Abstract: Semiconductor device includes a pad for outputting a cyclic redundancy check (CRC) data for error detection and a signal outputting unit for outputting the CRC data or a data strobe signal, which is output together with data of being output in response to a read command, through the pad according to operation modes. Method for operating a semiconductor device provided a step of outputting a CRC data for error detection through a CRC data pad and a step of outputting a data strobe signal, which is output together with data output in response to a read command, through the CRC data pad according to an operation mode.

Abstract: Provided is a pipe latch circuit of a multi-bit pre-fetch type semiconductor memory device with an advanced structure.

Abstract: Semiconductor memory device for high-speed data input/output includes a first serializer configured to partially serialize input 8-bit parallel data to output first to fourth serial data, a second serializer configured to partially serialize the first to fourth serial data to output fifth and sixth serial data and a third serializer configured to serialize the fifth and sixth serial data to output seventh serial data.

Abstract: A Code Address Memory (CAM) cell read control circuit of a semiconductor memory device includes a CAM cell read circuit configured to read data stored in a CAM cell and to output the read data, an internal delay circuit configured to delay an externally input reset signal and to generate a number of internal command signals, and a signal generation unit configured to generate an internal ready/busy signal in response to the internal command signals. The internal ready/busy signal is generated after the externally input reset signal has reset the CAM cell read circuit.

Abstract: A semiconductor memory device includes a memory cell array including first memory cells for storing data and second memory cells for storing chip identification (ID) information, a data comparison circuit configured to compare input data and the stored data of the first memory cells and to output comparison data, and output circuits configured to output the comparison data received in parallel from the data comparison circuit. The comparison data is outputted through a selected one of the output circuits according to an enable signal generated based on the chip ID information.

Abstract: A semiconductor memory apparatus includes: a first data counting unit configured to count respective programming levels of a plurality of input data and output a plurality of first data counting codes having a code value corresponding to the number of respective programming levels; a data read unit configured to sense data stored in a memory block having the plurality of input data programmed therein, based on a voltage level of a plurality of read bias signals, and output the sensed result as a plurality of output data; a second data counting unit configured to count respective programming levels of the plurality of output data and output a plurality of second data counting codes having a code value corresponding to the number of respective programming levels; a read bias control unit configured to compare the plurality of first data counting codes with the plurality of second data counting codes and output a bias control code having a code value corresponding to the comparison result; and a read bias genera

Abstract: A method of operating a nonvolatile memory device includes supplying a variable voltage of a first voltage level to a selected page buffer and supplying the variable voltage to a first bit line, coupled to a selected memory cell selected for data reading, for a first time period, cutting off the supply of the variable voltage to the first bit line, after the first time period, and precharging the first bit line to a second voltage level through a sense node of the selected page buffer, which is in a precharge state, evaluating a voltage of the first bit line, after the precharging of the first bit line, so that the voltage of the first bit line is shifted according to a program state of the selected memory cell, and sensing the voltage of the evaluated first bit line and latching data in the selected memory cell.

Abstract: A multi-chip package includes a plurality of chips coupled in parallel to an I/O pad and an output driver circuit included in each of the chips and configured to transmit output data to the I/O pad. The driving force of the output driver circuit is controlled on the basis of stack information indicative of the number of chips being activated.

Abstract: A nonvolatile memory apparatus includes a memory device having a configuration information storage block for storing a first configuration data group and a second configuration data group having fewer bits than the first configuration data group and a configuration information processing circuit configured to determine a majority of the first configuration data group outputted from the memory device, during a first period of a power-up operation, and determine a majority of the second configuration data group outputted from the memory device, during a second period after the first period.

Abstract: Provided is a pipe latch circuit of a multi-bit pre-fetch type semiconductor memory device with an advanced structure.

Abstract: A semiconductor memory device includes: a first address buffer configured to be used in a test mode and a normal mode and to receive more addresses in the test mode than in the normal mode; and a second address buffer configured to be used in the normal mode and disabled in the test mode.

Abstract: A semiconductor memory device of the claimed invention, having an active state for performing a read or write operation and an inactive state except for the active state includes a data input/output (I/O) line; a pull-up latch unit for pulling-up the data I/O line when the semiconductor memory device is in the inactive state; a pull-down latch unit for pulling-down the data I/O line when the semiconductor memory device is in the inactive state; and a selection unit for selectively driving one of the pull-up latch unit and the pull-down latch unit.

Abstract: Provided is a pipe latch circuit of a multi-bit pre-fetch type semiconductor memory device with an advanced structure.

Abstract: An apparatus for generating a DBI signal in a semiconductor integrated circuit includes a full adder that includes data input terminals and a carry input terminal, each of which receives data, performs an operation on the received data, thereby outputting a sum and a carry. A half adder includes data input terminals, each of which receives data, performs an operation on the received data, thereby outputting a sum and a carry. A DBI determining unit determines a logic value of each of the data according to the sums and the carries that are transmitted from the full adder and the half adder, thereby outputting a DBI signal.

Abstract: A semiconductor device comprises a delay locked loop (DLL) configured to control a phase delay of an internal clock to output first and second DLL clocks; an output enable unit configured to generate rising/falling data output enable signals in response to the second DLL clocks; and an output driver configured to output data in response to one of the first DLL clocks selected by the rising/falling data output enable signals, where a phase of the second DLL clock leads that of the first DLL clock.

Abstract: There is provided an input/output multiplexer capable of reducing a layout area in designing a device by disposing first and second multiplexers at either side of a specific data input/output (I/O) pad. An apparatus for multiplexing data inputted or outputted to a global input/output (I/O) line includes a first multiplexer for multiplexing the data and supplying a first multiplexed data to the global I/O line and a second multiplexer for multiplexing the first multiplexed data supplied to the global I/O line, wherein the first and second multiplexers are formed at either side of the global I/O line.

Abstract: A semiconductor memory device includes a DLL for detecting a phase difference between an external clock signal and a feedback clock signal to generate a delay control signal corresponding to the phase difference, and delaying the external clock signal by a delay amount corresponding to the delay control signal to generate a DLL clock signal; a clock counter reset signal generator for synchronizing an output enable reset signal with the external clock signal, delaying the synchronized signal by a delay amount corresponding to the delay control signal, and latching the delayed signal in response to the DLL clock signal to output a clock counter reset signal; and an output enable signal generator, reset in response to the clock counter reset signal, for counting the external clock signal and the DLL clock signal to generate an output enable signal corresponding to a read command and a CAS latency.

Abstract: A semiconductor memory device includes: a first address buffer configured to be used in a test mode and a normal mode and to receive more addresses in the test mode than in the normal mode; and a second address buffer configured to be used in the normal mode and disabled in the test mode.

Abstract: A semiconductor memory device includes a delay locked loop to generate a delay control signal corresponding to a detected phase difference between reference and feedback clock signals, a delay locked loop (DLL) clock signal, and the feedback clock signal. The memory device further includes a delay time measurement device to measure a first degree of delay between the reference and feedback clock signals and output a delay measurement value, and an output enable signal generation device to delay read command information synchronized with an external clock signal by a second degree of delay between the reference and DLL clock signals. The output enable signal generation device generates the read command information as final output enable signal by synchronizing the read command information with the DLL clock signal according to the delay measurement value and column address strobe (CAS) latency information.

Abstract: A semiconductor memory device includes: a first address buffer configured to be used in a test mode and a normal mode and to receive more addresses in the test mode than in the normal mode; and a second address buffer configured to be used in the normal mode and disabled in the test mode.