Abstract: The disclosure provides a fixation structure, for accommodating and fixing a storage module, including an accommodating housing. The accommodating housing includes a fixed housing and a movable housing. The fixed housing includes a bottom frame and a side frame. The side frame stands on three adjacent sides of the bottom frame to form an opening therebetween. The movable housing is detachably installed on the bottom frame to close the opening and forms an accommodation room with the fixed housing. The storage module is located in the accommodation room. The fixed housing and the movable housing are made of metal.

Abstract: A method of forming dummy structures and an overlay mark protection zone over an active layer zone based on the shape of an overlay mark and the resulting device are provided. Embodiments include determining a size and a shape of an overlay mark; determining a size and a shape of an overlay mark protection zone based on the shape of the overlay mark; determining a shape of a plurality of dummy structures based on the shape of the overlay mark; determining a size and a shape of an active layer zone based on the size and the shape of the overlay mark and the plurality of dummy structures; forming the active layer zone in an active layer of a semiconductor substrate; forming the overlay mark and the plurality of dummy structures over the active layer zone in a poly layer of the semiconductor substrate; and planarizing the poly layer.

Abstract: A light-emitting device includes a single-piece heat dissipation element, a circuit board and an electroinsulating casing. The single-piece heat dissipation element includes a carrier portion and a fin portion. The circuit board is configured on the carrier portion. The electroinsulating casing encapsulates the carrier portion and the fin portion.

Abstract: The present invention belongs to the technical field of resin composite materials, in particular relates to a low dielectric composite material and a laminate and printed circuit board prepared therefrom. The composite material is obtained by adhering a low dielectric resin composition with phosphorus-containing flame retardant onto a substrate; the composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).

Abstract: The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).

Abstract: Disclosed is a graphene printed circuit pattern structure including a substrate excellent in electrical insulation and a graphene printed circuit layer provided on the substrate. The graphene printed circuit layer is electrically conductive and has a circuit pattern like an electrical circuit on the circuit board. The graphene printed circuit layer includes surface-modified nanographene platelets, a carrier resin and a filler. The ratio of the particle size of the filler to the thickness of the surface-modified nanographene platelet is 2-1000, and the surface-modified nanographene platelets are dispersed in the carrier resin. The filler is uniformly placed among the surface-modified nanographene platelets so as to enhance effective contact for the surface-modified nanographene platelets. The graphene printed circuit pattern structure provides excellent electrical properties and heat dissipation to achieve protection by preventing electrical elements from overheat.

Abstract: A system includes: a first converter for receiving a pre-stage input DC voltage from a power source, and providing a pre-stage output DC voltage including a first DC voltage or a second DC voltage; a modulator the modulator controlling the first converter; a second converter, coupled to the first converter; and a controller, the controller controlling an operation mode of the second converter and notifying the modulator about the operation mode of the second converter. The modulator and the controller receive an external voltage indication signal indicating whether the pre-stage output DC voltage is the first DC voltage or the second DC voltage. The modulator controls the first converter to output the pre-stage output DC voltage based on the voltage indication signal. The modulator notifies the controller about whether the pre-stage output DC voltage reaches a target level.

Abstract: A high-efficiency buffer stocker is disclosed. The buffer stocker includes an overhead transport track for supporting overhead transport vehicles carrying wafer containers and at least one conveyor system or conveyor belt provided beneath the overhead transport track for receiving the wafer containers from the overhead transport vehicles on the overhead transport track. The buffer stocker is capable of absorbing the excessive flow of wafer containers between a processing tool and a stocker, for example, to facilitate the orderly and efficient flow of wafers between sequential process tools in a semiconductor fabrication facility, for example.

Abstract: An auto-locking torque distributing mechanism comprises a main plate receiving two gear sets. On two sides of the main plate, slots and apertures are respectively formed near two side peripheries thereof and partially communicated with each other. A sleeve assembly includes a covering unit with an opening enclosed by a first wall whereby each aperture is communicated with the opening and arranged near the first wall while connecting the main plate to the sleeve assembly. When one wheel slips and spins much faster than the other wheel, the sleeve assembly keeps fluid to avoid leaking. By the aforementioned partial communication, the fluid is easily sucked into the aperture to enter the slot and go among the gear sets, thereby limiting the amount of torque sent to the slipping wheel and distributing as much as torque to the non-slipping wheel to keep the traction of the vehicle.

Abstract: Disclosed is a graphene polymer composite material, including a matrix resin, a filler and a plurality of nano-scaled graphene sheets. Each nano-scaled graphene sheet has a surface-modified layer formed of a surface modifying agent, which provides hydrophilic and hydrophobic functional groups used to form chemical bonds with the matrix resin and the filler, thereby greatly improving strength of junction cohesion. The filler helps the graphene sheets to contact each other so as so to increase overall electrical conductivity and thermal conductivity. Since the graphene sheets are uniformly dispersed in the matrix resin, the composite material of the present invention possesses excellent mechanical property, anti-oxidation, acid-base resistance, high electrical conductivity and thermal conductivity. Therefore, the composite material is suitable for the industries in need of high performance material.

Abstract: A trial frame includes a trial frame body and at least one measurement subject having a visual invariant geometric characteristic. The trial frame body has at least one key parameter. The measurement subject is disposed on the trial frame body and collaborates with a measurement method. A two-dimensional image of the measurement subject is recorded by an image capturing device when the trial frame body fits to a user, and the key parameter is deduced from the two-dimensional image of the measurement subject.

