Patents by Inventor Andreas Bibl

Andreas Bibl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODES
    Publication number: 20160329232
    Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.
    Type: Application
    Filed: July 18, 2016
    Publication date: November 10, 2016
    Inventors: Dariusz Golda, Andreas Bibl
  • Micro LED with wavelength conversion layer
    Patent number: 9484504
    Abstract: A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: November 1, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Kelly McGroddy
  • Mass transfer system
    Patent number: 9484237
    Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: November 1, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, Dariusz Golda
  • Wearable display having an array of LEDs on a conformable silicon substrate
    Patent number: 9478583
    Abstract: A conformable electronic device and methods for forming such devices are described. Embodiments of a conformable electronic device may include a silicon substrate having a thickness of 50 ?m or less. An array of LEDs that are electrically coupled to a controller chip may be formed on a surface of the silicon substrate. In an embodiment, a top passivation layer is formed over the array of LEDs, the one or more controller chips, and the top surface of the silicon substrate. An embodiment also includes a bottom passivation layer formed on a bottom surface of the silicon substrate.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: October 25, 2016
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl
  • MICRO DEVICE WITH STABILIZATION POST
    Publication number: 20160308103
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: June 24, 2016
    Publication date: October 20, 2016
    Inventors: Hsin-Hua Hu, Kevin K.C. Chang, Andreas Bibl
  • Micro device transfer head heater assembly and method of transferring a micro device
    Patent number: 9463613
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: October 11, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT
    Publication number: 20160293566
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Application
    Filed: June 14, 2016
    Publication date: October 6, 2016
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • Fluid circulation
    Patent number: 9457579
    Abstract: A method for use in fluid jetting, the method includes recirculating a fluid between a first container and a second container through a flow path in a printhead, the flow path includes a nozzle through which jets fluid from either the first container or second container which supplies the fluid for jetting. A ratio of a recirculation fluid flow rate to an amount of fluid jetted through the nozzle depends on an operational parameter of the printhead, and the recirculation fluid flow rate includes an amount of the recirculation fluid passing by a cross-section of the flow path per second.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: October 4, 2016
    Assignee: FUJIFILM Dimatix, Inc.
    Inventor: Andreas Bibl
  • LED with internally confined current injection area
    Patent number: 9450147
    Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: September 20, 2016
    Assignee: Apple Inc.
    Inventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
  • COMPLIANT MICRO DEVICE TRANSFER HEAD
    Publication number: 20160257131
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • DISPLAY MODULE AND SYSTEM APPLICATIONS
    Publication number: 20160259368
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • Compliant electrostatic transfer head with spring support layer
    Patent number: 9425151
    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: August 23, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Stephen P. Bathurst, John A. Higginson, Andreas Bibl, Jeffrey Birkmeyer
  • Compliant bipolar micro device transfer head with silicon electrodes
    Patent number: 9406541
    Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: August 2, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Andreas Bibl
  • ELECTRO-STATIC DISCHARGE AND ELECTRIC OVERSTRESS PROTECTION STRATEGY FOR MICRO-CHIP ARRAY ON PANEL
    Publication number: 20160210895
    Abstract: A display system includes an array of light emitting diodes (LEDs), first and second driver chips, and one or more protection chips on a display substrate. The first and second driver chips are to drive a first group of LEDs of the array of LEDs and a second group of LEDs of the array of LEDs, respectively. Each protection chip includes one or more electro-static discharge (ESD) protection devices to assist with protecting the driver chips from damage caused by an ESD event. In one embodiment, each ESD protection device is connected between one or more signal lines, one or more power supply voltage lines, and an electrical ground line of the display substrate. In one embodiment, at least one protection chip comprises one or more electric overstress (EOS) protection devices to assist with protecting the driver chips from damage caused by an EOS event.
    Type: Application
    Filed: September 24, 2015
    Publication date: July 21, 2016
    Inventors: Xiaofeng FAN, Andreas BIBL, Kapil V. SAKARIYA, Tore NAUTA
  • Micro device transfer system with pivot mount
    Patent number: 9391042
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: July 12, 2016
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • MICRO DEVICE TRANSFER HEAD ARRAY
    Publication number: 20160196998
    Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.
    Type: Application
    Filed: February 24, 2016
    Publication date: July 7, 2016
    Inventors: Dariusz Golda, Andreas Bibl
  • MEMS Jetting Structure For Dense Packing
    Publication number: 20160185114
    Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
    Type: Application
    Filed: March 7, 2016
    Publication date: June 30, 2016
    Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
  • Micro device with stabilization post
    Patent number: 9379092
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: June 28, 2016
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Kevin K. C. Chang, Andreas Bibl
  • MASS TRANSFER TOOL MANIPULATOR ASSEMBLY
    Publication number: 20160176045
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl, Paul Argus Parks, Stephen Paul Bathurst
  • Compliant micro device transfer head
    Patent number: 9370864
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: June 21, 2016
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu