Abstract: Embodiments herein provide a method for authenticating wireless devices. The method includes generating, by a first wireless device, first biometric data of a user based on a user input. The method further includes determining, by the first wireless device, at least one standard parameter of a first wireless signal being generated by the first wireless device. The method further includes modifying, based on the first biometric data, the at least one standard parameter of the first wireless signal resulting in a second wireless signal. The method further includes transmitting, by the first wireless device to a second wireless device, the second wireless signal, based on a match between the at least one standard parameter of the second wireless signal and at least one reference parameter of a third wireless signal that has been pre-stored in the second wireless device.

Abstract: A systolic array can be configured to skip distributed operands that have zero-values, resulting in improved resource efficiency. A skip module is introduced to receive operands from memory, identify whether they have a zero value or not, and, if they are nonzero, generate an operand vector including an index before sending the operand vector to a processing element.

Abstract: Methods and apparatus to transition between 2D and 3D renderings of augmented reality content are disclosed. An example apparatus includes instructions to cause programmable circuitry to: cause projection of an AR object onto at least one of a first surface in a real-world environment or a second surface in the real-world environment; cause the AR object to appear to move with variable depth relative to the first surface; cause the AR object to appear to move at a fixed depth relative to the second surface; cause the AR object to appear to transition from the first surface to the second surface when an apparent depth of the AR object relative to the first surface is within a threshold of the fixed depth; and prevent the AR object from appearing to transition to the second surface when the apparent depth is not within the threshold of the fixed depth.

Abstract: A systolic array can be configured to skip distributed operands that have zero-values, resulting in improved resource efficiency. A skip module is introduced to receive operands from memory, identify whether they have a zero value or not, and, if they are nonzero, generate an operand vector including an index before sending the operand vector to a processing element.

Abstract: The present disclosure is directed to systems, apparatuses, and processes to identify one or more physical surfaces within a mixed reality environment, determine visually reflective properties, respectively, of the one or more physical surfaces, and based upon the determined visually reflective properties, determined for an image to be projected out location in the mixed reality environment, characteristics of a reflection of the image in one of the one or more physical surfaces. Subsequent projections of the image in the location of the mixed reality environment may take into consideration the characteristics determined. Other embodiments may recommend or edit the image to be projected to optimize reflections of the image within the mixed reality environment. Other embodiments may be disclosed and/or claimed.

Abstract: In an embodiment, a method includes configuring a specialized circuit for floating point computations using numbers represented by a hybrid format, wherein the hybrid format includes a first format and a second format. In the embodiment, the method includes operating the further configured specialized circuit to store an approximation of a numeric value in the first format during a forward pass for training a deep learning network. In the embodiment, the method includes operating the further configured specialized circuit to store an approximation of a second numeric value in the second format during a backward pass for training the deep learning network.

Abstract: A thermal measurement system includes a temperature-controlled chamber configured to house a Device Under Test (DUT) and a first temperature sensor to measure an external temperature of the DUT inside the temperature-controlled chamber. The thermal measurement system further includes a heating device for heating a test material outside the temperature-controlled chamber and a controller configured to control the heating device to heat the test material to the external temperature measured by the first temperature sensor of the DUT inside the temperature-controlled chamber. In one aspect, a thermethesiometer indicates a skin effect of a surface temperature of the test material outside the temperature-controlled chamber.

Abstract: The disclosure provides a method for receiving a query from a user of the electronic device, wherein the query is one of a voice query, a gesture query and a text query; determining an intermediate response for an augmented query; categorizing, by the electronic device, the intermediate response; selecting at least one other user communicating with the user of the electronic device for the determined category of the intermediate response; determining a perception of the at least one other user based on a profile of the at least one other user and a communication history with the at least one other user; and generating, by the electronic device, a final response for the user of the electronic device based on the perception of at least one other user and the determined intermediate response.

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises a mold material. In an embodiment, a first photonics integrated circuit (PIC) is within the second layer. In an embodiment, a second PIC is within the second layer, and a waveguide is in the first layer. In an embodiment, the waveguide optically couples the first PIC to the second PIC.