Abstract: A resin composition, including (A) a polyimide resin; (B) a pre-polymerised maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4?-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerised maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

Abstract: An electrochemical separation membrane and the manufacturing method thereof are disclosed. The method includes: a polymer solution preparing step to mix a polymer material, solvent and ceramic precursors thoroughly to form a polymer solution, wherein the polymer material and the ceramic precursors are dissolved uniformly in the solvent; a coating step to coat the polymer solution on a porous base material; a hydrolysis step to cause the porous base material coated with the polymer solution to contact an aqueous solution to hydrolyze the ceramic precursor into ceramic particles; and a drying step to remove the water and the solvent from the porous base material and in order to form the electrochemical separation membrane. The electrochemical separation membrane made of this method have better ion conductivity, interface stability and thermal stability based on the ceramic particles.

Abstract: Disclosed is a graphene dissipation structure including a substrate and a graphene dissipation layer. The substrate has at least two surfaces. One of the surfaces contacts at least one heat source, and another one is not in contact with the heat source and provided with the graphene dissipation layer, which includes surface-modified graphene nanometer sheets, a carrier resin and a filler. The surface-modified graphene nanometer sheets are well dispersed in the carrier resin, and enhanced to contact each other through the filler to form a thermal conductive network. The ratio of the particle size of the filler and the thickness of the graphene nanometer sheets is about 2 to 100. Therefore, the heat absorbed by the substrate from the heat source is transferred to the graphene dissipation layer, and further dissipated to the outside through thermal conduction or radiation, thereby achieving the function of heat dissipation.

Abstract: An electronic device including a main body, a shell and a locking mechanism is provided. The locking mechanism includes a first locking component and at least one second locking component. The first locking component is slidably disposed at the main body, locks the shell and has at least one retaining portion. The second locking component is slidably disposed at the main body and locks the shell. The retaining portion blocks the second locking component from sliding relatively to the main body. When the first locking component slides relatively to the main body to release the shell, the retaining portion moves away from the second locking component and the second locking component slides relatively to the main body to release the shell.

Abstract: Disclosed is a graphene masterbatch including a base resin, electrically conductive carbon black, graphene nanoplatelets with modified surface and a dispersant. The modified surface of graphene nanoplatelet is formed by a modifying agent containing a coupling compound so as to possess hydrophobic and hydrophilic functional groups, which help graphene nanoplatelets form chemical bonding with carbon black and the base resin. Since the modified surface makes graphene nanoplatelets evenly dispersed in the base resin, the graphene masterbatch of the present invention is suitably melt blended with a polymer material to form a composite material such that graphene nanoplatelets are evenly dispersed in the polymer material, thereby enhancing junction strength, increasing mechanical properties, and improving anti-oxidation, acid/base resistance, and thermal conductivity.

Abstract: A method of forming dummy structures and an overlay mark protection zone over an active layer zone based on the shape of an overlay mark and the resulting device are provided. Embodiments include determining a size and a shape of an overlay mark; determining a size and a shape of an overlay mark protection zone based on the shape of the overlay mark; determining a shape of a plurality of dummy structures based on the shape of the overlay mark; determining a size and a shape of an active layer zone based on the size and the shape of the overlay mark and the plurality of dummy structures; forming the active layer zone in an active layer of a semiconductor substrate; forming the overlay mark and the plurality of dummy structures over the active layer zone in a poly layer of the semiconductor substrate; and planarizing the poly layer.

Abstract: A manufacturing method of an electronic device includes: providing a substrate; forming a source and a drain on the substrate; forming a semiconductor layer on the substrate; forming a first light sensitive material layer on the semiconductor layer; removing a first portion of the first light sensitive material layer by a first exposure and development process and maintaining a second portion of the first light sensitive material layer to serve as a first gate insulation layer; patterning the semiconductor layer to form a channel layer below the first gate insulation layer; forming a second light sensitive material layer on the substrate; removing a third portion of the second light sensitive material layer by a second exposure and development process to expose at least a part of the first gate insulation layer; and forming a first gate on the first gate insulation layer. An electronic device is also provided.

Abstract: A resin composition contains: (A) 100 parts by weight of the cyanate ester resin; (B) 5 to 80 parts by weight of the styrene-maleic anhydride copolymer; (C) 15 to 80 parts by weight of the styrene-butadiene-divinyl benzene (SBDVB) terpolymer; and (D) 5 to 60 parts by weight of the acrylate compound, where the contents of the styrene-maleic anhydride copolymer, the styrene butadiene divinyl benzene terpolymer, and the acrylate compound are based on 100 parts by weight of the cyanate ester resin. By providing such formulation, the resin composition of the present invention exhibits low dielectric constant, low dielectric dissipation, high thermal stability and high flame resistance, and is useful in manufacturing a prepreg or a resin film, and is further useful in manufacturing a laminate and a printed circuit board.

Abstract: A graphene composite coating layer for being coated on the surface of the target object comprises a curable mixed resin more than 97 wt % and a plurality of surface modified nano graphene sheets. The curable mixed resin comprises a curable resin and a curing agent. The curable resin is 10-50 wt % of the curable mixed resin, and the curing agent is 0˜10 wt % of the curable mixed resin. The surface modified graphene sheets with less than 3 wt % of the graphene composite coating layer are evenly spread in the curable mixed resin. The surface of the surface modified nano graphene sheet has some specific functional groups to form effective bonding with the curable mixed resin, thereby improving the compatibility of the surface modified nano graphene sheets and the curable mixed resin, increasing the junction strength, and enhancing the functions like anti-oxidation, acid/base resistance and mechanical strength.