Abstract: A method for producing an adaptive element for dental implantation includes: creating a 3D virtual model including a crown part and a root part; obtaining a boundary curve between the crown part and the root part; defining a boundary plane on the root part perpendicular to a vertical axis of the 3D virtual model and spaced apart from the boundary curve; projecting the boundary curve on the boundary plane in a direction parallel to the vertical axis; generating a tubular model having a predetermined thickness based on the boundary curve, a virtual surface connected from the boundary curve to the cutting plane, and the cutting plane; and producing the adaptive element according to the tubular model.

Abstract: An example method of threshold voltage offset calibration at memory device power up comprises: identifying a set of memory pages that have been programmed within a time window; determining, for each voltage offset bin of a plurality of voltage offset bins, a corresponding value of a data state metric produced by a memory access operation with respect to a memory page of the set of memory pages, wherein the memory access operation utilizes a voltage offset associated with the voltage offset bin; identifying a subset of the plurality of voltage offset bins, such that memory access operations performed using the corresponding voltage offsets produced respective values of the data state metric that satisfy a predefined quality criterion; selecting, among the subset of the plurality of voltage offset bins, a voltage offset bin that is associated with the lowest voltage offset; and associating the set of memory pages with the selected voltage offset bin.

Abstract: A scanning method for multiple barcodes is applied in an electronic device. The electronic device loads a tag template, and the tag template has a plurality of detection zones each corresponding to a target barcode and a target barcode type. The electronic device captures a tag image with a plurality of barcode patterns to be detected, and each barcode pattern to be detected has coordinate information on an image coordinate system. The electronic device overlays the tag image with the tag template to determine whether each barcode pattern to be detected is located in one of the detection zones. When the barcode pattern to be detected is located in one of the detection zones and matches the corresponding target barcode type, the electronic device reads the barcode pattern to be detected to obtain a read result.

Abstract: A method for sharing a console variable setting of an application and the electronic device and system is provided. The sharing method includes: capturing a display frame of a first electronic device to obtain a set coding image by a second electronic device; transforming the set coding image into a meta file by the second electronic device, wherein the meta file comprises a set of setting parameters for a plurality of first setting options of a first application of the first electronic device; and setting a plurality of second setting options of a second application of the second electronic device as the set of setting parameters for the plurality of first setting options according to the meta file, wherein the second application is the same as the first application.

Abstract: Methods and devices for video decoding are provided. The method includes: receiving a control variable associated with the video block at a coding level, where the control variable enables adaptive switch between a plurality of motion vector refinement (MVR) offset sets, and the video block comprises first and second geometric partitions; receiving one or more syntax elements to determine a first MVR offset for the first geometric partition and a second MVR offset for the second geometric partition from a selected MVR offset set; obtaining a first motion vector (MV) and a second MV from a candidate list for the first and second geometric partitions; calculating a first refined MV and a second refined MV based on the first and second MVs and the first and second MVR offsets; and obtaining prediction samples for the video block based on the first and second refined MVs.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: Disclosed herein is a probiotic composition that includes Lactobacillus salivarius subsp. salicinius AP-32, Lactobacillus johnsonii MH-68, and Bifidobacterium animalis subsp. lactis CP-9, which are deposited at the China Center for Type Culture Collection (CCTCC) respectively under accession numbers CCTCC M 2011127, CCTCC M 2011128, and CCTCC M 2014588. A number ratio of Lactobacillus salivarius subsp. salicinius AP-32, Lactobacillus johnsonii MH-68, and Bifidobacterium animalis subsp. lactis CP-9 ranges from 1:0.1:0.1 to 1:1:8. Also disclosed herein is use of the probiotic composition for alleviating type 1 diabetes mellitus (T1DM).

Abstract: A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum system is disposed under and in gas communication with the supporting platform. The gas permeable buffer layer is disposed over the supporting platform and covers the supporting surface, wherein a hardness scale of the gas permeable buffer layer is smaller than a hardness scale of the supporting platform.

