Patents by Inventor An-Yu Kuo

An-Yu Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11771651
    Abstract: Disclosed herein are novel synthetic polypeptides and uses thereof in the preparation of liposomes. According to embodiments of the present disclosure, the synthetic polypeptide comprises a membrane lytic motif, a masking motif, and a linker configured to link the membrane lytic motif and the masking motif. The linker is cleavable by a stimulus, such as, light, protease, or phosphatase. Once being coupled to a liposome, the exposure to the stimulus cleaves the linker that results in the separation of the masking motif from the membrane lytic motif, which in turn exerts membrane lytic activity on the liposome that leads to the collapse of the intact structure of the liposome, and releases the agent encapsulated in the liposome to the target site. Also disclosed herein are methods of diagnosing or treating a disease in a subject by use of the present liposomes.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: October 3, 2023
    Assignee: Academia Sinica
    Inventors: Hsien-Ming Lee, Hua-De Gao, Jia-Lin Hong, Chih-Yu Kuo, Cheng-Bang Jian
  • Publication number: 20230307404
    Abstract: A package structure includes a die, a first redistribution circuit structure, a first redistribution circuit structure, a second redistribution circuit structure, an enhancement layer, first conductive terminals, and second conductive terminals. The first redistribution circuit structure is disposed on a rear side of the die and electrically coupled to thereto. The second redistribution circuit structure is disposed on an active side of the die and electrically coupled thereto. The enhancement layer is disposed on the first redistribution circuit structure. The first redistribution circuit structure is disposed between the enhancement layer and the die. The first conductive terminals are connected to the first redistribution circuit structure. The first redistribution circuit structure is between the first conductive terminals and the die. The second conductive terminals are connected to the second redistribution circuit structure.
    Type: Application
    Filed: March 28, 2022
    Publication date: September 28, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yu Kuo, Yu-Ching Lo, Wei-Jie Huang, Ching-Pin Yuan, Yi-Che Chiang, Kris Lipu Chuang, Hsin-Yu Pan, Yi-Yang Lei, Ching-Hua Hsieh, Kuei-Wei Huang
  • Patent number: 11764206
    Abstract: In an integrated circuit (IC) fabrication process, devices or sub-circuits are fabricated in respective first and second electrical isolation regions. A back-to-back (B2B) diodes sub-circuit is fabricated in a third electrical isolation region, which includes a first diode whose cathode is connected with a first terminal and whose anode is connected with a second terminal, and a second diode whose anode is connected with the first terminal and whose cathode is connected with the second terminal. Electrostatic discharge protection is provided to the first and second electrical isolation regions by electrically connecting the first terminal of the B2B diodes sub-circuit with a VSS power supply terminal of the first device or sub-circuit and the second terminal of the B2B diodes sub-circuit with a VSS power supply terminal of the second device or sub-circuit. Thereafter, the first device or sub-circuit and the second device or sub-circuit are electrically connected.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, LTD.
    Inventors: Hsi-Yu Kuo, Yu-Lin Chu, Tsung-Yuan Chen, Chih-Wei Hsu
  • Patent number: 11712788
    Abstract: An oil filter removal tool configured for removal of a filter cartridge is provided, including: a main body, including a driving portion configured to be connected with a driven portion of the filter cartridge so that the main body is rotatable with the filter cartridge; a cover portion, connected with the main body, including an opening corresponding to the driving portion, the opening being configured for assembling of the driven portion of the filter cartridge therewithin; wherein the main body has a first flexibility, the cover portion has a second flexibility, and the second flexibility is greater than the first flexibility.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 1, 2023
    Assignee: KTL INTERNATIONAL CO., LTD.
    Inventors: Ying-Chieh Liao, Yu-Kuo Liao
  • Patent number: 11705502
    Abstract: The present disclosure relates to a semiconductor device including a substrate and a pair of spacers on the substrate. Each spacer of the pair of spacers includes an upper portion having a first width and a lower portion under the upper portion and having a second width different from the first width. The semiconductor device further includes a gate structure between the pair of spacers. The gate structure has an upper gate length and a lower gate length that is different from the upper gate length.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: July 18, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yu Kuo, Shang-Yun Huang, Chih-Yin Kuo
  • Publication number: 20230224963
    Abstract: Various techniques pertaining to a special dual clear-to-send (CTS) mode for improvement in collision avoidance in wireless communications are described. A first station (STA) transmits a request-to-send (RTS) and, in response, receives a first CTS from a second STA. The first STA waits to receive a second CTS from the second STA before transmitting data to the second STA responsive to the first CTS being of a first type and the second CTS being of a second type different from the first type. The first STA then transmits the data to the second STA upon passage of a waiting period.
