Abstract: The present invention belongs to the technical field of a resin having low dielectric properties, and presents a vinylbenzyl-etherified-DOPO compound resin composition and a preparation method and application thereof. The composition includes a vinylbenzyl-etherified-DOPO compound resin and a vinyl-terminated polyphenylene ether resin. The DOPO resin is vinylbenzyl etherified in the present invention, thus obtaining a vinylbenzyl-etherified-DOPO compound resin having low dielectric properties, and there are no hydroxyl group on itself, no hydroxyl function group will be generated during the cross-linking reaction; and the vinylbenzyl-etherified-DOPO compound resin contains phosphorus atoms, and has flame retardancy.

Abstract: The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board.

Abstract: A circuit for accessing a memory is provided. The memory includes a scatter table storage region and a plurality of storage regions. The scatter table storage region stores a plurality of entries that record starting addresses and sizes of the data storage regions, respectively. The circuit includes an accessing circuit and a cache. The cache stores an entry read from the scatter table storage region. When the accessing circuit needs to access data from the data storage regions, the accessing circuit issues a read request to the cache to read the entry from the cache, determines whether the data is stored in the storage region recorded by the entry according to contents of the entry, and further accordingly determines whether to access the memory to obtain the data according to the contents of the entry.

Abstract: The present disclosure provides a barrel and a lens holder, wherein the barrel having a circular barrel wall and at least a protruding block, with the protruding block protruding beyond the circular barrel wall; the lens holder having a circular hollow wall and at least a spiral guiding track, inside of the circular hollow wall forming a housing space, the housing space having an entrance for placing the barrel; the spiral guiding track being formed axially on a ring-shaped diameter-oriented end surface at the entrance; the barrel being disposed inside the housing space axially and the protruding block maintaining contact with the spiral guiding track; when the barrel rotating, the protruding block sliding along the spiral guiding track so as to adjust the axial position of the barrel with respect to the lens holder.

Abstract: The present invention provides an interactive advertisement imaging matching system, which includes a mobile terminal, for transmitting or receiving a call invitation signal; and includes an advertisement server, which is for transmitting any advertisement towards the mobile terminal, in the duration of the call invitation signal. Moreover, the present invention also provides an interactive advertisement imaging matching system and operation method thereof.

Abstract: A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I): The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.

Abstract: A method of forming dummy structures and an overlay mark protection zone over an active layer zone based on the shape of an overlay mark and the resulting device are provided. Embodiments include determining a size and a shape of an overlay mark; determining a size and a shape of an overlay mark protection zone based on the shape of the overlay mark; determining a shape of a plurality of dummy structures based on the shape of the overlay mark; determining a size and a shape of an active layer zone based on the size and the shape of the overlay mark and the plurality of dummy structures; forming the active layer zone in an active layer of a semiconductor substrate; forming the overlay mark and the plurality of dummy structures over the active layer zone in a poly layer of the semiconductor substrate; and planarizing the poly layer.

Abstract: A low dissipation factor resin composition comprises the following components: (A) an aromatic tetrafunctional vinylbenzyl monomer, its prepolymer or a combination thereof, the aromatic tetrafunctional vinylbenzyl monomer having a structure shown below; (B) flame retardant; and (C) peroxide.

Abstract: An image access method applicable to an image access device is provided. The method includes: providing a plurality of codes that respectively represent a plurality of image sources; determining a plurality of sets of access settings according to a pixel format arrangement, each set of access setting corresponding to a code arrangement combination composed of the codes; and sequentially accessing data of the image sources by the image access apparatus according to the code arrangement combinations corresponding to the access settings.

Abstract: A method for producing a thin film transistor includes forming a transistor prototype on a substrate. The transistor prototype includes two transparent electrodes adapted to form a source and a drain of a thin film transistor. Next, the two transparent electrodes of the transistor prototype are exposed in an environment full of a plasma. The plasma conducts a surface treatment on the two transparent electrodes of the transistor prototype to form the thin film transistor. The method can solve the problem of excessive contact resistance of the transparent conductive films of conventional thin film transistors.

Abstract: A method for producing a thin film transistor includes forming a transistor prototype on a substrate, with the transistor prototype including a face having a to-be-treated portion. The to-be-treated portion of the transistor prototype is exposed in an environment full of a supercritical fluid. The supercritical fluid conducts a surface treatment on the to-be-treated portion of the transistor prototype to form a thin film transistor. The method can solve the problem of too many defects of the thin film transistor resulting from a low-temperature process.

Abstract: An electronic calculating apparatus, a method and a non-transitory machine-readable medium are provided. The electronic calculating apparatus includes an input/output (I/O) interface, a knowledge tree database and a processor. The I/O interface receives first data of a user, wherein the first data is comprised of a natural language character string. The knowledge tree database stores a context knowledge tree. The processor receives the first data of the user via the I/O interface, analyzes the first data and generates context characteristic information, and substitutes the context characteristic information into the context knowledge tree to generate first context recommend information. The processor then enables a display apparatus to display the first context recommend information.

