Abstract: There is provided a ceramic sheet product having a binder layer separately formed in a lower portion thereof to increase stackability and to reduce generation of pores after binder burnout, and a method thereof. The ceramic sheet product includes a binder layer formed of a binder resin; and a ceramic green sheet form on the binder layer. This reduces an amount of high polymer binder in a ceramic slurry, increasing a ceramic powder fraction. Due to such a high density of the green sheet, the number of pores formed after the binder burnout is very small, which decreases volume shrinkage and increases density.

Abstract: There is provided a Low Temperature Co-fired Ceramic (LTCC) composition, an LTCC substrate comprising the same, and a method of manufacturing the same. The LTCC composition includes 20 to 70 parts by weight of ceramic powder; and 30 to 80 parts by weight of glass component for low-temperature sintering, wherein the ceramic powder has plate-shaped ceramic powder particles and globular ceramic powder particles, and the ceramic powder has a content ratio of the globular ceramic powder particles with respect to the plate-shaped ceramic powder particles in a range of 0 to 1.

Abstract: Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40?a?89, 10?b?50, 1?c?20, 0?d?10, and 0?e?10, respectively.

Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

Abstract: There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic powder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than that of the first constraining layer.

Abstract: There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics.

Abstract: Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

Abstract: Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The first ceramic layer has a firing area shrinkage rate of about 1% or less. The second ceramic layer has a cavity receiving electronic components and a different firing shrinkage rate from the first ceramic layer.

Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

Abstract: There is provided a constraining green including a first constraining layer having a surface disposed on the one of the top and bottom surfaces of the ceramic laminated body, the first constraining layer containing a first inorganic powder; and a second constraining layer disposed on a top of the first constraining layer and containing a second inorganic powder and a fly ash. The constraining green sheet serves to ensure less shrinkage of the ceramic laminated body and improve debinding characteristics.

Abstract: Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40?a?89, 10?b?50, 1?c?20, O?d?10, and O?e?10, respectively.

Abstract: There is provided a method of manufacturing a dielectric sheet and a multilayer ceramic substrate. A method of manufacturing a dielectric sheet according to an aspect of the invention may include: forming an embossed pattern formed of a thermoplastic material on a carrier film; forming a dielectric sheet by casting dielectric slurry onto the carrier film to cover the embossed pattern; removing the carrier film and the embossed pattern to leave an intaglio pattern having the shape corresponding to the embossed pattern on the dielectric sheet; and filling the intaglio pattern of the dielectric sheet with a conductive material. According to an aspect of the invention, a method of manufacturing a dielectric sheet and a multilayer ceramic substrate that can prevent the generation of irregularities when a dielectric sheet having an intaglio electrode pattern printed thereon is laminated to a multilayer substrate can be provided.

Abstract: Provided is a carrier film for forming a ceramic green sheet. The carrier film includes a film-type base material for fabricating the ceramic green sheet, a binder layer disposed on the film-type base material, the binder layer being formed of a binder resin, and a delamination layer disposed on a bottom surface of the carrier film, the delamination layer being formed of a resin having a releasing property. Also, provided is a method for fabricating a ceramic green sheet. The method includes preparing a carrier film for forming the ceramic green sheet including a binder layer, coating a ceramic slurry onto the carrier film, and drying the coated ceramic slurry to form the ceramic green sheet.

Abstract: There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic binder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than a powder packing density of the first constraining layer.

Abstract: Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate using the same. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on the top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. Thus, a shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders that are different in terms of density and particle diameter.

Abstract: A pressure loader for firing a laminated ceramic substrate includes an outer loader and an inner loader. The outer loader is mounted on a periphery region of a ceramic laminated body to press the periphery region, and the inner loader is mounted on an internal region of the ceramic laminated body to press the internal region.