Abstract: An electronic component includes: a capacitor body; an external electrode disposed on an end of the capacitor body in a first direction and containing copper (Cu) as a main component; a metal frame electrically connected to the external electrode; and a bonding member disposed between the external electrode and the metal frame. The bonding member includes a tin (Sn)-based solder layer; a tin-copper based alloy solder layer disposed between the tin-based solder layer and the external electrode; and a tin-based alloy solder layer disposed between the tin-based solder layer and the metal frame.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: An electronic component includes a body; external electrodes respectively disposed on opposing surfaces of the body in a first direction thereof; and a pair of metal frames connected to the external electrodes, respectively, in which each of the metal frames includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is greater than a length of the body in the second direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.

Abstract: An electronic component includes a body in which external electrodes are disposed on opposing surfaces of the body in a first direction thereof, respectively; and a pair of metal frames connected to the external electrodes, respectively, wherein the metal frame includes a support portion bonded to the external electrodes, and a mounting portion extending in the first direction from a lower end of the support portion and spaced apart from the body and the external electrodes, and a length of the mounting portion in a second direction perpendicular to the first direction is smaller than a length of the body in the second direction.

Abstract: An electronic component includes a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction; and a pair of metal frames disposed on opposing side surfaces of the capacitor array, respectively, and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively, wherein the metal frames include: support portions bonded to head portions of the external electrodes; and a mounting portion extending in a second direction perpendicular to the first direction from lower ends of the support portions, and one or more cutting portions are formed in portions of lower sides of the support portions and the mounting portion.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors consecutively disposed in a horizontal direction, first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes, respectively. The first and second metal frames respectively include first and second horizontal bonding portions bonded to upper portions of first and second band portions, first and second horizontal mounting portions disposed to oppose the first and second horizontal bonding portions in a vertical direction, and first and second vertical portions connecting the first and second horizontal bonding portions and the first and second horizontal mounting portions and having at least one first and second cutout portions in a horizontal direction, respectively. The first and second horizontal mounting portions are spaced apart from the plurality of multilayer capacitors.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the m first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.

Abstract: A multilayer electronic component includes: a first frame terminal including a first side frame, a first bottom frame and a first top frame; a second frame terminal including a second side frame, a second bottom frame and a second top frame; an electronic component including first and second external electrodes, and disposed between the first and second side frames; a first conductive adhesive disposed between the first external electrode and an upper portion of the first frame terminal; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second frame terminal, wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively.

Abstract: A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

Abstract: The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of various metals included in the substrate, resulting in good adhesion between the ceramic substrate and the capacitor.

Abstract: The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of various metals included in the substrate, resulting in good adhesion between the ceramic substrate and the capacitor.

Abstract: A board for a probe card includes a ceramic board including a first insulating layer, and second insulating layers disposed on one surface of the first insulating layer and including cavities for receiving electronic components, conductive patterns disposed on the first and second insulating layers, conductive vias electrically connecting the conductive patterns, and a capacitor disposed in the cavities. The cavities have a depth greater than a thickness of the capacitor to secure a space in a lower portion of the cavity after receiving the capacitor.

Abstract: Disclosed is a method of manufacturing a nonshrinking multilayer ceramic substrate. The method includes forming at least one conductive via and an electrode pattern in at least one of a plurality of ceramic green sheets, laminating the ceramic green sheets to form a ceramic laminate, selectively forming a shrinkage inhibiting thin film of sinter-resistant powder on a region including the conductive via and a periphery thereof in at least one of two surfaces of the ceramic laminate using aerosol deposition, disposing a shrinkage inhibiting green sheet for suppressing the shrinkage of the ceramic laminate on at least one of the two surfaces of the ceramic laminate including the shrinkage inhibiting thin film to form a non-sintered multilayer ceramic substrate, and sintering the non-sintered multilayer ceramic substrate.

Abstract: There is provided a Low Temperature Co-fired Ceramic (LTCC) composition, an LTCC substrate comprising the same, and a method of manufacturing the same. The LTCC composition includes 20 to 70 parts by weight of ceramic powder; and 30 to 80 parts by weight of glass component for low-temperature sintering, wherein the ceramic powder has plate-shaped ceramic powder particles and globular ceramic powder particles, and the ceramic powder has a content ratio of the globular ceramic powder particles with respect to the plate-shaped ceramic powder particles in a range of 0 to 1.

Abstract: Provided are a method of manufacturing a multi-layer ceramic substrate. The method includes preparing a non-sintered ceramic laminated structure formed of a plurality of ceramic green sheets; preparing one or more constraining green sheets comprising a first constraining layer formed of a first inorganic powder having a first particle diameter and a second constraining layer formed of a second inorganic powder having a second particle diameter larger than the first particle diameter; disposing the constraining green sheets on the top and the bottom of the ceramic laminated structure; and firing the ceramic laminated structure at a predetermined firing temperature.

Abstract: Provided is a laminated ceramic package. The laminated ceramic package includes a laminated ceramic substrate having a conductive pattern therein, a first ceramic layer on the laminated ceramic substrate, and a second ceramic layer on the first ceramic layer. The first ceramic layer has a firing area shrinkage rate of about 1% or less. The second ceramic layer has a cavity receiving electronic components and a different firing shrinkage rate from the first ceramic layer.

Abstract: Provided are a constraining green sheet and a method of manufacturing a multi-layer ceramic substrate. The constraining green sheet includes a first constraining layer and a second constraining layer. The first constraining layer has a side to be disposed on a multi-layer ceramic laminated structure and is formed of a first inorganic powder having a first particle diameter. The second constraining layer is disposed on top of the first constraining layer and is formed of a second inorganic powder having a second particle diameter larger than the first particle diameter. The second constraining layer is equal to or lower than the first constraining layer in terms of powder packing density. A shrinkage suppression rate can be increased and a de-binder passage can be secured in a firing process of the ceramic laminated structure by using the constraining green sheet formed of inorganic powders having different density and particle diameter.