Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits that modulate data, communicate data, and serialize/deserialize data, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and a top surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit. Furthermore, a bottom surface of the optical integrated circuit faces the top surface of the interposer, and the front surface of the optical integrated circuit is optically coupled to an optical-fiber receptacle, which in turn is optically coupled to an optical-fiber connector.

Abstract: When an unsafe port with a loss of signal is detected, a transceiver may enable one laser in a group of lasers associated with the unsafe port and may disable the remaining lasers. Then, the transceiver may instruct a transmitter associated with the one laser to transmit an optical signal on the unsafe port using a reduced transmit power that is less than a threshold value associated with the Class 1 conditions and at a different time than enabled lasers in other groups of lasers. Alternatively, for a safe port on which valid communication is received, the transceiver may enable lasers in a group of lasers associated with the safe port. Then, the transceiver may instruct transmitters associated with the lasers in this group of lasers to transmit optical signals on the safe port using a normal transmit power for the lasers that is greater than the threshold value.

Abstract: A dual-ring-modulated laser includes a gain medium having a reflective end coupled to a gain-medium reflector and an output end coupled to a reflector circuit to form a lasing cavity. This reflector circuit comprises: a first ring modulator; a second ring modulator; and a shared waveguide that optically couples the first and second ring modulators. The first and second ring modulators have resonance peaks, which are tuned to have an alignment separation from each other. During operation, the first and second ring modulators are driven in opposing directions based on the same electrical input signal, so the resonance peaks of the first and second ring modulators shift wavelengths in the opposing directions during modulation. The modulation shift for each of the resonance peaks equals the alignment separation, so the resonance peaks interchange positions during modulation to cancel out reflectivity changes in the lasing cavity caused by the modulation.

Abstract: An optical source is described. This hybrid external cavity laser includes a semiconductor optical amplifier (with a semiconductor other than silicon) that provides an optical gain medium and that includes a reflector (such as a mirror). Moreover, the hybrid external cavity laser includes a photonic chip with: an optical waveguide that conveys an optical signal output by the semiconductor optical amplifier; and a ring resonator (as a wavelength-selective filter), having a resonance wavelength, which reflects at least a resonance wavelength in the optical signal. Furthermore, the photonic chip includes an interferometer that provides optical signals on arms of the interferometer. Control logic in the hybrid external cavity laser thermally tunes the resonance wavelength to match a cavity mode of the hybrid external cavity laser based on measurements of the optical signals from the interferometer.

Abstract: An integrated circuit includes an optical reflector with one or two bus optical waveguides and a one-dimensional, photonic crystal nanobeam cavity to provide single-mode reflection with a narrow bandwidth. In particular, the nanobeam cavity may be implemented on a nanobeam-cavity optical waveguide (such as a channel or ridge optical waveguide), which is optically coupled to the one or two bus optical waveguides. The nanobeam-cavity optical waveguide may include notches along a symmetry axis of the nanobeam-cavity optical waveguide that are partially etched from edges of the nanobeam-cavity optical waveguide toward a center of the nanobeam-cavity optical waveguide. Furthermore, a fill factor of the notches may vary as a function of location along the symmetry axis, while a pitch of the notches is unchanged, to define the nanobeam cavity.

Abstract: A hybrid optical source that provides an optical signal having a wavelength (or a narrow band of wavelengths) is described. This hybrid optical source includes an optical amplifier (such as a III-V semiconductor optical amplifier) that is butt-coupled or vertically coupled to a silicon-on-insulator (SOI) platform, and which outputs an optical signal. The SOI platform includes an optical waveguide that conveys the optical signal. A temperature-compensation element included in the optical waveguide compensates for temperature dependence of the indexes of refraction of the optical amplifier and the optical waveguide. In addition, a reflector, adjacent to the optical waveguide after the temperature-compensation element, reflects a portion of the optical signal and transmits another portion of the optical signal that has the wavelength.

