Patents by Inventor Andreas Bibl

Andreas Bibl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED with internally confined current injection area
    Patent number: 9450147
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: September 20, 2016
    Assignee: Apple Inc.
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • COMPLIANT MICRO DEVICE TRANSFER HEAD
    Publication number: 20160257131
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • DISPLAY MODULE AND SYSTEM APPLICATIONS
    Publication number: 20160259368
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Compliant electrostatic transfer head with spring support layer
    Patent number: 9425151
    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: August 23, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Stephen P. Bathurst, John A. Higginson, Andreas Bibl, Jeffrey Birkmeyer
  • Compliant bipolar micro device transfer head with silicon electrodes
    Patent number: 9406541
    Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: August 2, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Andreas Bibl
  • ELECTRO-STATIC DISCHARGE AND ELECTRIC OVERSTRESS PROTECTION STRATEGY FOR MICRO-CHIP ARRAY ON PANEL
    Publication number: 20160210895
    Abstract: A display system includes an array of light emitting diodes (LEDs), first and second driver chips, and one or more protection chips on a display substrate. The first and second driver chips are to drive a first group of LEDs of the array of LEDs and a second group of LEDs of the array of LEDs, respectively. Each protection chip includes one or more electro-static discharge (ESD) protection devices to assist with protecting the driver chips from damage caused by an ESD event. In one embodiment, each ESD protection device is connected between one or more signal lines, one or more power supply voltage lines, and an electrical ground line of the display substrate. In one embodiment, at least one protection chip comprises one or more electric overstress (EOS) protection devices to assist with protecting the driver chips from damage caused by an EOS event.
    Type: Application
    Filed: September 24, 2015
    Publication date: July 21, 2016
    Inventors: Xiaofeng FAN, Andreas BIBL, Kapil V. SAKARIYA, Tore NAUTA
  • Micro device transfer system with pivot mount
    Patent number: 9391042
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: July 12, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • MICRO DEVICE TRANSFER HEAD ARRAY
    Publication number: 20160196998
    Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.
    Type: Application
    Filed: February 24, 2016
    Publication date: July 7, 2016
    Inventors: Dariusz Golda, Andreas Bibl
  • MEMS Jetting Structure For Dense Packing
    Publication number: 20160185114
    Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
    Type: Application
    Filed: March 7, 2016
    Publication date: June 30, 2016
    Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
  • Micro device with stabilization post
    Patent number: 9379092
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: June 28, 2016
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Kevin K. C. Chang, Andreas Bibl
  • MASS TRANSFER TOOL MANIPULATOR ASSEMBLY
    Publication number: 20160176045
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl, Paul Argus Parks, Stephen Paul Bathurst
  • Compliant micro device transfer head
    Patent number: 9370864
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: June 21, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • Display module and system applications
    Patent number: 9367094
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: June 14, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • WEARABLE DISPLAY
    Publication number: 20160163765
    Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 ?m or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.
    Type: Application
    Filed: December 8, 2014
    Publication date: June 9, 2016
    Inventors: Hsin-Hua Hu, Andreas Bibl
  • Forming a device having a curved piezoelectric membrane
    Patent number: 9362484
    Abstract: Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: June 7, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Paul A. Hoisington, Jeffrey Birkmeyer, Andreas Bibl, Mats G. Ottosson, Gregory De Brabander, Zhenfang Chen, Mark Nepomnishy, Shinya Sugimoto
  • METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE
    Publication number: 20160148916
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: January 27, 2016
    Publication date: May 26, 2016
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Active matrix emissive micro LED display
    Patent number: 9343448
    Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: May 17, 2016
    Assignee: LuxVue Technology Corporation
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
    Publication number: 20160111405
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Application
    Filed: December 21, 2015
    Publication date: April 21, 2016
    Inventors: Andreas Bibl, Charles R. Griggs
  • Micro pick up array with integrated pivot mount
    Patent number: 9314930
    Abstract: Systems and methods for transferring a micro device from a carrier substrate include, in an embodiment, a micro pick up array structure to allow the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 19, 2016
    Assignee: LuxVue Technology Corporation
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • Flexible display and method of formation with sacrificial release layer
    Patent number: 9318475
    Abstract: A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: April 19, 2016
    Assignee: LuxVue Technology Corporation
    Inventors: Andreas Bibl, Dariusz Golda