    Type: Application
    Filed: November 14, 2022
    Publication date: July 13, 2023
    Inventors: Tsung-Hsuan Wu, Chao-Wen Chou, Ching-Yu Kuo, Ping Hsien Chiang, Ming-Yen Tsai
  • Patent number: 11694606
    Abstract: A display device with sensing element includes a substrate having a disposing surface, a plurality of display elements, at least one sensing element, and at least one lighting adjustment element. The display elements are disposed above the disposing surface to present an image. The at least one sensing element disposed above the disposing surface to sense a light brightness projected toward either side of the substrate. The at least one light adjustment element is in signal transmittable connection with the display elements and the at least one sensing element. The at least one light adjustment element adjusts a plurality of control signals inputted into the display elements to determine a contrast of the image.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: July 4, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Yu Kuo, Wei-Chung Chen, Yi-Hsiang Huang, Yu-Hsiang Liu
  • Patent number: 11663331
    Abstract: A computer-implemented method, a computer program product, and a computer system for creating malware domain sinkholes by domain clustering. The computer system clusters malware domains into domain clusters. The computer system collects domain metrics in the domain clusters. The computer system sorts clustered malware domains in the respective ones of the domain clusters, based on the domain metrics. The computer system selects, from the clustered malware domains in the respective ones of the domain clusters, a predetermined number of top domains as candidates of respective domain sinkholes, wherein the respective domain sinkholes are created for the respective ones of the domain clusters.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: May 30, 2023
    Assignee: International Business Machines Corporation
    Inventors: Cheng-Ta Lee, Bo-Yu Kuo, Gideon Zenz, Andrii Iesiev, Jacobus P. Lodewijkx
  • Patent number: 11658439
    Abstract: A male plug and a female receptacle and a docking structure thereof include a male plug and a female receptacle docked with each other. When the male plug and the female receptacle docked with each other, the male plug is fitted with the female receptacle using a horizontal holding force provided by a first fastening structure, and is fitted with the female receptacle using a vertical holding force provided by a second fastening structure, hence further reinforcing plugging stability between the male plug and the female receptacle by the horizontal and vertical holding forces.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: May 23, 2023
    Assignee: Getac Technology Corporation
    Inventor: Hsiu-Yu Kuo
  • Publication number: 20230154918
    Abstract: In an integrated circuit (IC) fabrication process, devices or sub-circuits are fabricated in respective first and second electrical isolation regions. A back-to-back (B2B) diodes sub-circuit is fabricated in a third electrical isolation region, which includes a first diode whose cathode is connected with a first terminal and whose anode is connected with a second terminal, and a second diode whose anode is connected with the first terminal and whose cathode is connected with the second terminal. Electrostatic discharge protection is provided to the first and second electrical isolation regions by electrically connecting the first terminal of the B2B diodes sub-circuit with a VSS power supply terminal of the first device or sub-circuit and the second terminal of the B2B diodes sub-circuit with a VSS power supply terminal of the second device or sub-circuit. Thereafter, the first device or sub-circuit and the second device or sub-circuit are electrically connected.
    Type: Application
    Filed: January 24, 2022
    Publication date: May 18, 2023
    Inventors: Hsi-Yu Kuo, Yu-Lin Chu, Tsung-Yuan Chen, Chih-Wei Hsu
  • Publication number: 20230115449
    Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Yu Kuo, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Yi-Yang Lei, Wei-Jie Huang
  • Publication number: 20230092969
    Abstract: An embodiment of the present invention is directed toward machine learning to produce results encompassing a new output. A machine learning model is trained to determine a candidate output from among a plurality of candidate outputs. First embeddings associated with the plurality of candidate outputs are generated from a first set of training data by an intermediate layer of the trained machine learning model. Second embeddings associated with a new candidate output are generated from a second set of training data by the intermediate layer of the trained machine learning model. A third embedding is determined for input data by the intermediate layer of the trained machine learning model. A resulting candidate output for the input data is predicted from a group of the plurality of candidate outputs and the new candidate output based on distances for the third embedding to the first and second embeddings.
