Abstract: An electronic component and a board having the same mounted thereon are provided. The electronic component includes: a body; an electrode disposed on an end of the body in a first direction; a metal frame including a support layer bonded to the external electrode, a mounting portion extending in the first direction in a lower end of the support layer and having a protruding portion on a lower surface, and a coating film formed to cover an upper surface of the protruding portion on an upper surface of the mounting portion and including titanium (Ti).

Abstract: An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.

Abstract: An electronic component includes a capacitor array having a plurality of multilayer capacitors consecutively arranged in a first direction, the plurality of multilayer capacitors each comprising a body, and first and second external electrodes respectively comprising first and second head portions, and first and second band portions respectively extending from the first and second head portions to portions of upper and lower surfaces and portions of side surfaces of the body, a first metal frame coupled to the plurality of first band portions by binding the first band portions in belt form so as to be connected to the plurality of first external electrodes, and a second metal frame coupled to the plurality of second band portions by binding the second band portions in belt form so as to be connected to the plurality of second external electrodes.

Abstract: An electronic component includes a body in which external electrodes are disposed on opposing surfaces of the body in a first direction thereof, respectively; and a pair of metal frames connected to the external electrodes, respectively, wherein the metal frame includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is smaller than a length of the body in the second direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a body, external electrodes including head portions disposed on external surfaces of the body, and band portions extending from the head portions to top and bottom surfaces and both side surfaces of the body, respectively, each of the band portions including an extending portion disposed on at least one surface of the body extending beyond a band portion disposed on another surface of the body, and metal frames electrically connected to the pair of external electrodes, respectively. The metal frames includes support portions bonded to the head portions, mounting portions extending from ends of the support portions in a first direction and spaced apart from the body and the external electrodes, and bonding portions extending from the support portions to be bonded to the extending portions.

Abstract: An electronic component includes: a capacitor body; an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component; a metal frame electrically connected to the external electrode; and a bonding member disposed between the external electrode and the metal frame. The bonding member includes a tin (Sn)-based solder layer; a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.

Abstract: A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.

Abstract: An electronic component includes a capacitor array having a plurality of multilayer capacitors consecutively arranged in a first direction, the plurality of multilayer capacitors each comprising a body, and first and second external electrodes respectively comprising first and second head portions, and first and second band portions respectively extending from the first and second head portions to portions of upper and lower surfaces and portions of side surfaces of the body, a first metal frame coupled to the plurality of first band portions by binding the first band portions in belt form so as to be connected to the plurality of first external electrodes, and a second metal frame coupled to the plurality of second band portions by binding the second band portions in belt form so as to be connected to the plurality of second external electrodes.

Abstract: A multilayer electronic component includes: a first frame terminal including a first side frame, a first bottom frame and a first top frame; a second frame terminal including a second side frame, a second bottom frame and a second top frame; an electronic component including first and second external electrodes, and disposed between the first and second side frames; a first conductive adhesive disposed between the first external electrode and an upper portion of the first frame terminal; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second frame terminal, wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a body, external electrodes including head portions disposed on external surfaces of the body, and band portions extending from the head portions to top and bottom surfaces and both side surfaces of the body, respectively, each of the band portions including an extending portion disposed on at least one surface of the body extending beyond a band portion disposed on another surface of the body, and metal frames electrically connected to the pair of external electrodes, respectively. The metal frames includes support portions bonded to the head portions, mounting portions extending from ends of the support portions in a first direction and spaced apart from the body and the external electrodes, and bonding portions extending from the support portions to be bonded to the extending portions.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.

Abstract: A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.