Abstract: An optical modulator is described. This optical modulator may be implemented using silicon-on-insulator (SOI) technology. In particular, the optical modulator may include a carrier-accumulation-type micro-disk resonator fabricated using optical waveguides having a composite structure. Moreover, the composite structure may embed a metal-oxide semiconductor capacitor in the disk resonator. For example, the composite structure may include polysilicon disposed on an oxide layer, which is disposed on a silicon layer in an SOI platform. The optical modulator may have high modulation efficiency and high-speed operation. In addition, the optical modulator may have a compact footprint with low power consumption.

Abstract: An integrated circuit includes an optical reflector with one or two bus optical waveguides and a one-dimensional, photonic crystal nanobeam cavity to provide single-mode reflection with a narrow bandwidth. In particular, the nanobeam cavity may be implemented on a nanobeam-cavity optical waveguide (such as a channel or ridge optical waveguide), which is optically coupled to the one or two bus optical waveguides. The nanobeam-cavity optical waveguide may include notches along a symmetry axis of the nanobeam-cavity optical waveguide that are partially etched from edges of the nanobeam-cavity optical waveguide toward a center of the nanobeam-cavity optical waveguide. Furthermore, a fill factor of the notches may vary as a function of location along the symmetry axis, while a pitch of the notches is unchanged, to define the nanobeam cavity.

Abstract: A technique for fabricating a hybrid optical source is described. During this fabrication technique, a III-V compound-semiconductor active gain medium is integrated with a silicon-on-insulator (SOI) chip (or wafer) using edge coupling to form a co-planar hybrid optical source. Using a backside etch-assisted cleaving technique, and a temporary transparent substrate with alignment markers, a III-V compound-semiconductor chip with proper edge polish and coating can be integrated with a processed SOI chip (or wafer) with accurate alignment. This fabrication technique may significantly reduce the alignment complexity when fabricating the hybrid optical source, and may enable wafer-scale integration.

Abstract: An optical source includes a semiconductor optical amplifier that provides an optical signal, and a photonic chip with first and second ring resonators that operate as Vernier rings. When the optical source is operated below a lasing threshold, one or more thermal-tuning mechanisms, which may be thermally coupled to the first ring resonator and/or the second ring resonator, may be adjusted to align resonances of the first ring resonator and the second ring resonator based on measured optical power on a shared optical waveguide that is optically coupled to the first and second ring resonators. Then, when the optical source is operated above the lasing threshold, a common thermal-tuning mechanism may be adjusted to lock the aligned resonances with an optical cavity mode of the optical source based on a measured optical power on an optical waveguide that is optically coupled to the first ring resonator.

Abstract: Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).

Abstract: An optical device includes an optical reflector based on a coupled-loopback optical waveguide. In particular, an input port, an output port and an optical loop in arms of the optical reflector are optically coupled to a directional coupler. The directional coupler evanescently couples an optical signal between the arms. For example, the directional coupler may include: a multimode interference coupler and/or a Mach-Zehnder Interferometer (MZI). Moreover, destructive interference during the evanescent coupling determines the reflection and transmission power coefficients of the optical reflector.

Abstract: A standard-CMOS-process-compatible optical mode converter transitions an optical mode size using a series of adjacent regions having different optical mode sizes. In particular, in a partial-slab-mode region, which is adjacent to an initial rib-optical-waveguide-mode region, a width of a slab portion of the rib-type optical waveguide decreases and a width of a rib portion of the rib-type optical waveguide decreases to a first minimum tip size. Then, in a slab-mode region, which is adjacent to the partial-slab-mode region, the width of the slab portion decreases to a second minimum tip size. In addition, a dielectric layer is disposed over the slab portion, the rib portion and the BOX layer in the partial-slab-mode region, the slab portion and the BOX layer in the slab-mode region, and the BOX layer in a released-mode region that is adjacent to the slab-mode region and that does not include the semiconductor layer.

