Patents by Inventor Beom Joon Cho
Beom Joon Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11948750Abstract: An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.Type: GrantFiled: September 28, 2021Date of Patent: April 2, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon Cho, Ki Young Kim, Woo Chul Shin, Sang Soo Park
-
Patent number: 11848159Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and a pair of external electrodes disposed on opposing ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein the external electrodes respectively include a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrode and a band portion extending from the connection portion to a portion of a neighboring surface of the capacitor body, a conductive resin layer covering a corner of the connection portion of the conductive layer and having a cutout portion so that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer due to the cutout portion.Type: GrantFiled: June 3, 2021Date of Patent: December 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Beom Joon Cho
-
Patent number: 11837404Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.Type: GrantFiled: January 18, 2023Date of Patent: December 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
-
Publication number: 20230282422Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: ApplicationFiled: May 11, 2023Publication date: September 7, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
-
Patent number: 11749460Abstract: There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.Type: GrantFiled: May 28, 2021Date of Patent: September 5, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Gyeong Ju Song, Beom Joon Cho, Seung Min Ahn
-
Patent number: 11728095Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.Type: GrantFiled: August 30, 2021Date of Patent: August 15, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon Cho, Seung Min Ahn, Mi Na Hyun
-
Patent number: 11721481Abstract: An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A?B?0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.Type: GrantFiled: June 9, 2021Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
-
Publication number: 20230215633Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a first direction, first and second side margin portions respectively disposed on surfaces of the body in a third direction, and external electrodes respectively disposed on surfaces of the body in a second direction. The first side margin portion includes first dielectric grains, the dielectric layer includes second dielectric grains, and in cross-sections of the first side margin portion and the body in the first and third directions, a ratio of a major axis length to a minor axis length of the first dielectric grain is 3 or greater and 30 or less, and a ratio of a major axis length to a minor axis length of the second dielectric grain is 1.5 or less.Type: ApplicationFiled: November 8, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Beom Joon Cho
-
Publication number: 20230215634Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other, having at least one dielectric layer interposed therebetween in a first direction; and first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to the at least one first internal electrode and the at least one second internal electrode. The body further includes a cover layer disposed to overlap the capacitance region in the first direction, and 1.11 or more is a value obtained by dividing a sum of respective major-axis lengths Lx of a plurality of crystal grains included in the cover layer by a sum of respective minor-axis lengths Sx of the plurality of crystal grains.Type: ApplicationFiled: October 31, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Beom Joon Cho
-
Patent number: 11688561Abstract: An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames respectively including a pair of connected portions connected to the pair of external electrodes, respectively, and a pair of mounted portions bent at and extending from one ends of the pair of connected portions, respectively, wherein corners of end portions of the pair of mounted portions facing each other have a curved surface.Type: GrantFiled: May 20, 2021Date of Patent: June 27, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young Heon Lee, Beom Joon Cho, Gyeong Ju Song
-
Publication number: 20230170140Abstract: A multilayer electronic component includes a capacitor including a body comprising a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, first and second external electrodes disposed on the body, a first metal frame disposed on the first external electrode of the capacitor, and a second metal frame disposed on the second external electrode of the capacitor. W>L, wherein L is a dimension of the capacitor in a second direction and W is a dimension of the capacitor in a third direction, and the first and second metal frames include support portions in contact with the first and second external electrodes, extension portions extending from the support portions in a first direction and disposed to be spaced apart from the body and the first and second external electrodes, and mounting portions extending from one ends of the extension portion in the second direction.Type: ApplicationFiled: October 27, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Beom Joon CHO
-
Publication number: 20230154677Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.Type: ApplicationFiled: January 18, 2023Publication date: May 18, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
-
Patent number: 11640876Abstract: An electronic component includes at least one first multilayer capacitor and at least one second multilayer capacitor alternatively laminated in a first direction perpendicular to one surface of the first multilayer capacitor, such that an external electrode of the first multilayer capacitor is connected to an external electrode of the second multilayer capacitor. In the first multilayer capacitor, a plurality of internal electrodes are laminated in a first direction, and in the second multilayer capacitor, a plurality of internal electrodes are laminated in a second direction perpendicular to the first direction.Type: GrantFiled: April 29, 2021Date of Patent: May 2, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon Cho, Min Kyeong Sim
-
Patent number: 11594376Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.Type: GrantFiled: March 22, 2021Date of Patent: February 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon Cho, Won Young Jang, Hyeok Jin Park
-
Patent number: 11587729Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.Type: GrantFiled: September 8, 2021Date of Patent: February 21, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Yeop Kim, Beom Joon Cho, Gyeong Ju Song
-
Patent number: 11581135Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes a capacitor body, a pair of external electrodes, respectively disposed on end portions of the capacitor body, a pair of metal frames, respectively disposed to be connected the pair of external electrodes, and a conductive bonding layer disposed between the external electrode and the metal frame and having a discontinuous region.Type: GrantFiled: February 26, 2021Date of Patent: February 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Kyeong Sim, Beom Joon Cho
-
Patent number: 11515096Abstract: An electronic component includes a capacitor component including a body and an external electrode disposed outside the body; a metal frame connected to the external electrode; and an encapsulant at least partially covering regions of the capacitor component and the metal frame. The metal frame may include a surface unevenness portion disposed on at least a portion of an interface with the encapsulant.Type: GrantFiled: April 23, 2021Date of Patent: November 29, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Min Ahn, Beom Joon Cho, Ki Young Kim
-
Publication number: 20220262573Abstract: An electronic component is provided, and the electronic component includes: a capacitor array in which a plurality of multilayer capacitors are stacked, the plurality of multilayer capacitors including a body, and first and second external electrodes; first and second metal frames including first and second support portions bonded to the first and second external electrodes of the capacitor array, first and second mounting portions located below the first and second external electrodes and having first and second protrusions protruding downwardly, and first and second connection portions connecting the first and second support portions to the first and second mounting portions, respectively; and a capsule portion encapsulating the capacitor array to expose the first mounting portion of the first metal frame and the second mounting portion of the second metal frame, and having a lower surface provided with a plurality of protruding portions are formed at predetermined intervals.Type: ApplicationFiled: May 2, 2022Publication date: August 18, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Young KIM, Jae Young NA, Beom Joon CHO, Ji Hong JO, Woo Chul SHIN
-
Patent number: 11393624Abstract: A board having an electronic component mounted thereon includes a capacitor body; a pair of external electrodes disposed on both ends of the capacitor body, respectively; a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions each having a protrusion on a lower side thereof, respectively; a board; and a pair of electrode pads disposed on an upper surface of the board and connected to the pair of metal frames, respectively, and each having a groove portion corresponding to the protrusion on an upper surface thereof.Type: GrantFiled: May 3, 2021Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyeong Ju Song, Beom Joon Cho, Sang Yeop Kim
-
Publication number: 20220181086Abstract: An electronic component, which is mounted on a substrate having an electrode pad disposed on an upper surface thereof and bonded to a metal frame of the electronic component through a solder, includes a capacitor body, an external electrode respectively disposed on one end of the capacitor body, and a metal frame connected to the external electrode and mounted on the electrode pad of the substrate. The metal frame is divided into first and second portions including different metals having different electrical conductivity.Type: ApplicationFiled: August 30, 2021Publication date: June 9, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Beom Joon CHO, Seung Min AHN, Mi Na HYUN