Patents by Inventor Andreas Bibl

Andreas Bibl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED display with wavelength conversion layer
    Patent number: 9865577
    Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: January 9, 2018
    Assignee: APPLE INC.
    Inventors: Andreas Bibl, Kelly McGroddy
  • Compliant electrostatic transfer head with defined cavity
    Patent number: 9828244
    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: November 28, 2017
    Assignee: APPLE INC.
    Inventors: Dariusz Golda, Stephen P. Bathurst, John A. Higginson, Andreas Bibl, Jeffrey Birkmeyer
  • LED array
    Patent number: 9831383
    Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: November 28, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
  • Compliant bipolar micro device transfer head with silicon electrodes
    Patent number: 9799547
    Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: October 24, 2017
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Andreas Bibl
  • MEMS jetting structure for dense packing
    Patent number: 9776408
    Abstract: A fluid ejector includes a fluid ejection module having a substrate and a layer separate from the substrate. The substrate includes a plurality of fluid ejection elements arranged in a matrix, each fluid ejection element configured to cause a fluid to be ejected from a nozzle. The layer separate from the substrate includes a plurality of electrical connections, each electrical connection adjacent to a corresponding fluid ejection element.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: October 3, 2017
    Assignee: FUJIFILM Dimatix, Inc.
    Inventors: Andreas Bibl, Kevin von Essen, Paul A. Hoisington
  • Method of transferring and bonding an array of micro devices
    Patent number: 9773750
    Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: September 26, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu, Hung-Fai Stephen Law
  • COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODES
    Publication number: 20170271192
    Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.
    Type: Application
    Filed: June 7, 2017
    Publication date: September 21, 2017
    Inventors: Dariusz Golda, Andreas Bibl
  • Micro device stabilization post
    Patent number: 9741592
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: August 22, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER
    Publication number: 20170206845
    Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
    Type: Application
    Filed: April 5, 2017
    Publication date: July 20, 2017
    Inventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
  • Compliant bipolar micro device transfer head with silicon electrodes
    Patent number: 9711387
    Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: July 18, 2017
    Assignee: Apple Inc.
    Inventors: Dariusz Golda, Andreas Bibl
  • MICRO DEVICE STABILIZATION POST
    Publication number: 20170170049
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 15, 2017
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • LED DISPLAY WITH WAVELENGTH CONVERSION LAYER
    Publication number: 20170162553
    Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.
    Type: Application
    Filed: February 21, 2017
    Publication date: June 8, 2017
    Inventors: Andreas Bibl, Kelly McGroddy
  • LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
    Publication number: 20170148773
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Application
    Filed: February 7, 2017
    Publication date: May 25, 2017
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • DISPLAY MODULE AND SYSTEM APPLICATIONS
    Publication number: 20170141091
    Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.
    Type: Application
    Filed: January 26, 2017
    Publication date: May 18, 2017
    Inventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
  • METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE
    Publication number: 20170125391
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
    Publication number: 20170125392
    Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: Andreas Bibl, Charles R. Griggs
  • Smart pixel lighting and display microcontroller
    Patent number: 9626908
    Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: April 18, 2017
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
  • Light emitting device reflective bank structure
    Patent number: 9620487
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Method of fabricating a micro device transfer head
    Patent number: 9620478
    Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Micro device with stabilization post
    Patent number: 9620695
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Kevin K. C. Chang, Andreas Bibl