. The address signal includes multiple memory addresses arranged in multiple consecutive clock cycles of the processor. The consecutive clock cycles of the processor is provided to read the data stored in the memory addresses.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 19, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Li-Wei Deng, Ying-Yen Chen, Chih-Tung Chen
  • Patent number: 11776853
    Abstract: A semiconductor device and method of manufacture are provided in which a passivation layer is patterned. In embodiments, by-products from the patterning process are removed using the same etching chamber and at the same time as the removal of a photoresist utilized in the patterning process. Such processes may be used during the manufacturing of FinFET devices.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: October 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Hao Chen, Che-Cheng Chang, Horng-Huei Tseng, Wen-Tung Chen, Yu-Cheng Liu
  • Publication number: 20230305198
    Abstract: A multilayer optical film structure and a method of manufacturing the same are provided. The multilayer optical film structure includes a base layer, a first optical structure and a second optical structure. The base layer has a first surface and a second surface. The first optical structure is disposed on the first surface of the base layer. The second optical structure is disposed on the second surface of the base layer, and includes a first structural layer, a second structural layer and a third structural layer. The first structural layer is located between the base layer and the second structural layer, and the second structural layer is located between the first structural layer and the third structural layer. The difference between the refractive index of the first structural layer and the refractive index of the second structural layer is greater than or equal to 0.1.
    Type: Application
    Filed: February 24, 2023
    Publication date: September 28, 2023
    Inventor: YING-TUNG CHEN
  • Publication number: 20230304645
    Abstract: An optical film and a light emitting module using the same are disclosed. The light emitting module includes a light emitting assembly and an optical film. The light emitting assembly includes a substrate and a plurality of light emitting units disposed on the substrate. The optical film is disposed above the light emitting units, and includes a base layer and a first optical structure. The first optical structure is disposed on the base layer and includes a first high refractive index layer and a first low refractive index layer. The first high refractive index layer is located between the light emitting assembly and the first low refractive index layer. The first inclined surfaces are formed on an interface between the first high refractive index layer and the first low refractive index layer. Each first inclined surface is inclined relative to a thickness direction of the base layer.
    Type: Application
    Filed: February 27, 2023
    Publication date: September 28, 2023
    Inventor: YING-TUNG CHEN
  • Publication number: 20230280752
    Abstract: A method for preventing a robot from colliding with another robot that is provided with an identifying image includes steps of: controlling the robot to move along a predetermined path; stopping the robot when it is determined that a first image captured by the robot while the robot is moving contains the identifying image; and controlling the robot to resume moving along the predetermined path when it is determined that a second image captured by the robot while the robot is not moving does not contain the identifying image.
    Type: Application
    Filed: February 28, 2023
    Publication date: September 7, 2023
    Inventors: Chien-Tung CHEN, Chung-Hou WU, Chao-Cheng CHEN, Yi-Jin LIN, Dien-Lin TSAI
  • Patent number: 11736510
    Abstract: A domain security assurance system includes a computing platform having processing hardware and a memory storing software code. The processing hardware is configured to execute the software code to obtain domain inventory data identifying multiple domains, to predict, using the domain inventory data, which of the domains are owned by the same entity to identify commonly owned domains, and to determine, using the domain inventory data and the commonly owned domains, which of the commonly owned domains are controlled by the same administrator to identify one or more group(s) of commonly administered domains. When executed, the software code also removes, using the domain inventory data, duplicate domains included in the group(s) to identify non-duplicate domains, evaluates a susceptibility of each of the non-duplicate domains to a cyber-attack to identify one or more target domain(s) vulnerable to the cyber-attack, and identifies the target domain(s) for a security assessment.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: August 22, 2023
    Assignee: Disney Enterprises, Inc.
    Inventors: Wen Tung Chen, Preetjot Singh, Christine Tang
  • Publication number: 20230210049
    Abstract: A controlling method of a robot lawn mower includes a mowing procedure, an interruption determining procedure and an interrupting procedure. The interruption determining procedure includes steps of receiving sensing data indicating a current sensing result related to at least one of surrounding environment or an operation status of the robot lawn mower, and determining whether an interruption condition related to at least one of an environment factor or an operation factor of the robot lawn mower is met. When it is determined that the interruption condition is met, the interrupting procedure is executed, and the robot lawn mower moves to a preset standby location.
    Type: Application
    Filed: December 21, 2022
    Publication date: July 6, 2023
    Applicant: URSrobot Inc.
    Inventors: Chien-Tung Chen, Chung-Hou Wu, Chao-Cheng Chen
  • Patent number: 11646247
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a first through substrate via (TSV) within a substrate. The first TSV comprises a first doped region extending from a top surface of the substrate to a bottom surface of the substrate. A conductive via overlies the top surface of the substrate and is electrically coupled to the first TSV.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: May 9, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Yang Shen, Chien-Hsien Tseng, Dun-Nian Yaung, Nai-Wen Cheng, Pao-Tung Chen
  • Publication number: 20230106039
    Abstract: A semiconductor device includes a first semiconductor chip including a first substrate, a plurality of first dielectric layers and a plurality of conductive lines formed in the first dielectric layers over the first substrate. The semiconductor device further includes a second semiconductor chip having a surface bonded to a first surface of the first semiconductor chip, the second semiconductor chip including a second substrate, a plurality of second dielectric layers and a plurality of second conductive lines formed in the second dielectric layers over the second substrate. The semiconductor device further includes a first conductive feature extending from the first semiconductor chip to one of the plurality of second conductive lines, and a first seal ring structure extending from the first semiconductor chip to the second semiconductor chip.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 6, 2023
    Inventors: Cheng-Ying Ho, Pao-Tung Chen, Wen-De Wang, Jen-Cheng Liu, Dun-Nian Yaung
  • Publication number: 20230098788
    Abstract: A metal mesh structure includes at least one first wire extending along a first direction and at least one second wire extending along a second direction different from the first direction. The at least one first wire includes a first portion, a second portion and a first bending portion connected between the first portion and the second portion. The first bending portion crosses the at least one second wire to form a node. An extending line of the first portion along the first direction passes through the node and is overlapped with the second portion. A first included angle is included between the first direction and the second direction, and a second included angle is included between the first bending portion and the at least one second wire, wherein the first included angle is different from the second included angle, and the second included angle is 90 degrees.
    Type: Application
    Filed: March 21, 2022
    Publication date: March 30, 2023
    Applicant: HENGHAO TECHNOLOGY CO., LTD.
    Inventors: Yu-Tung Chen, Shan-Chen Huang, Yu-Yuan Yeh
  • Patent number: D987635
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: May 30, 2023
    Assignee: Dell Products L.P.
    Inventors: Tung Chen Wu, Antonio T. Latto, Chih-Tung Kao
  • Patent number: D1007520
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: December 12, 2023
    Assignee: CHINA MEDICAL UNIVERSITY
    Inventors: Der-Yang Cho, Chih-Yu Chi, Chia-Huei Chou, Yow-Wen Hsieh, Pei-Ran Sun, Lu-Ching Ho, Ming-Tung Chen