Abstract: An apparatus comprises at least one processor and at least one memory including instruction code configured to, with the at least one processor, cause the apparatus at least to perform, with a first accuracy, a first portion of a bitwise multiplication of first and second digital inputs and to perform, with a second accuracy different than the first accuracy, at least a second portion of the bitwise multiplication.

Abstract: An apparatus comprising an integrated circuit chip comprising a first surface region and a second surface region adjacent to the first surface region; a substrate coupled to the integrated circuit chip through a plurality of connections comprising solder; and underfill between the substrate and the integrated circuit chip, wherein the underfill contacts the second surface region, but does not contact the first surface region.

Abstract: A method of storing or searching data files on a plurality of cloud-based storage systems includes detecting an event on the electronic device indicative of storing at least one data file on a cloud-based storage, analyzing the at least one data file in response to detecting the event to extract a plurality of elements, mapping the plurality of elements to one or more rules stored in a memory of the electronic device, selecting at least one cloud-based storage for storing the at least one data file, and storing information corresponding to the at least one data file in the memory upon storing the at least one data file onto the selected at least one cloud-based storage for searching the at least one data file.

Abstract: Techniques for performing analog-to-digital conversion are disclosed. For example, a method performs an analog-to-digital conversion of an analog input to a digital output comprising a set of bits, the set of bits comprising a most significant bit and one or more additional bits, the analog-to-digital conversion starting at a given one of the one or more additional bits following the most significant bit.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermal routing techniques within a hybrid silicon laser or photonics integrated circuit to facilitate heat extraction during laser operation. In particular dual metal layers, with a top metal layer thermally coupled with P node above a quantum well and extending substantially under a heat sink, and a bottom metal layer thermally coupled with an N node, where the top metal layer and the bottom metal layer are not electrically coupled. Other embodiments may be described and/or claimed.

Abstract: An integrated circuit package may be formed comprising a first integrated circuit assembly, a second integrated circuit assembly, and a means to transfer optical signals therebetween. This optical signal transfer may be facilitated with a first lens or a first micro-lens array adjacent at least one waveguide of the first integrated circuit assembly and a second lens or second micro-lens array adjacent at least one waveguide of the second integrated circuit assembly, wherein the optical signals are transmitted across a gap between the first lens/micro-lens array and the second lens/micro-lens array. In further embodiments, the optical signal transfer assembly may comprise at least one photonic bridge between at least one waveguide of the first integrated circuit assembly and at least one waveguide of the second integrated circuit assembly.

Abstract: Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.

Abstract: Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.

Abstract: Examples disclosed herein provide real-time language learning within a smart space. An example system includes a sensor; object detection software to identify a first object and a second object in an environment based on an output of the sensor; assign a first weight to the first object and a second weight to the second object; perform a comparison of the first weight and the second weight; and select the first object to be associated with a second language output based on the comparison; context determination software to determine a second language context based on the output of the sensor; linguistic analysis software to associate the first object with a second language based on the second language context; and prompt generation software to cause the second language output for the first object in the second language to be presented.

Abstract: IC chip package with silicon photonic features integrated onto an interposer along with electrical routing redistribution layers. An active side of an IC chip may be electrically coupled to a first side of the interposer through first-level interconnects. The interposer may include a core (e.g., of silicon or glass) with electrical through-vias extending through the core. The redistribution layers may be built up on a second side of the interposer from the through-vias and terminating at interfaces suitable for coupling the package to a host component through second-level interconnects. Silicon photonic features (e.g., of the type in a photonic integrated circuit chip) may be fabricated within a silicon layer of the interposer using high temperature processing, for example of 350° C., or more. The photonic features may be fabricated prior to the fabrication of metallized redistribution layers, which may be subsequently built-up within dielectric material(s) using lower temperature processing.

Abstract: Methods and apparatus to transition between 2D and 3D renderings of augmented reality content are disclosed. An example apparatus includes instructions to cause programmable circuitry to: cause projection of an AR object onto at least one of a first surface in a real-world environment or a second surface in the real-world environment; cause the AR object to appear to move with variable depth relative to the first surface; cause the AR object to appear to move at a fixed depth relative to the second surface; cause the AR object to appear to transition from the first surface to the second surface when an apparent depth of the AR object relative to the first surface is within a threshold of the fixed depth; and prevent the AR object from appearing to transition to the second surface when the apparent depth is not within the threshold of the fixed depth.