Abstract: A mold for imprinting a pattern onto a resin material applied onto a substrate is constituted by a mold substrate formed of a material transparent to light in at least a part of a wavelength range of light used for alignment, an alignment structure area having an alignment structure comprising a recess portion, a pattern forming area having a pattern, and a coating layer is formed of a material having an optical characteristic different from that of the mold substrate. The coating layer is on a side wall of the recess portion.

Abstract: A mold applicable to imprinting includes a first surface having an area of a pattern to be transferred, a second surface located opposite from the first surface, a first mark for alignment provided at the first surface, and a second mark for alignment provided at a position at which the second mark is spaced from the first surface.

Abstract: A process for producing a structure containing silicon oxide includes a step of forming a first layer of organic spin-on glass on a substrate and a step of forming a second layer of inorganic spin-on glass on the first layer. Thereafter, the first layer is etched by using a pattern formed on the second layer as a mask and then the first layer and the second layer are calcined to prepare the structure containing silicon oxide.

Abstract: A process for producing a structure containing silicon oxide includes a step of forming a first layer of organic spin-on glass on a substrate and a step of forming a second layer of inorganic spin-on glass on the first layer. Thereafter, the first layer is etched by using a pattern formed on the second layer as a mask and then the first layer and the second layer are calcined to prepare the structure containing silicon oxide.

Abstract: An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage.

Abstract: An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.

Abstract: An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled.

Abstract: There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.

Abstract: A nanoimprinting method includes: forming at a region for performing a first nanoimprinting process on a substrate, a first patterning region with a first affinity to resin; forming at a region for performing a second nanoimprinting process on the substrate, a second patterning region with a second affinity to resin, the second affinity being lower than the first affinity; applying the resin to the first patterning region and transferring a pattern of a mold to the resin by the first nanoimprinting process; and modifying the second patterning region to a region with affinity to resin that is higher than the second affinity, then applying the resin to the modified region, and performing the second nanoimprinting process to process the second patterning region thereby connecting patterns formed at the first patterning region and the second patterning region to each other.

Abstract: A method for manufacturing a semiconductor device is provided, in which the lengths of a wiring trench and a via hole in a depth direction are easily controlled. A component having a first insulating film is prepared on a substrate, and a layer is disposed on the above-described first insulating film. A mold having a pattern is imprinted on the above-described layer so as to form a second insulating film having a wiring trench and a first via, the pattern corresponding to the wiring trench and the first via. Thereafter, the above-described first insulating film is etched by using the above-described second insulating film as a mask so as to form a second via, which is connected to the first via, in the first insulating film.

Abstract: A manufacturing method of a structure by an imprint process includes a first imprint step of forming a first resin material layer by applying a first resin material onto a substrate and then transferring an imprint pattern of a mold onto the first resin material layer, a second imprint step of forming a second resin material layer by applying a second resin material onto the first resin material layer formed in the first imprint step and onto an area of the substrate adjacent to the first resin material layer and then transferring the imprint pattern of the mold onto the second resin material layer, and a step of forming a pattern by etching the first and second resin material layers.

Abstract: A method of processing a substrate includes applying a resin on the substrate, imprinting a pattern of a mold onto the resin, the pattern including protrusions and recesses, forming a protective layer over the resin, etching the protective layer so that the protrusions of the pattern imprinted in the resin are exposed and the protective layer in the recesses of the pattern in the resin remains, etching the exposed protrusions of the pattern, to expose the substrate, while using the protective layer as a mask to prevent areas covered by the protective layer from being etched, so that a reverse pattern is formed on the protective layer, which has a structure reversed from the pattern imprinted on the resin, and etching the exposed substrate, to etch a pattern in the substrate, while using the reverse pattern as a mask to prevent areas covered by the protective layer from being etched.

Abstract: A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.

Abstract: A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.

Abstract: An imprint method is constituted by a step of curing a resin material formed on a substrate in a state in which an imprint pattern of a mold is in contact or proximity with the resin material, and a step of parting the mold from the cured resin material. The parting is effected while irradiating an entire area in which the imprint pattern of the mold is formed and the cured resin material with an electromagnetic wave for ionizing gaseous molecules in an atmosphere in which the mold and the cured resin material are placed.

Abstract: A mold for imprinting a pattern onto a member to be processed is constituted by a mold body having a front surface, at which the pattern is formed, and a rear surface opposite from the front surface; a coating layer for covering the front surface of the mold body; and a coating layer for covering the rear surface of the mold body. The coating layer for covering the rear surface of the mold body is partially provided with an opening at the rear surface of the mold body.

Abstract: A mold capable of effecting alignment of the mold and the member to be processed with high accuracy even in such a state that a photocurable resin material is disposed between the mold and the member to be processed is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmittivities to light in a part of an ultraviolet wavelength range of the ultraviolet light. The second material has a refractive index of not less than 1.7.

Abstract: A method for manufacturing a semiconductor device is provided, in which the lengths of a wiring trench and a via hole in a depth direction are easily controlled. A component having a first insulating film is prepared on a substrate, and a layer is disposed on the above-described first insulating film. A mold having a pattern is imprinted on the above-described layer so as to form a second insulating film having a wiring trench and a first via, the pattern corresponding to the wiring trench and the first via. Thereafter, the above-described first insulating film is etched by using the above-described second insulating film as a mask so as to form a second via, which is connected to the first via, in the first insulating film.

Abstract: A pattern forming method includes a step of forming a pattern of a resist on a surface of a thin film formed on the base material; a step of forming a reverse layer on the pattern of the resist; a step of forming a reverse pattern, of the reverse layer complementary to the pattern of the resist by removing the resist after removing the reverse layer to expose a surface of the resist; a step of forming a hard mask layer including the thin film, on which the reverse layer is formed, by etching the thin film through the reverse pattern of the reverse layer as a mask; and a step of etching the base material through, as a mask, the hard mask layer on which the reverse layer remains or the hard mask layer on which the reverse layer has been removed.

Abstract: A fluid delivery device is provided which comprises a microchannel device for cutting out a certain amount of a sample from a micorochannel by controlling a valve opening. The fluid delivery device has a valve for controlling a flow of a fluid, comprising a flow channel for the fluid, and a valve in the flow channel, wherein the valve operates in accordance with a pressure difference between the upstream side and downstream side of the valve caused by the flow of the fluid through the flow channel, allowing the fluid to flow when the pressure difference is lower than a prescribed value P0, and intercepting the fluid not to flow when the pressure difference is P0 or more.