Abstract: A method of implementing autonomous emergency braking (AEB) for advanced driver-assistance systems (ADAS), the method includes receiving one or more first inputs and identifying one or more targets external to a host vehicle based on the one or more first inputs. The method further includes receiving one or more second inputs related to a turning status of the host vehicle and detecting a U-turn state associated with the host vehicle based on the one or more second inputs. The AEB algorithm may be modified in response to the detected U-turn state, wherein the AEB algorithm initiates an AEB event as necessary to avoid collisions with the one or more identified targets.

Abstract: A fluorescence lifetime imaging microscopy system comprises a microscope comprising an excitation source configured to direct an excitation energy to an imaging target, and a detector configured to measure emissions of energy from the imaging target, and a non-transitory computer-readable medium with instructions stored thereon, which perform steps comprising collecting a quantity of measured emissions of energy from the imaging target as measured data, providing a trained neural network configured to calculate fluorescent decay parameters from the quantity of measured emissions of energy, providing the data to the trained neural network, and calculating at least one fluorescence lifetime parameter with the neural network from the measured data, wherein the measured data comprises an input fluorescence decay histogram, and wherein the neural network was trained by a generative adversarial network. A method of training a neural network and a method of acquiring an image are also described.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: This disclosure is directed to a rugged plug having a connector, an elastic inner sheath and a slidable rigid sheath. The connector has a coupling end. The elastic inner sheath sleeves the connector. The elastic inner sheath has an elastic arm, and a hook is protruded from one lateral side of the elastic arm. The hook protrudes from the side of the elastic inner sheath and a tip of the hook is a curved surface, an actuating slope is defined on the elastic arm, and a direction normal to the actuating slope is biased toward the coupling end of the connector. The slidable rigid sheath movably sleeves the elastic inner sheath, the slidable rigid sheath cover the actuating slope and the hook is located outside the slidable rigid sheath, the slidable rigid sheath has an actuating structure and the actuating structure abuts against the actuating slope.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: A semiconductor structure includes a first shallow trench isolation (STI) structure within a semiconductor substrate. The first STI structure includes a buffer structure, an adhesion structure, an electromagnetic reflection structure, and a fill structure. The adhesion structure is between and adhesively bonded to the buffer structure and the electromagnetic reflection structure. The electromagnetic reflection structure is between the adhesion structure and the fill structure to reflect electromagnetic radiation.

Abstract: A method for sharing a console variable setting of an application is applied to a plurality of electronic devices. The sharing method includes: generating, by a first electronic device, a meta file, where the meta file has setting parameters for a plurality of first setting options of a first application of the first electronic device; transforming, by the first electronic device, the meta file into a set coding image; and displaying, by the first electronic device, a display frame with the set coding image. Therefore, a second electronic device can automatically adjust setting parameters for a plurality of second setting options of a second application into setting parameters the same as those of the first application by capturing the set coding image in the display frame.

Abstract: An electronic device including a pixel array structure, a redistribution structure, and a plurality of conductive via structures is provided. The pixel array structure includes a plurality of signal lines. The redistribution structure overlaps the pixel array structure and includes a plurality of conductive lines. The conductive via structures electrically connect the signal lines of the pixel array structure and the conductive lines of the redistribution structure. At least one of the conductive via structures shares at least one conductive layer with the pixel array structure.

Abstract: In an integrated circuit (IC) fabrication process, devices or sub-circuits are fabricated in respective first and second electrical isolation regions. A back-to-back (B2B) diodes sub-circuit is fabricated in a third electrical isolation region, which includes a first diode whose cathode is connected with a first terminal and whose anode is connected with a second terminal, and a second diode whose anode is connected with the first terminal and whose cathode is connected with the second terminal. Electrostatic discharge protection is provided to the first and second electrical isolation regions by electrically connecting the first terminal of the B2B diodes sub-circuit with a VSS power supply terminal of the first device or sub-circuit and the second terminal of the B2B diodes sub-circuit with a VSS power supply terminal of the second device or sub-circuit. Thereafter, the first device or sub-circuit and the second device or sub-circuit are electrically connected.

Abstract: An electronic package is provided, where a circuit layer and a metal layer having a plurality of openings are formed on a dielectric layer of a circuit portion to reduce the area ratio of the metal layer to the dielectric layer, so as to reduce stress concentration and prevent warping of the electronic package.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.