Abstract: A standard-CMOS-process-compatible optical mode converter transitions an optical mode size using a series of adjacent regions having different optical mode sizes. In particular, in a partial-slab-mode region, which is adjacent to an initial rib-optical-waveguide-mode region, a width of a slab portion of the rib-type optical waveguide decreases and a width of a rib portion of the rib-type optical waveguide decreases to a first minimum tip size. Then, in a slab-mode region, which is adjacent to the partial-slab-mode region, the width of the slab portion decreases to a second minimum tip size. In addition, a dielectric layer is disposed over the slab portion, the rib portion and the BOX layer in the partial-slab-mode region, the slab portion and the BOX layer in the slab-mode region, and the BOX layer in a released-mode region that is adjacent to the slab-mode region and that does not include the semiconductor layer.

Abstract: An optical modulator is described. This optical modulator may be implemented using silicon-on-insulator (SOI) technology. In particular, a semiconductor layer in an SOI platform may include a photonic crystal having a group velocity of light that is less than that of the semiconductor layer. Moreover, an optical modulator (such as a Mach-Zehnder interferometer) may be implemented in the photonic crystal with a vertical junction in the semiconductor layer. During operation of the optical modulator, an input optical signal may be split into two different optical signals that feed two optical waveguides, and then subsequently combined into an output optical signal. Furthermore, during operation, time-varying bias voltages may be applied across the vertical junction in the optical modulator using contacts defined along a lateral direction of the optical modulator.

Abstract: An optical source is described. This optical source includes a semiconductor optical amplifier, with a semiconductor other than silicon, which provides an optical gain medium. In addition, a photonic chip, optically coupled to the semiconductor optical amplifier, includes: a first optical waveguide that conveys at least a portion of the optical signal, and a second optical waveguide that conveys at least another portion of the optical signal. Moreover, the photonic chip includes a distributed-Bragg-reflector (DBR) ring resonator that is optically coupled to the first optical waveguide and the second optical waveguide, and that reflects a tunable wavelength in the optical signal. Furthermore, a monitor on the photonic chip measures at least the other portion of the optical signal, and control logic on the photonic chip thermally tunes the tunable wavelength of the DBR ring resonator based on the measurement of at least the other portion of the optical signal.

Abstract: A photonic integrated circuit (PIC) is described. This PIC includes a semiconductor-barrier layer-semiconductor diode in an optical waveguide that conveys an optical signal, where the barrier layer is an oxide or a high-k material. Moreover, semiconductor layers in the semiconductor-barrier layer-semiconductor diode may include geometric features (such as a periodic pattern of holes or trenches) that create a lattice-shifted photonic crystal optical waveguide having a group velocity of light that is lower than the group velocity of light in the first semiconductor layer and the second semiconductor layer without the geometric features. The optical waveguide is included in an optical modulator, such as a Mach-Zehnder interferometer (MZI).

Abstract: A macro-switch is described. This macro-switch includes facing integrated circuits, one of which implements optical waveguides that convey optical signals, and the other which implements control logic, electrical switches and memory buffers at each of multiple switch sites. Moreover, the macro-switch has a fully connected topology between the switch sites. Furthermore, the memory buffers at each switch site provide packet buffering and congestion relief without causing undue scheduling/routing complexity. Consequently, the macro-switch can be scaled to an arbitrarily large switching matrix (i.e., an arbitrary number of switch sites and/or switching stages).

Abstract: A multi-chip module (MCM) is described. This MCM includes two substrates that are passively self-assembled on another substrate using hydrophilic and hydrophobic materials on facing surfaces of the substrates and liquid surface tension as the restoring force. In particular, regions with a hydrophilic material on the two substrates overlap regions with the hydrophilic material on the other substrate. These regions on the other substrate may be surrounded by a region with a hydrophobic material. In addition, spacers on a surface of at least one of the two substrates may align optical waveguides disposed on the two substrates, so that the optical waveguides are coplanar. This fabrication technique may allow low-loss hybrid optical sources to be fabricated by edge coupling the two substrates. For example, a first of the two substrates may be a III/V compound semiconductor and a second of the two substrates may be a silicon-on-insulator photonic chip.

Abstract: A photonic integrated circuit (PIC) is described. This PIC includes a grating coupler for surface-normal coupling that has an alternating pattern of grating teeth and grating trenches, where the grating trenches are filled with an electro-optical material. By applying an electric potential to the grating teeth, the index of refraction of the electro-optical material can be modified.