Patents by Inventor Andreas Bibl

Andreas Bibl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170206845
    Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
    Type: Application
    Filed: April 5, 2017
    Publication date: July 20, 2017
    Inventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
  • Patent number: 9711387
    Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: July 18, 2017
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Andreas Bibl
  • Publication number: 20170170049
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 15, 2017
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Publication number: 20170162553
    Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.
    Type: Application
    Filed: February 21, 2017
    Publication date: June 8, 2017
    Inventors: Andreas Bibl, Kelly McGroddy
  • Publication number: 20170148773
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Application
    Filed: February 7, 2017
    Publication date: May 25, 2017
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20170141091
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Application
    Filed: January 26, 2017
    Publication date: May 18, 2017
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Publication number: 20170125392
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: Andreas Bibl, Charles R. Griggs
  • Publication number: 20170125391
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 9626908
    Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: April 18, 2017
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
  • Patent number: 9620695
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Kevin K. C. Chang, Andreas Bibl
  • Patent number: 9620478
    Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 9620487
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20170092627
    Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 ?m or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.
    Type: Application
    Filed: October 20, 2016
    Publication date: March 30, 2017
    Inventors: Hsin-Hua Hu, Andreas Bibl
  • Patent number: 9599857
    Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: March 21, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kelly McGroddy
  • Publication number: 20170072559
    Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Inventors: Paul Argus Parks, Nile Alexander Light, Stephen P. Bathurst, John A. Higginson, Andreas Bibl
  • Patent number: 9589944
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: March 7, 2017
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 9583533
    Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: February 28, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl
  • Patent number: 9582036
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: February 28, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Patent number: 9583466
    Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: February 28, 2017
    Assignee: Apple Inc.
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan
  • Patent number: 9570427
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: February 14, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Charles R. Griggs