    Type: Application
    Filed: September 20, 2021
    Publication date: March 23, 2023
    Inventors: CHAO-MIN CHANG, Bo-Yu Kuo, Yu-Jin Chen, Yu-Chi Tang
  • Publication number: 20230064313
    Abstract: A system and method for management of heterogeneous bare metal servers is disclosed. The system includes target bare metal servers coupled to a network and an administrative server. The administrative server executes a framework for managing the bare metal servers. The framework includes unified APIs for performance of management functions. A recognition engine receives identification information from the server and selects a driver from a driver library based on the identification information. Each of the drivers in the driver library is associated with a different type of bare metal server. A driver loader loads the selected driver to translate the unified APIs to native APIs on the bare metal server to perform the management function on the server.
    Type: Application
    Filed: July 25, 2022
    Publication date: March 2, 2023
    Inventors: Yen-Hsun CHEN, Chiun-Yu KUO, Tong-Pai HUANG, Chia-Jui LEE
  • Publication number: 20230054608
    Abstract: Techniques are described that enable automatic emergency braking (AEB) for a path-crossing target when a collision between a host vehicle and the target that is deemed imminent. Based on whether an acceleration of the host vehicle is above a threshold. Based on the acceleration, and, optionally, a location of the target relative to a crossing path (e.g., whether a portion of the target is within a suppression zone), an AEB system of the host vehicle is either activated or not activated, for example, suppressed. This suppression of the AEB system may include gating or nulling an AEB activation signal to prevent an emergency braking event. By managing the AEB system in a path-crossing scenario, many common false-positive AEB events (warnings, alerts, and/or braking) may be avoided. Furthermore, intentional vehicle maneuvers that comply with normal driving etiquette or rules can still be allowed for operator and passenger comfort, without risking safety.
    Type: Application
    Filed: August 19, 2021
    Publication date: February 23, 2023
    Inventors: Wen-Yu Kuo, Yu Han
  • Publication number: 20230030048
    Abstract: A connector plug, abutting structure of the same, and electrical connection mechanism having the same are provided. The connector plug includes a connection body and an outer casing member. The outer casing member is disposed outside the connection body and includes an inner casing, an outer casing movably fitted to the inner casing from outside, and a resilient component acting between the inner casing and the outer casing. At least one hook hole is disposed at the front end of the outer casing. At least one engaging arm is disposed on the inner casing and extends forward to form a hook portion. At least one engaging hole is disposed on a receptacle. When a plug is plugged into the receptacle, the hook portion becomes engaged with the engaging hole to achieve connection.
    Type: Application
    Filed: July 26, 2022
    Publication date: February 2, 2023
    Inventor: HSIU-YU KUO
  • Publication number: 20230032566
    Abstract: A connector plug, abutting structure of the same, and electrical connection mechanism having the same are provided. The connector plug includes a connection body and an outer casing member. The outer casing member is disposed outside the connection body and includes an inner casing and an outer casing enclosing the inner casing. At least one engaging arm is disposed on the inner casing and has a pressing portion protruding from the outer casing and an engaging portion extending forward from the pressing portion and hanging on the sidewall of an insertion port of the connection body. At least one engaging hole is defined on a receptacle. When a plug is plugged into the receptacle, the engaging portion becomes engaged with the engaging hole to achieve connection.
    Type: Application
    Filed: July 26, 2022
    Publication date: February 2, 2023
    Inventor: HSIU-YU KUO
  • Patent number: D985561
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: May 9, 2023
    Assignee: KINGSTON DIGITAL, INC.
    Inventors: Yu-Kuo Huang, Yi-Ting Lin
  • Patent number: D995532
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: August 15, 2023
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventors: Hsiu-Yu Kuo, Shi-Liang Zhong
  • Patent number: D998969
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: September 19, 2023
    Assignee: KTL INTERNATIONAL CO., LTD.
    Inventors: Ying-Chieh Liao, Yu-Kuo Liao
  • Patent number: D1000405
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: October 3, 2023
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventors: Shi-Liang Zhong, Hsiu-Yu Kuo