Abstract: A low dissipation factor resin composition comprises: (A) 100 to 150 parts by weight of a vinyl-containing compound or a polymer thereof; (B) 0 to 75 parts by weight of styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl functional polybutadiene urethane oligomer or a combination thereof; (C) 30 to 150 parts by weight of flame retardant; and (D) 0.1 to 10 parts by weight of peroxide. The resin composition and a product made thereby are applicable to a copper-clad laminate and a printed circuit board, characterized by having low dissipation factor at high frequency and satisfactory thermal resistance and thermal expansion.

Abstract: A package substrate is provided, which includes: a body having opposite first and second surfaces, each having adjacent first and second regions defined thereon; first and second circuit layers formed on the first and second surfaces of the body, respectively; a first insulating layer formed on the first surface of the body and having a plurality of first openings formed in the first insulating layer and positioned in the first and second regions; and a second insulating layer formed on the second surface of the body and having a plurality of second openings formed in the second insulating layer and positioned in the second region. Further, at least a third opening is formed in the second insulating layer and positioned in the first region to reduce the volume of the second insulating layer, thereby facilitating even distribution of thermal stresses through the first and second insulating layers during thermal cycling and hence preventing warpage of the package substrate.

Abstract: Embodiments of the invention are generally directed to conversion of multimedia data streams for use by connected devices. An embodiment of a method for processing data includes receiving a data stream in a first multimedia data format at a first device, and inserting a replacement video portion into the received data stream to generate a modified multimedia data stream in a second multimedia data format. The modified data stream is provided to a second device coupled to the first device.

Abstract: Disclosed is a graphene polymer composite material, including a matrix resin, a filler and a plurality of nano-scaled graphene sheets. Each nano-scaled graphene sheet has a surface-modified layer formed of a surface modifying agent, which provides hydrophilic and hydrophobic functional groups used to form chemical bonds with the matrix resin and the filler, thereby greatly improving strength of junction cohesion. The filler helps the graphene sheets to contact each other so as so to increase overall electrical conductivity and thermal conductivity. Since the graphene sheets are uniformly dispersed in the matrix resin, the composite material of the present invention possesses excellent mechanical property, anti-oxidation, acid-base resistance, high electrical conductivity and thermal conductivity. Therefore, the composite material is suitable for the industries in need of high performance material.

Abstract: A method of forming dummy structures and an overlay mark protection zone over an active layer zone based on the shape of an overlay mark and the resulting device are provided. Embodiments include determining a size and a shape of an overlay mark; determining a size and a shape of an overlay mark protection zone based on the shape of the overlay mark; determining a shape of a plurality of dummy structures based on the shape of the overlay mark; determining a size and a shape of an active layer zone based on the size and the shape of the overlay mark and the plurality of dummy structures; forming the active layer zone in an active layer of a semiconductor substrate; forming the overlay mark and the plurality of dummy structures over the active layer zone in a poly layer of the semiconductor substrate; and planarizing the poly layer.

Abstract: A thin film transistor is disclosed in the present invention, including a substrate, a gate, an insulating layer, a source, a drain and an active layer. The gate is arranged on the substrate. The insulating layer is arranged on the gate. The source and the drain are arranged on the insulating layer. The active layer is arranged between the source and the drain, and is formed by a bottom layer, an intermediate layer and a top layer stacked together on the insulating layer. The conductivity of the intermediate layer is higher than that of the bottom layer, and the conductivity of the bottom layer is higher than that of the top layer. As such, the disadvantage of low carrier mobility as commonly seen in the conventional thin film transistor is overcome.

Abstract: An electronic device with a support includes a main body and a support arm. The support arm includes a fixed component and a support component. The support component comprises a pivot end and a leaning end. The support component pivots relative to the fixed component, such that the support arm has a first usage state and a second usage state. When in the first usage state, an acute angle is formed between the support component and the fixed component, and the leaning end of the support component and a bottom edge of the main body both support the main body. When in the second usage state, an obtuse angle is formed between the support component and the fixed component, and the leaning end of the support component is assembled with a seat which is for supporting the main body.

Abstract: This invention provides a light-emitting chip device with high thermal conductivity, which includes an epitaxial chip, an electrode disposed on a top surface of the epitaxial chip and a U-shaped electrode base cooperating with the electrode to provide electric energy to the epitaxial chip for generating light by electric-optical effect. The epitaxial chip includes a substrate and an epitaxial-layer structure with a roughening top surface and a roughening bottom surface for improving light extracted out of the epitaxial chip. A thermal conductive transparent reflective layer is formed between the substrate and the epitaxial-layer structure. The electrode base surrounds the substrate, the transparent reflective layer and a first cladding layer of the epitaxial-layer structure to facilitate the dissipation of the internal waste heat generated when the epitaxial chip emitting light. A method for manufacturing the chip device of the present invention is provided.